• Title/Summary/Keyword: eutectic melting

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Enhancement of Thermal Insulation Performance with Phase Change Material for Thermal Batteries (상변화 물질을 이용한 열전지 단열성능 향상에 관한 연구)

  • Lee, Jaein;Ha, Sang-hyeon;Kim, Kiyoul;Cheong, Haewon;Cho, Sungbaek
    • Journal of the Korea Institute of Military Science and Technology
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    • v.19 no.4
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    • pp.469-475
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    • 2016
  • Thermal batteries are primary reserve power sources, which are activated upon the melting of eutectic electrolytes by the ignition of heat sources. Therefore, sufficient thermal insulation is absolutely needed for the stable operation of thermal batteries. Currently, excessive amount of heat sources is being used to compensate the heat loss in the cell stack along with the insertion of metal plates and thermal insulators to reserve heat at the both ends of cell stack. However, there is a possibility that the excessive heat flows into the cell stack, causing a thermal runaway at the early stage of discharge. At the same time, the internal temperature of thermal batteries cannot be maintained above the battery operating temperature at the later stage of discharge because of the insufficient insulation. Therefore, the effects of Phase Changing Material(PCM) plates were demonstrated in this study, which can replace the metal and insulating plates, to improve the thermal insulation performance and safety of thermal batteries.

A Study on the Microstructural Characteristics of Tungsten by Boron Addition (붕소의 첨가에 따른 텅스텐의 미세조직 변화에 관한 연구)

  • Yoon, Kook Han;Kim, Young Do;Kim, Hyon Tae;Yoo, Myoung Ki;Choi, Ju
    • Analytical Science and Technology
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    • v.5 no.1
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    • pp.127-134
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    • 1992
  • Effects of boron addition on microstructure and phases of plasma are melted tungsten have been investigated by optical microscopy, scanning electron microscopy, Auger electron spectroscopy, X-ray diffractometer, measurements of grain size and hardness. The change in the microstructure upon boron addition was studied by optical microscopy. It was observed that the grain refinement was induced upon content within the limit of solubility. When the boron content was above the solubility limit, two phases of primary tungsten and eutectic structure were observed and confirmed by AES and XRD analysis. It was also shown that recrystallization temperature was increased and recrystallized grain size was reduced as boron content increased.

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EFFECT OF ADDED Si ON DENSIFICATION OF Ni-AI INTERMETALLIC COATING ON SPHEROIDAL GRAPHITE CAST IRON SUBSTRATES

  • Kim, Tetsuro ata;Keisuke Uenishi;Akira Ikenaga;Kojiro F. Kobayashi
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.726-731
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    • 2002
  • Reaction synthesis is a process to form ceramics, intermetallics and their composites from elemental powder mixture. Application of this process to a surface modification techniques has a possibilities to enable the process at a lower temperature or for a shorter time, although synthesized materials are likely to include voids and unreacted elements. This paper intend to examine the effect of Si addition to the mixture of Al and Ni on the densification of synthesized Ni-Al intermetallic compounds and to evaluate the surface properties of obtained coatings. By the Si addition, exothermic reaction temperature to form Ni-Al intermetallic was lowered to be below the melting point of Al. Si soluted $Al_3$Ni$_2$, $Al_3$Ni and $Al_{6}$Ni$_3$Si were mainly formed in the coating layer when powder mixture was heated to 973K for 300s. Besides, densification was enhanced by increasing hot press pressure, Si additions and heating rate. When the composition of eutectic Al-Si reaches 78%, void ratio of sintered compact reduced to 0.4%. It is caused by higher flowability of Al-Si liquid phase generated and its infiltration into the void. Since the hardness of NiAl(Si) compound (about 600HV) formed in the coating layer is higher than that of Ni-Al compound (about 400HV), coating layer with high density and superior wear property is obtained by hot press using reaction synthesis from Al-Ni-Si powder mixture.

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Properties of Autogenous Shrinkage according to Hydration Heat Velocity of High Strength Concrete Considering Mass Member (매스부재를 고려한 고강도콘크리트의 수화발열상승속도 조절에 따른 자기수축 특성)

  • Koo, Kyung-Mo;Kim, Gyu-Yong;Hong, Sung-Hyun;Nam, Jeong-Soo;Shin, Kyoung-Su;Khil, Bae-Su
    • Journal of the Korea Institute of Building Construction
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    • v.12 no.4
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    • pp.369-376
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    • 2012
  • In this study, to reduce the hydration heat velocity (HHV) of high-strength mass concrete at early ages, phase change materials (PCM) that could absorb hydration heat were applied, and the changes in autogenous shrinkage were investigated, as well as the relationship between the hydration temperature and autogenous shrinkage. The acceleration of the cement hydration process by the PCM leads to an early setting and a higher development of the compressive strength and elastic modulus of concrete at very early ages. The function of PCM could be worked below the original melting point due to the eutectic effect, while the hydration temperature and HHV of high-strength mass concrete can be decreased through the use of the PCM. A close relationship was found between the hydration temperature and autogenous shrinkage: the higher the HHV, the greater the ultimate autogenous shrinkage.

