• Transactions of Materials Processing
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• v.19 no.2
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• pp.73-78
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• 2010

Recently, many researches on the development of super-hydrophobic surface have been concentrated on the fabrication of nano-patterned products. Nano-patterned mold is a key to replicate nano-patterned products by mass production process such as injection molding and UV molding. The present paper proposes the new fabricating method of nano-patterned mold at low cost. The nano-patterned mold was fabricated by electroforming the anodic aluminum oxide membrane filled with UV curable resin in nano-hole by capillary phenomenon. As a result, the final mold with nano-patterns which have the holes with the diameter of 100~200 nm was fabricated. Furthermore, the UV-molded products with clear nano- patterns which have the pillars with the diameter of 100~200nm were achieved.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.12
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• pp.2361-2365
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• 2007

Temperature-dependent current-voltage characteristics of Organic Light-Emitting Diodes(OLEDs) were studied. The OLEDs were based on the molecular compounds, N,N'-diphenyl-N,N'-bis(3- methylrhenyi)-1,1'-diphenyl-4,4'-diamine (TPD) as a hole transport and tris(8-hydroxyquinoline) aluminum(Alq3) as an electron transport and emissive material. The current-voltage characteristics were measured in the temperature range of 10[K] and 300[K]. A conduction mechanism in OLEDs was interpreted in terms of tunneling and trap-filled limited current.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

• FLOWER RESEARCH JOURNAL
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• v.19 no.4
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• pp.192-196
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• 2011

This study was conducted to develop the suitable plant mat for garden mum. The results about growth 2 months after cutting of garden mum (Dendranthema grandiflorum 'White Miri') under 6 different plant-mat treatments using coir tape were as follows. The majorities of cuttings were withered under treatments of non-soiled 15 mm thick mat (C treatment). On the other hand, the same thick mat having a hole filled with soil 3 mm in diameter (D treatment) and the 30 mm thick mat having a hole filled with soil (F treatment) showed the best growth results. The survival rates of treatments D and F showed the higher rates of 100 and 90%, respectively than those of respective 56.3 and 20% of two layers without medium (A treatments) and C treatment having respective 10 and 15 mm thick non-soiled mats. The plant height showing the similar tendency with the result of the survival rate was shown with the lower value of 7.97 and 7.15 cm, respectively under treatments A and C, compared with the higher value of 9.74 and 9.80 cm respectively under treatments D and F. For flower gardening, it is better to adopt treatment D based on the our investigational results that treatment D required less soil than treatment F and had no trouble with forming adventitious roots for manufacturing mats and effective transferring.

• The Journal of the Korea Contents Association
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• v.15 no.2
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• pp.21-30
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• 2015

Image coding based on mixed raster content model generates don't care regions (DCR) in foreground and background layers, and its overall coding performance is greatly affected by region filling methods for DCRs. Most conventional methods for DCR filling fail in utilizing the local signal properties in hole regions and thus the high frequency components in non-DCR regions are reflected into DCR after signal filling. In addition, further high frequency components are induced to the filled signal because of signal discontinuities in the boundary of DCR. To solve this problem, a new DCR filling algorithm using the priority-based adaptive region growing is proposed in this paper. The proposed method uses the watershed algorithm and the flooding priority of each pixel for region filling is determined from the degree of smoothness in the neighborhood area. By growing the filled region into DCR based on the computed priority, the expansion of high-textured area can be minimized which can improve the overall coding performance. Experimental results show that the proposed method outperforms conventional algorithms.

• The KIPS Transactions:PartB
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• v.14B no.5
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• pp.351-360
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• 2007

Video Completion refers to a computer vision technique which restores damaged images by filling missing pixels with suitable color in a video sequence. We propose a new video completion technique to fill in image holes which are caused by removing an unnecessary object in a video sequence, where two objects cross each other in the presence of camera motion. We remove the closer object from a camera which results in image holes. Then these holes are filled by color information of some others frames. First of all, spatio-temporal volumes of occluding and occluded objects are created according to the centroid of the objects. Secondly, a temporal search technique by voxel matching separates and removes the occluding object. Finally. these holes are filled by using spatial search technique. Seams on the boundary of completed pixels we removed by a simple blending technique. Experimental results using real video sequences show that the proposed technique produces new completed videos.

