• Geomechanics and Engineering
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• v.16 no.1
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• pp.35-47
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• 2018

This paper investigates the mechanisms of tunnel spalling and massive tunnel failures using fracture mechanics principles. The study starts with examining the fracture propagation due to tensile and shear failure mechanisms. It was found that, fundamentally, in rock masses with high compressive stresses, tensile fracture propagation is often a stable process which leads to a gradual failure. Shear fracture propagation tends to be an unstable process. Several real case observations of spalling failures and massive shear failures in boreholes, tunnels and underground roadways are shown in the paper. A number of numerical models were used to investigate the fracture mechanisms and extents in the roof/wall of a deep tunnel and in an underground coal mine roadway. The modelling was done using a unique fracture mechanics code FRACOD which simulates explicitly the fracture initiation and propagation process. The study has demonstrated that both tensile and shear fracturing may occur in the vicinity of an underground opening. Shallow spalling in the tunnel wall is believed to be caused by tensile fracturing from extensional strain although no tensile stress exists there. Massive large scale failure however is most likely to be caused by shear fracturing under high compressive stresses. The observation that tunnel spalling often starts when the hoop stress reaches $0.4^*UCS$ has been explained in this paper by using the extension strain criterion. At this uniaxial compressive stress level, the lateral extensional strain is equivalent to the critical strain under uniaxial tension. Scale effect on UCS commonly believed by many is unlikely the dominant factor in this phenomenon.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.3
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• pp.153-166
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• 2003

Failure analysis is fundamental to the design and development methodology of electrostatic discharge (ESD) devices and ESD robust circuits. The role of failure analysis (FA) in the models, methodology, band mechanisms evaluation for improving ESD robustness of semiconductor products in CMOS, silicon-on-insulator (SOI) and silicon germanium (SiGe) technologies will be reviewed.

• Journal of Applied Reliability
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• v.16 no.4
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• pp.347-355
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• 2016

Purpose: With the advance of miniaturization of electronic products, stacked packages of high density semiconductors are commonly used. Potential failure modes and mechanisms of stacked packages are identified. Methods: Failure modes and mechanisms of thin chip stacked packages are determined through the categorization and failure analysis: delamination, non-wet, crack, ESD, EMI and the process related damages. Results: Those failure modes are not easy to find and require excessive amount time and effort for analysis and subsequent improvement. Conclusion: In this study, a method of estimating the failure rate based on the strength measurement is suggested.

• Journal of Applied Reliability
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• v.16 no.4
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• pp.331-337
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• 2016

Purpose: The purpose of this study is the analysis of the failure mechanisms effect of circuit design characteristics of the ballast for LED Lamp Methods: Recently, electronic circuit of ballasts for LED lamp are being occurred on various failure mechanisms (whiskers, ion migration, heat dissipation problem, switching element damage) because electronic ballast circuit design characteristics are becoming more and more diverse. Results: we analysis failure mechanisms that occurs in accordance with the circuit design characteristics The ballast for LED lamp were divided into three different types (Type A, Type B, Type C) considering circuit design characteristics (thermal design, PCB patten spacing, element material) and it was experimented in the acceleration test conditions ($85^{\circ}C$, 85% R.H). Conclusion: We confirmed that failure mechanism of the ballast for LED Lamp had occurred differently in accordance with the circuit design characteristics.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.195-202
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• 2003

In this study, failure mechanisms of Au stud bumps/ACF flip chip joints were investigated underhigh current stressing condition. For the determination of allowable currents, I-V tests were performed on flip chip joints, and applied currents were measured as high as almost 4.2Amps $(4.42\times10^4\;Amp/cm^2)$. Degradation of flip chip joints was observed by in-situ monitoring of Au stud bumps-Al pads contact resistance. All failures, defined at infinite resistance, occurred at upward electron flow (from PCB pads to chip pads) applied bumps (UEB). However, failure did not occur at downward electron flow applied bumps (DEB). Only several $m\Omega$ contact resistance increased because of Au-Al intermetallic compound (IMC) growth. This polarity effect of Au stud bumps was different from that of solder bumps, and the mechanism was investigated by the calculation of chemical and electrical atomic flux. According to SEM and EDS results, major IMC phase was $Au_5Al_2$, and crack propagated along the interface between Au stud bump and IMC resulting in electrical failures at UEB. Therefore. failure mechanisms at Au stud bump/ACF flip chip Joint undo high current density condition are: 1) crack propagation, accompanied with Au-Al IMC growth. reduces contact area resulting in contact resistance increase; and 2) the polarity effect, depending on the direction of electrons. induces and accelerates the interfacial failure at UEBs.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.5
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• pp.152-162
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• 2005

