• Title/Summary/Keyword: fault growth

검색결과 141건 처리시간 0.025초

회전기기 볼베어링의 외륜 결함 검출 기법 연구 (Study on Detection Technique for Outer-race Fault of the Ball Bearing in Rotary Machinery)

  • 정래혁;이병곤;이도환
    • 한국안전학회지
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    • 제25권3호
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    • pp.1-6
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    • 2010
  • Ball bearings are one of main components that support the rotational shaft in high speed rotary machinery. So, it is very important to detect the incipient faults and fault growth of bearing since the damage and failure of bearing can cause a critical failures or accidents of machinery system. In the past, many researchers mainly performed to detect the bearing fault using traditional method such as wavelet, statistics, envelope etc in vibration signals. But study on the detection technique for bearing fault growth has a little been performed. In this paper, we verified the possibility for monitoring of fault growth and detection of fault size in bearing outer-race by using the envelope powerspectrum and probabilistic density function from measured vibration signals.

Frameworks for NHPP Software Reliability Growth Models

  • Park, J.Y.;Park, J.H.;Fujiwara, T.
    • International Journal of Reliability and Applications
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    • 제7권2호
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    • pp.155-166
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    • 2006
  • Many software reliability growth models (SRGMs) based on nonhomogeneous Poisson process (NHPP) have been developed and applied in practice. NHPP SRGMs are characterized by their mean value functions. Mean value functions are usually derived from differential equations representing the fault detection/removal process during testing. In this paper such differential equations are regarded as frameworks for generating mean value functions. Currently available frameworks are theoretically discussed with respect to capability of representing the fault detection/removal process. Then two general frameworks are proposed.

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불완전 디버깅을 고려한 개발 소프트웨어의 최적 인도 시기 결정 방법에 관한 연구 (A Study on the Optimum Release Time Determination of Developing Software Considering Imperfect Debugging)

  • 최규식
    • 대한전기학회논문지:시스템및제어부문D
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    • 제54권6호
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    • pp.396-402
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    • 2005
  • The software reliability growth model(SRGM) has been developed in order to evaluate such measures as remaining fault number, fault rate, and reliability for the developing stage software. Most of the study literatures assumed that this detecting efficiency was perfect. However the actual fault detecting is generally imperfect, and widely known to many persons. It is not easy to develop and remove the fault existing in the software because the fault finding is difficult, and the exact solving method also not easy, and new fault may be introduced depending on the tester's capability. There, the fault removing efficiency influences the software reliability growth or developing cost of software. It is a very useful measure throughout the developing stage, much helpful for the developer to evaluate the debugging efficiency, and evaluate additional workload. Hence, the study for the imperfect debugging is important in point of software reliability and cost. This paper proposes that the fault debugging is imperfect and new fault may be introduced for the developing software during the developing stage.

Si(111)표면 위에서 Si의 동종층상성장에 관한 연구 (The Study of Si homoepitaxial growth on Si(111) Surface)

  • 곽호원;문병연
    • 한국산업융합학회 논문집
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    • 제7권4호
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    • pp.349-354
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    • 2004
  • The growth mode of the Si layers which were grown on Si(111) by using Ag as surfactant were investigated by intensity oscillations of the RHEED specular spot at the different temperatures. we found that the introduction of Ag as the surfactant alters the growth mode from a three-dimensional clustering mechanism to a two-dimensional layer-by-layer growth. In the growth of Si layers on Si(111) with a surfactant Ag, At $450^{\circ}C$, RHEED intensity oscillation was very stable and periodic from early stage of deposition to 32 ML. RHEED patterns during homoepitaxial growth at $450^{\circ}C$ was changed from $7{\times}7$ structure into ${\sqrt{3}}{\times}{\sqrt{3}}$ structures. Since the ${\sqrt{3}}{\times}{\sqrt{3}}$ structure include no stacking fault, the stacking fault layer seems to be reconstructed into normal stacking one at transition from the $7{\times}7$ structure to a ${\sqrt{3}}{\times}{\sqrt{3}}$ one. We also found that the number of the intensity oscillation of the specular spot for Si growth with a surfactant Ag was more than for Si growth without a surfactant. This result may be explained that the activation energy decrease for the surface diffusion of Si atoms due to segregation of the surfactant toward the growing surface.

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결함 중요도 단계를 고려한 소프트웨어 신뢰도 성장 모델에 관한 연구 (A Study on Software Reliability Growth Modeling with Fault Significance Levels)

  • 신경애
    • 한국컴퓨터산업학회논문지
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    • 제3권7호
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    • pp.837-844
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    • 2002
  • 소프트웨어 개발 과정에서 시스템 내에 잔존하는 결함을 발견하거나 수정하기 위해 테스트를 실시한다. 테스트 단계에서 결함을 발견하고 소프트웨어 신뢰성을 평가할 수 있다. 수리적으로 신뢰성을 평가할 수 있는 모델이 소프트웨어 신뢰도 성장 모델이다. 이 모델의 대부분은 결함의 형태가 하나이고 결함율은 일정하다라는 가정에서 진행되고 있다. 본 연구에서는 테스트 단계에서 발견되는 결함이 일정하지 않다라는 관점에서 새로운 모델을 제안하고 결함 데이터를 적용해보았다. 또한 기존의 모델과 비교 및 분석하여 타당성을 증명하였다.

