• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.4
• /
• pp.39-46
• /
• 2003

Sn-Cu eutectic solder bump was fabricated by electroplating for flip chip and its characteristics were studied. A Si-wafer was used as a substrate and the UBM(Under Bump Metallization) of Al(400 nm)/Cu(300 nm)/Ni(400 nm)/Au(20 nm) was coated sequentially from the substrate to the top by an electron beam evaporator. The experimental results showed that the plating ratio of the Sn-Cu increased from 0.25 to 2.7 $\mu\textrm{m}$/min with the current density of 1 to 8 A/d$\m^2$. In this range of current density the plated Sn-Cu maintains its composition nearly constant level as Sn-0.9∼1.4 wt%/Cu. The solder bump of typical mushroom shape with its stem diameter of 120 $\mu\textrm{m}$ was formed through plating at 5 A/d$\m^2$ for 2 hrs. The mushroom bump changed its shape to the spherical type of 140 $\mu\textrm{m}$ diameter by air reflow at $260^{\circ}C$. The homogeneity of chemical composition for the solder bump was examined, and Sn content in the mushroom bump appears to be uneven. However, the Sn distributed more uniformly through an air reflow.

• Journal of the Korean Society for Heat Treatment
• /
• v.13 no.1
• /
• pp.1-9
• /
• 2000

The microstructural characteristics and low temperature tensile properties between $25^{\circ}C$ and $-196^{\circ}C$ for as-welded and age hardened specimen by using Al 5083-H321 for base metal, 5083-5356 and 5083-4043 weldments have been investigated. The hardness of 5083-5356 weldment decreases with aging treatment, whereas the weld region of 5083-4043 weldment shows remarkable increase in hardness after aging due to the precipitation of fine Si particle at the grain boundaries and interiors. Low temperature tensile properties of 5083 AI base metal, 5083-5356 and 5083-4043 weldments appear to be the increment of tensile strengths and elongations at the room temperature and $-196^{\circ}C$, while the decrement of tensile properties around $-50^{\circ}C$ is shown. Through the observation of fine serration to fracture in the stress-strain curve and tensile fractography, the increment of localized deformation leading to promote the neck initiation and the increment of the dimple size cause to decrease in tensile strengths and elongations around $-50^{\circ}C$. For the tensile specimen of the 5083 base metal, 5083-5356 and 5083-4043 weldments, the reason to increase in elongation after solution and aging treatment is the diminishment of fine pit, the resolution of Mg into the matrix and the spheridization of the eutectic Si.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.05a
• /
• pp.65-69
• /
• 2003

The effects of microstructural features on the fracture behaviors, including impact, high-cycle fatigue, fatigue and crack propagation, of thixoformed 357-T5 (Al-7%Si-0.6%Mg) alloy were examined. The resistance to impact and high-cycle fatigueof thixoformed 357-T5 tended to improve greatly with increasing solid volume fraction. An almost three-fold increase in impact energy value was, for example, observed with increasing solid volume fraction from 59 to 70%. The improvement in both impact and fatigue properties of thixoformed 357-75 with increasing solid volume fraction in the present study appeared to be related to the magnitude of stress concentration at the interface between primary and eutectic phase, by which the fracture process was largely influenced. Based on the fractographic and micrographic observations, the mechanism associated with the beneficial effect of high solid volume fraction in thixoformed 357-T5 alloy was discussed.

• Journal of Korea Foundry Society
• /
• v.37 no.2
• /
• pp.31-37
• /
• 2017

A new form of austenitic heat-resistant ductile iron was developed and its microstructures and elevated temperature properties were compared to those of Ductile Ni-Resist D5S. According to JMatPro calculations, it was predicted that Mo-rich carbides would be crystallized before the eutectic reaction starts in the developed alloy. At the austenite cell boundaries of the developed alloy, both Mo-rich carbides and Cr-rich carbides were found. In addition, Ni-silicides were found adjacent to Cr-rich carbides in D5S specimen and were identified as $Ni_2Si$. The developed alloy also had greater yield strength and lower tensile strength levels with less elongation due to the dissolution of Mo atoms into the austenite matrix and the precipitation of Mo-rich carbides. From the results of elevated temperature tensile tests and stress-rupture tests, it was found that the developed alloy had elevated temperature properties superior to those of D5S. This was due to the pinning effect of the dissolved Mo atoms in the austenite matrix.

• Journal of Welding and Joining
• /
• v.31 no.3
• /
• pp.4-10
• /
• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Journal of the Korean institute of surface engineering
• /
• v.36 no.5
• /
• pp.386-392
• /
• 2003

The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm) subsequently. The compositions of the bump were Sn-Cu and eutectic Sn-Pb, and characteristics of two bumps were compared. Experimental results showed that the electroplated thickness of the solders were increased with time, and the increasing rates were TEX>$0.45 <\mu\textrm{m}$/min for the Sn-Cu and $ 0.35\mu\textrm{m}$/min for the Sn-Pb. In the case of Sn-Cu, electroplating rate increased from 0.25 to $2.7\mu\textrm{m}$/min with increasing current density from 1 to 8.5 $A/dm^2$. In the case of Sn-Pb the rate increased until the current density became $4 A/dm^2$, and after that current density the rate maintains constant value of $0.62\mu\textrm{m}$/min. The electro plated bumps were air reflowed to form spherical bumps, and their bonded shear strengths were evaluated. The shear strength reached at the reflow time of 10 sec, and the strength was of 113 gf for Sn-Cu and 120 gf for Sn-Pb.