• Journal of Korean Society of Steel Construction
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• v.16 no.1 s.68
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• pp.113-121
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• 2004

A test program was conducted on full-scale steel moment connections constructed using a T-stiffener. In the T-stiffener connection, the beam-to-column connection was reinforced with the horizontal and vertical element of the T-stiffener to resist moment under severe cyclic loads. A total of five specimens were tested in this study together with a concrete-filled tubular(CFT) column(${\sqsubset}-500{\times}500{\times}12$) and a steel beam($H-506{\times}201{\times}11{\times}19$). For the specimens, the T-stiffener was combined with RBS (also known as "Dog-bone") detail or Horizontal Element Hole(HEH) detail constructed to enhance deformation capacity. The test program showed excellent seismic performance for specimens constructed with an RBS or an HEH. except the specimens had brittle failure of VE. The test results also showed that the connections all developed maximum moments at the face of the column. Such moments were at least 15% and as much as 36% larger than the plastic moment capacity of the beam. based on the actual yield stress of the beam steel.

• Steel and Composite Structures
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• v.35 no.6
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• pp.789-798
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• 2020

The effect of Chitosan (CS), Carbon Nanotube (CNT) and hybrid (CS-CNT) fillers on the natural frequency of drilled composite plate is investigated by experimentally in this study. The numerical validation is also made with a program based on Finite Element Method (SolidWorks). Nine types filled and one neat composite plates are used in the study. The fillers ratios are 1% CS, 2% CS, 3% CS, 0.1% CNT, 0.2% CNT, 0.3% CNT, 1% CS+0.3% CNT, 2% CS+0.3% CNT, 3% CS+0.3% CNT. The specimens cut to certain sizes by water jet from the plates 400 mm × 400 mm in dimensions. Some of them are drilled in certain dimensions with drill. The natural frequency of each specimen is measured by the vibration test set up to determine the vibration characteristic. The vibration test set up includes an accelerometer, a current source power unit, a data acquisition card and a computer. A code is written in Matlab^® program for the signal processing. The study are investigated and discussed in four main points to understand the effect of the fillers on the natural frequency of the composite plate. These are the effect of fillers contents and amounts, orientation angles of fibers, holes numbers and holes sizes. As results, the natural frequency of the plate with 1% CS and 0.1% CNT hybrid filler is lower than those of the plates with other fillers ratios for 45° orientation angle. Besides, in the composite plate with 0° orientation angle, the natural frequency increases with increasing the filler ratio. Moreover, the natural frequency increases until a certain hole number and then it decreases. Furthermore, the natural frequency is not affected until a certain hole diameter but then it decreases.

• The Journal of the Korea Contents Association
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• v.14 no.12
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• pp.555-564
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• 2014

The boundary noise in image syntheses using DIBR consists of noisy pixels that are separated from foreground objects into background region. It is generated mainly by edge misalignment between the reference image and depth map or blurred edge in the reference image. Since hole areas are generally filled with neighboring pixels, boundary noise adjacent to the hole is the main cause of quality degradation in synthesized images. To solve this problem, a new boundary noise removal algorithm using a preprocessing of the depth map is proposed in this paper. The most common way to eliminate boundary noise caused by boundary misalignment is to modify depth map so that the boundary of the depth map can be matched to that of the reference image. Most conventional methods, however, show poor performances of boundary detection especially in blurred edge, because they are based on a simple boundary search algorithm which exploits signal gradient. In the proposed method, a two-step hierarchical approach for boundary detection is adopted which enables effective boundary detection between the transition and background regions. Experimental results show that the proposed method outperforms conventional ones subjectively and objectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.