Coolant rubber hoses for automobile radiators can be degraded and thus failed due to the influence of contacting stresses of air and coolant liquid under the thermal and mechanical loadings. In this study, test analysis was carried out for evaluating the degradation and failure mechanisms of coolant hose materials. Two kinds of EPDM rubber materials applicable to the hoses were adopted: commonly-used ethylene-propylene diene monomer(EPDM) rubbers and EPDM rubbers with high resistance against electro-chemical degradation (ECD). An increase of surface hardness and a large reduction of failure strain were shown due to the formation of oxidation layer for the specimens which had been kept in a high temperature air chamber. Coolant ageing effects took place only by an amount of pure thermal degradation. The specimens degraded by ECD test showed a swelling behavior and a considerable increase in weight on account of the penetration of coolant liquid into the skin and interior of the rubber specimens. The ECD induced material softening as well as drastic reduction in strength and failure strain. However EPDM rubbers designed for high resistance against ECD revealed a large improvement in reduction of failure strain and weight. This study finally established a procedure for reliability analysis and evaluation of the degradation and failure mechanisms of EPDM rubbers used in coolant hoses for automobile radiators.

• Earthquakes and Structures
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• v.10 no.2
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• pp.351-366
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• 2016

The structural collapse of masonry structure under dynamic loading displays many possible failure mechanisms often related to interaction between structural components. Roof collapse is one of the major damage mechanisms observed in masonry structures during an earthquake. Better connection between the roof diaphragm and walls may be preventing roof collapse, but it can affect other failure mechanisms. In spite of this fact, less attention has been paid to the influence of the roof diaphragm effect on masonry structures and little research has been implemented in this field. In the present study, the roof diaphragm effect on the unreinforced masonry structure under dynamic loading has been experimentally investigated. Three one-quarter scale one-story adobe masonry house models with different roof conditions have been tested by subjecting them to sinusoid loading on a shaking table simulator. Phenomena such as failure pattern, dynamic performance of masonry structure were examined.

• Proceedings of the Earthquake Engineering Society of Korea Conference
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• 2001.09a
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• pp.295-301
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• 2001

For the seismic analysis of typical roadway bridges provisions are given in most codes for analysis models, which describes however only fundamental modelling methods according to the basic theories of structural dynamics. In practice even conventional non-seismic analysis models, separate super- and substructure models, are applied, which are not adequate because of neglecting connection elements. In this study three typical roadway bridges, a Steel box bridge, a PC beam bridge and a PC box bridge are selected and simple models integrating super- and substructure as well as connection elements are given. The simple models are composed with frame elements with lumped masses representing stiffness and mass characteristics of the selected bridges. To check the properness of the simple models, analysis results with the simple models are compared with those obtained with detailed models in view of bridge failure mechanisms. It is proved that the simple models can be used in the preliminary design phase fur the determination of failure mechanisms of typical roadway bridges.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.28 no.3
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• pp.295-305
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• 1992

The critical strain energy release rate and the failure mechanisms of glass-carbon epoxy resin hybrid composites are investigated in the temperature range of the ambient temperature to 8$0^{\circ}C$. The direction of laminates and the volume fraction are [(+45, -45, 0, 0) sub(2) ] sub(s), 50%, respectively. The major failure mechanisms of these composites are studied using the scanning electron microscope for the fracture surface. Results are summarized as follows: 1) The critical strain energy release rate shows a maximum at ambient temperature and it tends to decrease as temperature goes up. 2) The critical strain energy release rate increases as the content of glass increases, and especially shows dramatic increase for the high glass fiber content specimens. 3) Major failure mechanisms can be classfied such as localized shear yielding, fiber-matrix debonding, matrix micro-cracking, and fiber pull-out and/or delamination.

• Proceedings of the KIEE Conference
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• 2002.07a
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• pp.503-507
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• 2002

This paper describes the symptoms with the failure causes of pole transformers analyzed at KEPCO branch offices' request in 2001, and ultimately aims for devising proper countermeasures against the failures. The failure causes are generally divided into problems in manufacturing, mounting and operating. The pole transformers encounter the failure with unique mechanisms. To verify the mechanisms to failures and help devise proper countermeasures, a flowchart is proposed based on the authors' experience and foreign case studies. The failure causes of pole transformers can be analyzed more exactly by using the flowchart.