• Journal of Korea Foundry Society
• /
• v.19 no.5
• /
• pp.403-409
• /
• 1999

Mg-Zn-Zr ternary alloys containing 6wt% Zn and (0, 0.4, 0.6)wt% Zr, which is added for grain refinement, can be cast into complex shape by squeeze casting. The influence of Zn and Zr as additional elements on microstructure and mechanical characteristics is investigated by OM, SEM, WDX, XRD and microvickers hardness measurement. The microstructure of Mg-Zn-Zr alloys consists of primary ${\alpha}-Mg$ and MgZn eutectic compound between dendrites. The grain size is decreased from $136{\mu}m$ to $97\;{\mu}m$ by Zr addition, resulting in that the hardness is increased from 42Hv to 59Hv. Furthermore, the grain size is changed to $83{\beta}$ and the hardness is increased to 65Hv by additional infiltration pressure. These results indicate that the Zr addition and additional infiltration pressure are effective for grain refinement acting as an important factor to increase the hardness. The increment in hardness by the Zr addition is slightly larger than that by the additional infiltration pressure.

• Journal of Korea Foundry Society
• /
• v.18 no.5
• /
• pp.431-438
• /
• 1998

Microstructure of A356 aluminum alloys cast in the permanent mold was investigated by optical microscope and image analyzer, with particular respect to the shape and size distribution of iron intermetallics known as ${\beta}-phase$ ($Al_5FeSi$). Morphologies of the ${\beta}-phase$ was found to change gradually with the Be:Fe ratio like these. In Be-free alloys, ${\beta}-phase$ with needlelike morphology was well developed, but script phase was appeared when the Be:Fe ratio is above 0.2:1. With the Be:Fe ratios of 0.4:1-1:1, script phase as well as Be-rich phase was also observed. In case of higher Be addition, above 1:1, Be-rich phase was observed on all regions of the specimens, and increasing of the Be:Fe ratios gradually make the Be-rich phase coarse. It was also observed that the ${\beta}-phase$ with needlelike morphology was coarsened with increase of the Fe content in Be-free alloys. However, in Be-added alloys, length and number of these ${\beta}-phases$ were considerably decreased with the increased Be:Fe ratio. Beryllium addition improved tensile properties and impact toughness of the A356 aluminium alloy, due to the formation of a script phase or a Be-rich phase instead of a needlelike ${\beta}-phase$. The DSC tests indicated that the presence of Be could increase the amount of Mg which is available for $Mg_2Si$ precipitate hardening, and enhance the precipitation kinetics by lowering the ternary eutectic temperature.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
• /
• v.7 no.4
• /
• pp.213-218
• /
• 2009

Electrowinning process recovers uranium with actinide elements from spent fuels and is a key step in the Pyroprocessing because of proliferation resistance. An analysis of heat transfer of the Electrowinning cell was conducted to develop basic tool for designing engineering-scale Electrowinner. For the calculation of the heat transfer, ANSYS CFX commercial code was adapted. As a result of the calculation, the vertical Heating Zone length had great effect upon temperature of LiCl-KCl eutectic salt. To maintain constant temperature in the salt, the Heating Zone length should be three times longer than the height of the salt. However, the argon and salt temperatures were barely affected by the Cooling Zone length. The temperature under the Cell cover was mainly influenced by the number of the cooling plates. When the cooling plates were installed more than the number of 5, temperature under the cover was maintained below $250^{\circ}C$. These temperature properties had similar tendency toward the temperature of the Cell which was measured from experiments, Simulated heat transfer information from this study could be used to design engineering-scale Electrowinner.

• Journal of Korea Foundry Society
• /
• v.20 no.2
• /
• pp.104-109
• /
• 2000

Three different white cast irons alloyed with Cr, V, Mo and W were prepared in order to study their abrasion wear behavior in as-cast and heat-treated conditions. The specimens were produced using a 15㎏-capacity high frequency induction furnace. Melts were super-heated to $1600^{\circ}C$, and poured at $1550^{\circ}C$ into Y-block pepset molds. Three combinations of the alloying elements were selected so as to obtain the different types of carbides : 3%C-10%Cr-5%Mo-5%W(alloy No. 1: $M_7C_3$ and $M_6C$), 3%C -10%V-5%Mo-5%W(alloy No. 2: MC and $M_2C$) and 3%C-17%Cr-3%V(alloy No. 3: $M_7C_3$ only). A scratching type abrasion test was carried out in the states of as-cast(AS), homogenizing(AH), air-hardening(AHF) and tempering(AHFT). First of all, the as-cast specimens were homogenized at $950^{\circ}C$ for 5h under the vacuum atmosphere. Then, they were austenitized at $1050^{\circ}C$ for 2h and followed by air-hardening in air. The air-hardened specimens were tempered at $300^{\circ}C$ for 3h. 1 ㎏ load was applied in order to contact the specimen with abrading wheel which was wound by 120 mesh SiC paper. The wear loss of the test piece(dimension: $50{\times}50{\times}5$ mm) was measured after one cycle of wear test and this procedure was repeated up to 8 cycles. In all the specimens, the abrasion wear loss was found to decrease in the order of AH, AS, AHFT and AHF states. Abrasion wear loss was lowest in the alloy No.2 and highest in the alloy No.1 except for the as-cast and homogenized condition in which the alloy No.3 showed the highest abrasion wear loss. The lowest abrasion wear loss of the alloy No.2 could be attributed to the fact that it contained primary and eutectic MC carbides, and eutectic $M_2C$ carbide with extremely high hardness. The matrix of each specimen was fully pearlitic in the as-cast state but it was transformed to martensite, tempered martensite and austenite depending upon the type of heat-treatment. From these results, it becomes clear that MC carbide is a significant phase to improve the abrasion wear resistance.