• Transactions of the Korean Society of Mechanical Engineers A
• /
• 제32권10호
• /
• pp.823-830
• /
• 2008

We present a high-accuracy digital-to-analog (DA) actuator using a load spring, specially designed to compensate the output displacement errors caused by fabrication errors. The compensated linear DA actuator is capable to change the slope of input-output modulation line in order to compensate fabrication errors. We design, fabricate, and characterize three different prototypes: one uncompensated design and two compensated designs respectively for a specific value and for a given range of fabrication error. The compensated linear DA actuators show the output displacement errors of $-0.20{\pm}0.23{\mu}m\;and\;-0.13{\pm}0.18{\mu}m$, respectively, reduced by 64.3% and 76.8% of the output displacement error, $0.56{\pm}0.20{\mu}m$, produced by the conventional uncompensated linear DA actuator. We experimentally verify the fabrication error compensation capability of the present compensated linear DA actuators, thus demonstrating high-accuracy actuation performance immune to fabrication errors.

• IE interfaces
• /
• 제10권1호
• /
• pp.1-13
• /
• 1997

반도체 Wafer Fabrication 공정은 무수한 공정과 복잡한 Lot의 흐름 등으로 다른 제조 형태에 비해 효율적인 관리가 대단히 어려운 부문이다. 본 연구는 반도체 Fab을 대상으로 주어진 생산 소요량과 목표 공기를 효율적으로 달성하기 위한 Shift 단위의 생산 일정계획을 대상으로 하였다. 특히, 전 공정 및 장비를 고려하기보다는 Bottleneck인 Photo 공정의 Stepper를 중심으로, 공정을 Layer단위로 묶어, 한 Shift에서 어떻게 Stepper를 할당하고 생산계획을 할 것인가를 결정하기 위한 2단계 방법론을 제시하고, Stepper 할당 및 계획에 필요한 3가지 알고리즘들을 제시하였다. 이 기법들을 소규모의 예제들에 대해 적용한 결과와 최적해와의 비교를 통하여 그 성능을 평가하였다.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1989년도 한국자동제어학술회의논문집; Seoul, Korea; 27-28 Oct. 1989
• /
• pp.421-426
• /
• 1989

Many of semiconductor manufacturing companies persuit automation of wafer fabrication to improve the yields and quality of their products. Development of real-time control system for wafer fabrication and wafer/cassette automatic transfer-system is the most important part to achieve the purpose. In this paper, SECS protocol proposed by SEMI is briefly reviewed and an implementation method of real-time monitoring and control system is suggested as one of the possible ways for wafer fabrication automation. The system consists of process equipments supporting SECS.

• Proceedings of the IEEK Conference
• /
• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
• /
• pp.727-730
• /
• 2003

Thin tin oxide film with nano-size particle was prepared on silicon substrate by hydrothermal synthetic method and successive sol-gel spin coating method. The fabrication method of tin oxide film with ultrafine nano-size crystalline structure was tried to be applied to fabrication of micro gas sensor array on silicon substrate. The tin oxide film on silicon substrate was well patterned by chemical etching upto 5${\mu}{\textrm}{m}$width and showed very uniform flatness. The tin oxide film preparation method and patterning method were successfully applied to newly proposed 2-dimensional micro sensor fabrication.

• Journal of the Korean Society for Precision Engineering
• /
• 제24권2호
• /
• pp.13-18
• /
• 2007

• Proceedings of the IEEK Conference
• /
• 대한전자공학회 2002년도 하계종합학술대회 논문집(5)
• /
• pp.91-94
• /
• 2002

SFFS(Solid Freeform Fabrication System) is commercializing to rapid prototyping concept in foreign some corporations including the U.S.A, have much technological problems yet and need new mode for agile prototyping. In this paper, we design algorithm that the cutting path of laser beam, on the SFFS(Solid Freeform Fabrication System), is controlled with constant speed. The designed algorithm for constant-speed path control is implemented and experimented in the CAFL$\^$VM/ (Computer Aided Fabrication of Lamination for Various Material) system, the new SFFS which was developed in this paper.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• 제39권1호
• /
• pp.153-161
• /
• 2016

