• Title/Summary/Keyword: fabrication process

Search Result 4,367, Processing Time 0.044 seconds

Behavior of Global Bending Distortion of Hatch-cover in Container Carrier during Fabrication Process (컨테이너 운반선 해치-커버 제작시 전 굽힘 변형 거동에 관한 연구)

  • Lee, Dong-Ju;Kim, Gyung-Gyu;Shin, Sang-Beom
    • Journal of Welding and Joining
    • /
    • v.28 no.4
    • /
    • pp.41-48
    • /
    • 2010
  • The purpose of this study is to establish the control method of the global bending distortion caused by fabrication process of hatch-cover in a container ship. In order to do it, the transitional behavior of global bending distortion in the deck of hatch-cover during fabrication process was measured by 3-dimensional measuring instrument. From the results, the principal factor controlling the global bending distortion was identified as the bending moment associated with the longitudinal shrinkage force and transverse shrinkage caused by welding and flame heating and the change of the centroid axis of hatch-cover in each fabrication process. Therefore, in this study, with the predictive equations of the longitudinal shrinkage force and transverse shrinkage caused by welding and flame heating and the simplified thermo elastic method, the predictive method for the global bending distortion was established and verified by comparing with the measured result. Based on the results, the amount of reverse bending distortion of main stiffeners was determined to prevent the global bending distortion of hatch-cover.

Current Status of Layer Transfer Process in Thin Silicon Solar Cell : a review

  • U. Gangopadhyay;K. Chakrabarty;S.K. Dhungel;Kim, Kyung-Hae;Yi, Jun-Sin;D. Majumdar;H. Saha
    • Transactions on Electrical and Electronic Materials
    • /
    • v.5 no.2
    • /
    • pp.41-49
    • /
    • 2004
  • Layer transfer process has emerged as a promising tool in the field of thin silicon solar cell technology. This process can use mono-crystalline silicon as a surface for the epitaxial growth of a thin layer of silicon. It requires some sort of surface conditioning of the substrate due to which the surface become suitable for homo-epitaxy and lift off after solar cell fabrication. The successful reuse of substrate has been reported. The use of the conditioned surface without any kind of epitaxial layer growth is also the issue to be addressed. This review paper basically describes the five most cost effective methods on which works are in progress. Several types of possible problems envisaged by different research groups are also incorporated here with necessary discussion. Work in Korea has already started in this area in collaboration IC Design and Fabrication Centre, Jadavpur University, India and that also has been mentioned.

Fabrication of Novel Metal Field Emitter Arrays(FEAs) Using Isotropic Silicon Etching and Oxidation

  • Oh, Chang-Woo;Lee, Chun-Gyoo;Park, Byung-Gook;Lee, Jong-Duk;Lee, Jong-Ho
    • Journal of Electrical Engineering and information Science
    • /
    • v.2 no.6
    • /
    • pp.212-216
    • /
    • 1997
  • A new metal tip fabrication process for low voltage operation is reported in this paper. The key element of the fabrication process is that isotropic silicon etching and oxidation process used in silicon tip fabrication is utilized for gate hole size reduction and gate oxide layer. A metal FEA with 625 tips was fabricated in order to demonstrate the validity of the new process and submicron gate apertures were successfully obtained from originally 1.7$\mu\textrm{m}$ diameter mask. The emission current above noise level was observed at the gate bias of 50V. The required gate voltage to obtain the anode current of 0.1${\mu}\textrm{A}$/tip was 74V and the emission current was stable above 2${\mu}\textrm{A}$/tip without any disruption. The local field conversion factor and the emitting area were calculated as 7.981${\times}$10\ulcornercm\ulcorner and 3.2${\times}$10\ulcorner$\textrm{cm}^2$/tip, respectively.

  • PDF

Fabrication of SiCN Microstructures for Super-High Temperature MEMS and Its Characteristics (초고온 MEMS용 SiCN 미세구조물 제작과 그 특성)

  • Lee, Gyu-Chul;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2006.06a
    • /
    • pp.392-393
    • /
    • 2006
  • This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work. polysilazane liquide as a precursor was deposited on Si wafers by spin coating. microstructured and solidificated by UV lithography. and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules. hardness and tensile strength of the SiC microstructure implemented under optimum process conditions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated multlayer or 3D microstructures as well as its good mechanical properties.

  • PDF

Process Conditions for the Fabrication of Hydrophobic Surfaces with Different Photo-curable Resins (광경화성 레진의 성분 변화에 대한 소수성 표면 제작을 위한 공정 조건)