Studies on the Detergency of Oily Soils (Part 1) - Detergency of Soild Oily Soils - (유성오염의 세척성에 관한 연구(제1보) -개체유성오염의 세척성-)

  • 김영희;정두진
    • Journal of the Korean Society of Clothing and Textiles
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    • v.18 no.4
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    • pp.524-535
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    • 1994
  • The interaction and detergency between oily soil and surfactant solution were studied Samples used were tristearin, tripalmitin and their mixture as a triglyceride, myristic acid as a fatty acid and sodium dodecyl sulfate (SDS) as surfactant. The results were as follows: 1. The mixtures of model oily soils were formed of eutectic point and their melting point were lower than them of individual oily soils. 2. The formation of liquid crystalline (LC) phase was recognized in the triangle phase diagram for SDS~ water~model oily soil system. The areas of LC phase region were in the order of SHS~ water~myristir acid> SDS~ water~mixture of tristearin, tripalmitin and myristic acid (TS/TP/M)>SDS~water~mixture of tristearin and tripalmitin (TS/TP) 3. The LC phase region expanded to wide concentration range of SDS solution and high concentration range of model oily soil with increasing temperature. Particularity, the LC phase region expanded highly at $30~40^{\circ}C$ but when the temperature was elevated above $40^{\circ}C$, expanding tendency decreased. 4. In the system of myristic acid and TS/TP/M contacted with SDS solution, the LC phase was already formed at $28^{\circ}C$ and the region of the LC phase were expanded with increasing temperature. But in the system of TS/TP contacted with SDS solution, the LC phase was not formed in whole experiment temperature. 5. The detergency of myristic acid was very high ann it was recognized that the formation of the LC phase played an important role in the detergency. The detergency of TS/TP was very for low, but when TS/TF was mixed with myristic acid, the detergency of TS/TP increased. It is supposed that the LC phase was formed butween SDS solution and myristic acid promoted to penetration of SDS solution into the inner parts of TS/TP.

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Lower Temperature Soldering of Capacitor Using Sn-Bi Coated $Sn-3.5\%Ag$ Solder (Sn-Bi도금 $Sn-3.5\%Ag$ 솔더를 이용한 Capacitor의 저온 솔더링)

  • Kim Mi-Jin;Cho Sun-Yun;Kim Sook-Hwan;Jung Jae-Pil
    • Journal of Welding and Joining
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    • v.23 no.3
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    • pp.61-67
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    • 2005
  • Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

Mechanism of Crack Formation in Pulse Nd:YAG Laser Spot Welding of Al Alloys (Al합금 펄스 Nd:YAG 레이저 점 용접부의 균열 발생기구)

  • 하용수;조창현;강정윤;김종도;박화순
    • Journal of Welding and Joining
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    • v.18 no.2
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    • pp.86-94
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    • 2000
  • This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7N01 spot-welded by pulse Nd : YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed : center line crack({TEX}$C_{C}${/TEX}), diagonal crack({TEX}$C_{D}${/TEX}), and U shape crack({TEX}$C_{U}${/TEX}). Also, HAZ crack({TEX}$C_{H}${/TEX}) was observed in the HAZ region, furthermore, mixing crack({TEX}$C_{M}${/TEX}) consisting of diagonal crack and HAZ crack was observed. White film was formed at th hot crack region in the fractured surface after it was immersed to 10% NaOH water. In the case of A5083 alloy, white films in {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack region were composed of low melting phases, {TEX}$Fe_{2}SiAl_{8}${/TEX} and eutectic phases, $Mg_2$Al$_3$ and $Mg_2$Si. Such films observed $CuAl_2$, {TEX}$Mg_{32}(Al,Zn)_{3}${/TEX}, MgZn$_2$, $Al_2$CuMg and $Mg_2$Si were observed in the whitely etched films near {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Sim in the case of A7N01 alloy, respectively. The {TEX}$C_{C}${/TEX} and {TEX}$C_{D}${/TEX} cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of {TEX}$C_{M}${/TEX} crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The {TEX}$C_{U}${/TEX} crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification.

