• Title/Summary/Keyword: failure test

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Analysis of Horizontal Behavior of a Single Column/Shaft by Horizontal Two-way Pile Load Test (반복수평재하시험을 통한 단일형현장타설말뚝의 거동분석)

  • Jeong, Sang-Seom;Song, Sung-Wook;Kim, Byung-Chul
    • Proceedings of the Korean Geotechical Society Conference
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    • 2008.03a
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    • pp.1132-1143
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    • 2008
  • A single Column/Shaft which extended the pile to the column of the bridge with same diameter has better safety and economical profit, but it usually has larger lateral displacement due to lateral loads such as wind, earthquake, wave, etc. A series of horizontal pile load testing were performed to study the lateral behavior of single column/shaft with varying different free lengths and embedded pile lengths. Eight instrumented test piles were cast-in-placed by bonding strain gauges at certain locations on both faces of the pile to measure bending moment, from two-way loadings. Linear variable differential transformers(LVDTs) were installed to measure the lateral pile displacement. Based on this, it is found that the test single column/shaft with different free lengths shows different failure modes. If the test pile has a longer free length, the failure occurs at the near the ground surface, but the shorter one's failure occurs at the below the ground surface.

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Cyclic shear test on a dowel beam-to-column connection of precast buildings

  • Magliulo, Gennaro;Ercolino, Marianna;Cimmino, Maddalena;Capozzi, Vittorio;Manfredi, Gaetano
    • Earthquakes and Structures
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    • v.9 no.3
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    • pp.541-562
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    • 2015
  • This paper aims at developing the knowledge on the seismic behavior of dowel beam-to-column connections, typically employed in precast buildings in Europe. Despite the large diffusion of the industrial buildings, a high seismic vulnerability was exhibited by these structures, mostly due to the connection systems deficiencies, during some recent earthquakes (Emilia 2012, Turkey 2011). An experimental campaign was conducted on a typical dowel connection between an external column and a roof beam. In this paper, the performed cyclic shear test is described. According to the experimental results, the seismic response of the system is evaluated in terms of strength, stiffness and failure mechanism. Moreover, the complete damage pattern of the test is described by means of the instrumentations records. The connection failure occurred due to the concrete cover failure in the column (splitting failure). Such a mechanism corresponds to a negligible energy dissipation capacity of the connection, compared to the overall seismic response of the structure. The experimental results are also compared with the results of a similar monotonic shear test, as well as with some literature relationships for predicting the strength of dowel connections under horizontal (seismic) loads.

Thermal Reliability Analysis of BLDC Motor in a High Speed Axial Fan by the Accelerated Life Test (가속수명시험에 의한 고속팬용 밀폐구조형 BLDC 모터의 열신뢰성 분석)

  • Lee Tae-Gu;Moon Jong-Sun;Yoo Hoseon;Lee Jae-Heon
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.17 no.12
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    • pp.1169-1176
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    • 2005
  • In this paper, thermal reliability of a closed type BLDC (Brushless DC) motor for high speed axial fan was analyzed by the accelerated life test. The closed type BLDC (Model No. MB1-8855-J01) motor was controlled by PCB module, which was composed of various electrical components. The failure of the closed type BLDC motor happened in PCB module due to high temperature. Failure mechanism of the closed type BLDC motor appears to be electrolyte dry out of capacitor. The accelerate life test was performed in temperature stress of $85^{\circ}C\;and\;105^{\circ}C$, respectively The failure data from the accelerated life test were analyzed and the life in each stress level was estimated with 960h and 261 h. At last, both life expression according to operating temperature of PCB module and life of the closed type BLBC motor in normal condition $(50^{\circ}C)$ were suggested.

Difference of Potential Range Formed at the Anode Between Water Drop Test and Temperature Humidity Bias Test to Evaluate Electrochemical Migration of Solders for Printed Circuit Board

  • Young Ran Yoo;Young Sik Kim
    • Corrosion Science and Technology
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    • v.22 no.3
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    • pp.153-163
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    • 2023
  • Two types of accelerated tests, Water Drop Test (WDT) and Temperature-Humidity-Bias Test (THBT), can be used to evaluate the susceptibility to electrochemical migration (ECM). In the WDT, liquid water is directly applied to a specimen, typically a patterned conductor like a printed circuit board. Time to failure in the WDT typically ranges from several seconds to several minutes. On the other hand, the THBT is conducted under elevated temperature and humidity conditions, allowing for assessment of design and life cycle factors on ECM. THBT is widely recognized as a more suitable method for reliability testing than WDT. In both test methods, localized corrosion can be observed on the anode. Composition of dendrites formed during the WDT is similar to that formed during THBT. However, there is a lack of correlation between the time to failure obtained from WDT and that obtained from THBT. In this study, we investigated the relationship between electrochemical parameters and time to failure obtained from both WDT and THBT. Differences in time to failure can be attributed to actual anode potential obtained in the two tests.