  • Hong, Sung-Ho;Woo, Heung-Sik
    • Tribology and Lubricants
    • /
    • v.36 no.5
    • /
    • pp.267-273
    • /
    • 2020
  • This study experimentally investigates hydrophobic surfaces fabricated via additive manufacturing. Additive manufacturing, commonly known as 3D printing, is the process of joining materials to fabricate parts from 3D model data, usually in a layer-upon-layer manner. Digital light processing is used to fabricate hydrophobic surfaces in this study. This method uses photo-curable resins and ultraviolet (UV) sources. Moreover, this technique generally has faster shaping speeds and is advantageous for the fabrication of small components because it enables the fabrication of one layer at a time. Two photo-curable resins with different compositions are used to fabricate micro-patterns of hydrophobic surfaces. The resins are composed of a photo-initiator, monomer, and oligomer. Experiments are conducted to determine suitable process conditions for the fabrication of hydrophobic surfaces depending on the type of resin. The most important factors affecting the process conditions are the UV exposure time and slice thickness. The fabrication capability according to the process conditions is evaluated using the side and top views of the micro-patterns observed using a microscope. The micro-patterns are collapsed and intertwined when the exposure time is short because sufficient light (heat) is not applied to cure the photo-curable resin with a given slice thickness. On the other hand, the micro-patterns are attached to each other when the exposure time is prolonged because the over-curing time can cure the periphery of a given shape. When the slice is thicker, the additional curing area is enlarged in each slice owing to the straightness of UV light, and the slice surface becomes rough.

Development of a Novel Fabrication Process for Multi-layered Microstructures using a Micro Milling and Deep X-ray Lithography (마이크로 밀링과 X-선 리소그래피 공정을 이용한 다층 마이크로 구조물 제작 공정 개발)

  • Kim, Jong Hyun;Chang, Suk Sang;Lim, Geunbae
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.31 no.3
    • /
    • pp.269-275
    • /
    • 2014
  • Conventional machining technologies such as a milling process have limitations in accuracy to fabricate microstructures. Deep X-ray lithography using the synchrotron radiation is a promising micromachining process with an excellent accuracy, whereas there are difficulties in the fabrication of multi-layered structures. Therefore, it is mainly used for fabricating simple mono-layered microstructures with a high aspect ratio. In this study, a novel technology for fabricating multi-layered microstructures is proposed by combining two processes. In advance, an X-ray resist material is cut and machined into various shapes and heights by the micro milling process. Subsequent X-ray irradiation process facilitates the fabrication of multi-layered microstructures. The proposed technology can overcome the limitation of the pattern accuracy in conventional milling process and the difficulty of the multi-layered machining in x-ray process. The usefulness of the proposed technology is demonstrated in this study by applying the technique in the realization of various multi-layered microstructures.

Non-lithographic Micro-structure Fabrication Technology and Its Application (Non-lithography 방법에 의한 마이크로 구조물 제작 및 응용)

  • 성인하;김진산;김대은
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2002.05a
    • /
    • pp.956-959
    • /
    • 2002
  • In this work, a new non-lithographic micro-fabrication technique is presented. The motivation of this work is to overcome the demerits of the most commonly used photo-lithographic techniques. The micro-fabrication technique presented in this work is a two-step process which consists of mechanical scribing followed by chemical etching. This method has many advantages over other micro-fabrication techniques since it is simple, cost-effective, rapid, and flexible. Also, the technique can be used to obtain a metal structure which has sub-micrometer width patterns. In this paper, the concept of this method and its application to microsystem technology are described.

  • PDF

A Study of Characteristics of the Wire-cut EDM Process in Aluminum Alloys (알루미늄합금의 와이어 컷 방전기공 특성에 과한 연구)

  • Lyu, Sung-Ki;An, Soon-Geon
    • Journal of the Korean Society of Safety
    • /
    • v.19 no.2
    • /
    • pp.21-25
    • /
    • 2004
  • This study deals with the characteristics of wire-cut EDM(Electrical Discharge Machining)process in aluminum alloys. Besides 2 series and 7 series of aluminum alloys for aerospace applications, porous aluminum is tested, which is used for sound absorbing matherial and interior and exterior material of building. Jinyoung JW-30 wire cutting machine was used in this experiment. Tap wate passed a filter and ionization was used as the discharging solution. An immerision method was applied as a cooling method because it separates chips effectively and machinability is good even with low value of electric current. The speed of fabrication was estimated by measuring the travel distance of the work piece and time spent for the movement. As pulse-on-time increased the fabrication speed decreased. On the other hand, as peak voltage of peak current increased the fabrication speed increased. In general 7075 aluminum alloy resulted in higher fabrication speed.

Development of remote RW technology for fuel multi-pin fabrication (핵연료 멀티핀 제조용 원격 저항용접기술 개발)

  • Kim, Su-Seong;Gu, Dae-Seo;Lee, Jeong-Won;Park, Geun-Il;Jo, Dae-Sik
    • Proceedings of the KWS Conference
    • /
    • 2006.10a
    • /
    • pp.89-91
    • /
    • 2006
  • An analysis of a multi-pin remote welding for a DUPIC fuel fabrication was made to establish the optimum welding processes in a hot cell environment. An initial investigation for hands-on fabrication outside the hot cell was performed, and the constraints of a hot cell welding were considered. Preliminary welding performances to improve the RW process were also examined. The RW process was determined to be the best in a hot cell environment for joining the end plate to the end caps. This paper presents an outline of the developed RW machine for a DUPIC fuel fabrication and compares the characteristics of a Zr-4 end plate welding by using electrical resistance and LB methods. The weld nuggets of RW specimens and torque strengths of resistant and LB welded zones were also investigated.

  • PDF