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Joining Foil-typed Pd-Cu Membranes to Collect CO2 Gas (이산화탄소 포집용 극박형 Pd-Cu 멤브레인 접합)

  • Rhewy, Gyung-Woo;Wee, So-Young;Kim, Gyeom;Lee, Chang-Ha;Baik, Il-Hyun;Park, Jin-Woo
    • Korean Journal of Metals and Materials
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    • v.48 no.12
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    • pp.1056-1063
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    • 2010
  • We present a new joining method for Pd-Cu membrane foils used as permeation tubes to collect $CO_2$. Since foils have poor mechanical strength, joining should be done at low temperatures to reduce residual stresses and without joining pressure. This contradicts the well known conditions for good contact between base materials that determines joint qualities. We selected Sn-Ag-Cu alloys that are highly reactive with Pd and Cu as a filler metal. As the filler melts at joining temperatures as low as $220{\sim}280^{\circ}C$, Pd and Cu are dissolved into the melt and react with the filler elements, which raises the melting temperature of the filler based on eutectic structures among the elements. Then, isothermal solidification progresses for the rest of the joining time. Intermetallic compounds (IMC) in the joints, one of the main factors for brittle joints, are inevitably formed. However, by optimizing both joining time and temperature, we balanced the wettability with IMC. Sealing test results confirmed that the joints are mechanically reliable during operation.

Electrochemical Behavior of Sm(III) on the Aluminium-Gallium Alloy Electrode in LiCl-KCl Eutectic

  • Ye, Chang-Mei;Jiang, Shi-Lin;Liu, Ya-Lan;Xu, Kai;Yang, Shao-Hua;Chang, Ke-Ke;Ren, Hao;Chai, Zhi-Fang;Shi, Wei-Qun
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.19 no.2
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    • pp.161-176
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    • 2021
  • In this study, the electrochemical behavior of Sm on the binary liquid Al-Ga cathode in the LiCl-KCl molten salt system is investigated. First, the co-reduction process of Sm(III)-Al(III), Sm(III)-Ga(III), and Sm(III)-Ga(III)-Al(III) on the W electrode (inert) were studied using cyclic voltammetry (CV), square-wave voltammetry (SWV) and open circuit potential (OCP) methods, respectively. It was identified that Sm(III) can be co-reduced with Al(III) or Ga(III) to form AlzSmy or GaxSmy intermetallic compounds. Subsequently, the under-potential deposition of Sm(III) at the Al, Ga, and Al-Ga active cathode was performed to confirm the formation of Sm-based intermetallic compounds. The X-ray diffraction (XRD) and scanning electron microscopy-energy dispersive spectroscopy (SEM-EDS) analyses indicated that Ga3Sm and Ga6Sm intermetallic compounds were formed on the Mo grid electrode (inert) during the potentiostatic electrolysis in LiCl-KCl-SmCl3-AlCl3-GaCl3 melt, while only Ga6Sm intermetallic compound was generated on the Al-Ga alloy electrode during the galvanostatic electrolysis in LiCl-KCl-SmCl3 melt. The electrolysis results revealed that the interaction between Sm and Ga was predominant in the Al-Ga alloy electrode, with Al only acting as an additive to lower the melting point.

Effects of Cr and Fe Addition on Microstructure and Tensile Properties of Ti-6Al-4V Prepared by Direct Energy Deposition

  • Byun, Yool;Lee, Sangwon;Seo, Seong-Moon;Yeom, Jong-taek;Kim, Seung Eon;Kang, Namhyun;Hong, Jaekeun
    • Metals and materials international
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    • v.24 no.6
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    • pp.1213-1220
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    • 2018
  • The effects of Cr and Fe addition on the mechanical properties of Ti-6Al-4V alloys prepared by direct energy deposition were investigated. As the Cr and Fe concentrations were increased from 0 to 2 mass%, the tensile strength increased because of the fine-grained equiaxed prior ${\beta}$ phase and martensite. An excellent combination of strength and ductility was obtained in these alloys. When the Cr and Fe concentrations were increased to 4 mass%, extremely fine-grained martensitic structures with poor ductility were obtained. In addition, Fe-added Ti-6Al-4V resulted in a partially melted Ti-6Al-4V powder because of the large difference between the melting temperatures of the Fe eutectic phase (Ti-33Fe) and the Ti-6Al-4V powder, which induced the formation of a thick liquid layer surrounding Ti-6Al-4V. The ductility of Fe-added Ti-6Al-4V was thus poorer than that of Cr-added Ti-6Al-4V.