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Generalization of the Testing-Domain Dependent NHPP SRGM and Its Application

  • Park, J.Y.;Hwang, Y.S.;Fujiwara, T.
    • International Journal of Reliability and Applications
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    • 제8권1호
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    • pp.53-66
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    • 2007
  • This paper proposes a new non-homogeneous Poisson process software reliability growth model based on the coverage information. The new model incorporates the coverage information in the fault detection process by assuming that only the faults in the covered constructs are detectable. Since the coverage growth behavior depends on the testing strategy, the fault detection process is first modeled for the general testing strategy and then realized for the uniform testing. Finally the model for the uniform testing is empirically evaluated by applying it to real data sets.

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A Stochastic Differential Equation Model for Software Reliability Assessment and Its Goodness-of-Fit

  • Shigeru Yamada;Akio Nishigaki;Kim, Mitsuhiro ura
    • International Journal of Reliability and Applications
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    • 제4권1호
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    • pp.1-12
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    • 2003
  • Many software reliability growth models (SRGM's) based on a nonhomogeneous Poisson process (NHPP) have been proposed by many researchers. Most of the SRGM's which have been proposed up to the present treat the event of software fault-detection in the testing and operational phases as a counting process. However, if the size of the software system is large, the number of software faults detected during the testing phase becomes large, and the change of the number of faults which are detected and removed through debugging activities becomes sufficiently small compared with the initial fault content at the beginning of the testing phase. Therefore, in such a situation, we can model the software fault-detection process as a stochastic process with a continuous state space. In this paper, we propose a new software reliability growth model describing the fault-detection process by applying a mathematical technique of stochastic differential equations of an Ito type. We also compare our model with the existing SRGM's in terms of goodness-of-fit for actual data sets.

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저항형 고온초전도 전류제한기의 사고각에 따른 전류제한 특성 분석 (The Analysis of Current Limiting Characteristics Acceding to Fault Angles in the Resistive Type High-Tc Superconducting Fault Current Limiter)

  • 박충렬;임성훈;박형민;이종화;고석철;최효상;한병성;현옥배
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.523-526
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    • 2004
  • According to the continuous demand for power and the growth of electric power utilities, the electric power transmission capacity was increased. The increase of the electric power transmission capacity results in an increase of the fault current level a fault happened. So the superconducting fault current limiter(SFCL) has been reached as the countermeasure for the reduction of the fault current. In this paper, we investigate the fault currents characteristics of resistive type SFCL according to fault angles when AC power source applied. As the fault angles increase, the first peak value of fault current decreased lower. On the other hand, the power burden of SFCL increased.

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EMTCD를 이용한 154kV 송전계통에서의 초전도 한류기 적용 해석 (Application Analysis of a Resistive type SFCL for Transmission Systems)

  • 허태전;배형택;박민원;유인근
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 하계학술대회 논문집 A
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    • pp.409-411
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    • 2004
  • The need for Fault Current Limiters (FCL) is associated with the continuous growth and interconnection of modem power systems and increase in dispersed generation facilities, which result in progressive increase in the short circuit capacity far beyond their original design capacity. Fault Current Limiters (FCL) clips the fault currents and reduces the electromechanical stresses on the network and the need to handle excessive fault currents. In addition, the reduction of the fault duration Provided by the limiter should increase the power transmission capability and improve the dynamic stability. This paper proposes the model of resistive type superconducting fault current limiter using EMTDC(Electromagnetic transients for DC analysis program). In order to verify the effectiveness of the SFCL, in this paper, the analysis of fault current in a transmission system through the EMTDC based simulation by using the modeled component of a resistive type SFCL is peformed and the detailed results are given.

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IEC 60909에 의한 삼상 고장계산 (Three-phase Fault Calculation by IEC 60909)

  • 손석금
    • 전기학회논문지P
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    • 제63권1호
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    • pp.12-18
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    • 2014
  • This paper analyzes how to calculate the three phase short circuit current calculation procedures used in the IEC 60909 short circuit. It presented the new procedure of the fault current for the interrupting capacity of the circuit breaker. This procedure is applied to the future power system and calculates the fault current. Power demands are increased because of the growth of the economy for this reason, the fault current of the power system is largely increased and the fault current procedure for the proper interrupting capacity calculation of the existing or the new circuit breaker is essential. How to calculate the three phase short circuit current for ac electrical system and select the high voltage and low voltage circuit breaker based on IEC 60909 standards.