Semiconductor manufacturing has suffered from the complex process behavior of the technology oriented control in the production line. While the technological processes are in charge of the quality and the yield of the product, the operational management is also critical for the productivity of the manufacturing line. The fabrication line in the semiconductor manufacturing is considered as the most complex part because of various kinds of the equipment, re-entrant process routing and various product devices. The efficiency and the productivity of the fabrication line may give a significant impact on the subsequent processes such as the probe line, the assembly line and final test line. In the management of the re-entrant process such as semiconductor fabrication, it is important to keep balanced fabrication line. The Performance measures in the fabrication line are throughput, cycle time, inventory, shortage, etc. In the fabrication, throughput and cycle time are the conflicting performance measures. It is very difficult to achieve two conflicting goal simultaneously in the manufacturing line. The capacity of equipment is important factor in the production planning and scheduling. The production planning consideration of capacity can make the scheduling more realistic. In this paper, an input and scheduling rule are to achieve the balanced operation in semiconductor fabrication line through equipment capacity and workload are proposed and evaluated. New backward projection and scheduling rule consideration of facility capacity are suggested. Scheduling wafers on the appropriate facilities are controlled by available capacity, which are determined by the workload in terms of the meet the production target.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• 제18권11호
• /
• pp.103-108
• /
• 2019

The cooling rate and the uniformity of mold temperature, in the injection molding process, possess great influences on the productivity and quality of replications. The conformal cooling channel, which is of a uniform spacing from the mold cavity by the metal additive manufacturing process, receives much attention recently. The purpose of this study is to develop a mold core with a curved conformal cooling channel for a pottery-shaped thick-wall cosmetic container through the hybrid method of direct metal tooling (DMT) process. In this study, we design a mold core that contains the curved cooling channel for the container. A method that divides the cavity is proposed and the DMT process is carried out to form the curved cooling channel. The test mold core, with the curved conformal cooling channel, has been fabricated by the proposed method to confirm the feasibility of the design concept. We show that no leakage is observed for the additive manufactured test mold core, and its physical properties demonstrate that it can be sufficiently used as the injection mold core.

• Proceedings of the KSME Conference
• /
• 대한기계학회 2001년도 춘계학술대회논문집D
• /
• pp.31-36
• /
• 2001

As a part of micro engine development feasibility estimation was done through fabrication and test of down scaled combustor and MEMS fabricated spark electrode. In an experimental observation of the down scaled combustion phenomena where flame propagation was observed by optical method and pressure change in combustor which gives the information about the reaction generated thermal energy was recorded and analyzed. Optimal combustor scale was derived to be about 2mm considering increased heat loss effect and thermal energy generation capability. Through the fabrication and discharge test of MEMS electrode effects of electrode width and gap was investigated. Electrode was fabricated by thick PR mold and electroplating. From the result discharge voltage characteristic in sub millimeter scale electrode having thickness of $40{\mu}m$ was obtained. From the result base technology for design and fabrication of micro engine was obtained.

• Proceedings of the KSME Conference
• /
• 대한기계학회 2004년도 추계학술대회
• /
• pp.904-909
• /
• 2004

In this paper a web-based micro fabrication system is discussed. A commercial CAD and a web browser were used as its user interfaces. In these user interfaces the concepts of Design for Manufacturing (DFM) was implemented providing the fabrication knowledge of micro machining to the designers. Simple databases were constructed to store the fabrication knowledge of materials, tools, and micro machining know-how. The part geometry was uploaded to the web server of this system as an STL (Stereo Lithography) format with process parameters for 3-axis micro milling. A Slice-based process planner automatically provides NC codes for controlling micro stages. A couple of micro parts were fabricated using the system with micro endmills. This design and manufacturing system enables network users to obtain micro-scale prototypes in a rapid manner.