Study on the Failure Mechanism of a Chip Resistor Solder Joint During Thermal Cycling for Prognostics and Health Monitoring (고장예지를 위한 온도사이클시험에서 칩저항 실장솔더의 고장메커니즘 연구)

  • Han, Chang-Woon;Park, Noh-Chang;Hong, Won-Sik
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.7
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    • pp.799-804
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    • 2011
  • A thermal cycling test was conducted on a chip resistor solder joint with real-time failure monitoring. In order to study the failure mechanism of the chip resistor solder joint during the test, the resistance between both ends of the resistor was monitored until the occurrence of failure. It was observed that the monitored resistance first fluctuated linearly according to the temperature change. The initial variation in the resistance occurred at the time during the cycle when there was a decrease in temperature. A more significant change in the resistance followed after a certain number of cycles, during the time when there was an increase in the temperature. In order to explain the failure patterns of the solder joint, a mechanism for the solder failure was suggested, and its validity was proved through FE simulations. Based on the explained failure mechanism, it was shown that prognostics for the solder failure can be implemented by monitoring the resistance change in a thermal cycle condition.

Development of Reliability Analysis Procedures for Repairable Systems with Interval Failure Time Data and a Related Case Study (구간 고장 데이터가 주어진 수리가능 시스템의 신뢰도 분석절차 개발 및 사례연구)

  • Cho, Cha-Hyun;Yum, Bong-Jin
    • Journal of the Korea Institute of Military Science and Technology
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    • v.14 no.5
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    • pp.859-870
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    • 2011
  • The purpose of this paper is to develop reliability analysis procedures for repairable systems with interval failure time data and apply the procedures for assessing the storage reliability of a subsystem of a certain type of guided missile. In the procedures, the interval failure time data are converted to pseudo failure times using the uniform random generation method, mid-point method or equispaced intervals method. Then, such analytic trend tests as Laplace, Lewis-Robinson, Pair-wise Comparison Nonparametric tests are used to determine whether the failure process follows a renewal or non-renewal process. Monte Carlo simulation experiments are conducted to compare the three conversion methods in terms of the statistical performance for each trend test when the underlying process is homogeneous Poisson, renewal, or non-homogeneous Poisson. The simulation results show that the uniform random generation method is best among the three. These results are applied to actual field data collected for a subsystem of a certain type of guided missile to identify its failure process and to estimate its mean time to failure and annual mean repair cost.

Heading Failure Modes during Underground Excavation (지하공간 건설에 따른 굴착전면의 파괴모드)

  • Kwon, Oh-Yeob;Cho, Jae-Wan;Shin, Jong-Ho;Choi, Ypng-Ki;Shin, Yong-Suk
    • Proceedings of the Korean Geotechical Society Conference
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    • 2005.03a
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    • pp.409-416
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    • 2005
  • Design analysis for underground spaces requires evaluating stability related to tunnel collapses. A failure mode is one of the critical factors in the conventional methods of stability analysis. Therefore identification of failure modes is essential in securing safe construction in the phase of design analysis, instrumentation planning and implementation of reinforcing measures. In this study failure modes at the tunnel heading in granular soils are investigated using physical model tests and numerical simulation for various tunnel depths and ground surface inclinations. Test results indicated that the effect of depth and inclination of ground surface on a failure mode are significant. It is identified that, with an incase in depth, failure modes become localized in a region close to the tunnel. It is also known that an increase in the inclination of ground surface results in inclined and wide failure modes.

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The Study for Software Future Forecasting Failure Time Using ARIMA AR(1) (ARIMA AR(1) 모형을 이용한 소프트웨어 미래 고장 시간 예측에 관한 연구)

  • Kim, Hee-Cheul;Shin, Hyun-Cheul
    • Convergence Security Journal
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    • v.8 no.2
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    • pp.35-40
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    • 2008
  • Software failure time presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing. For data analysis of software reliability model, data scale tools of trend analysis are developed. The methods of trend analysis are arithmetic mean test and Laplace trend test. Trend analysis only offer information of outline content. In this paper, we discuss forecasting failure time case of failure time censoring. The used software failure time data for forecasting failure time is random number of Weibull distribution(shaper parameter 1, scale parameter 0.5), Using this data, we are proposed to ARIMA(AR(1)) and simulation method for forecasting failure time. The practical ARIMA method is presented.

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Anapproach of Combining HALT and Failureanalysis for STNLCD Reliability Assessment (HALT와 고장분석을 이용한 STN LCD 모듈의 신뢰성 평가에 관한 연구)

  • Kang Bo-Chul;Hong Won-Sik;Cho Jai-Rip
    • Proceedings of the Korean Society for Quality Management Conference
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    • 2004.04a
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    • pp.85-89
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    • 2004
  • This brief paper is an application of HALT(High Accelerated Life Test) and FA(Failure analysis) to improvement of STN LCD module. Before HALT the result of environmental test is good. So, we choose the technique of HALT to evaluate reliability. After HALT and Fa, we suggest some methods to improve reliability

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