• Journal of Korea Foundry Society
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• v.10 no.1
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• pp.57-63
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• 1990

Continuous casting of the $Al-CuAl_2$ eutectic composite was carried out by the upward continuous casting process. The morphology of the eutectic growth and the stability of solid-liquid interface were investigated under various growth conditions. It was possible to get the planar solid-liquid interface at the condition of $G_L/R$＝$3.6{\times}10^3^{\circ}Csec/mm^2$. And the colony structures were formed at the conditions of $G_L/R$ < $R=0.33{\times}10^3^{\circ}Csec/mm^2$. The inter-lamellar spacing of $Al-CuAl_2$ eutectic composite was decreased with the increase of pulling speed. The reduction of inter-lamellar spacing & value of $G_L/R$ caused the increase of ultimate tensile strength and Rockwell hardness in $Al-CuAl_2$ eutectic composite.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.6
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• pp.229-233
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• 2005

Novel process was tried to obtain micro-porous ceramic body containing continuous pore channel. $MgAl_2O_4/MgO$ eutectic fibers and rods have been grown successfully by the micro-pulling-down method, and the microstructures and optical characterizations of grown crystals were performed. $MgAl_2O_4/MgO$ eutectic fibers of $0.3{\sim}1mm$ in diameter and about 500 mm in length, and the rods having 5 mm in diameter with approximately 60 mm in length have been grown with the $6{\sim}120mm/hr$ of growth speed. The eutectic fibers showed homogeneous microstructure in which MgO fiber aligned to the growth direction in the $MgAl_2O_4$ (spinel) matrix. The grown crystals looked semitransparency under naked eyes. Optical and orientational characterizations were performed. The second phase of MgO (periclase) was easily removed by selective etching with hydrochloric acid, and then porous bodies were obtained.

• Korean Journal of Materials Research
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• v.18 no.11
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• pp.577-582
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• 2008

Directional solidification experiments were carried out at $1-300\;{\mu}m/sec$ solidification rates in the single crystal superalloy, CMSX 10. The solid/liquid interface morphology changed from planar to dendritic, and the dendrite spacing became finer as the solidification rate increased. The pool size of the ${\gamma}/{\gamma}'$ eutectic, formed between dendrites, reduced as the solidification rate increased. The phase formation temperatures, such as the solidus, liquidus and eutectic, were estimated by differential scanning calorimetry (DSC) analysis. The morphology of the ${\gamma}/{\gamma}'$ phase, known to be eutectic, showed ${\gamma}'$ cells with a $\gamma$ intercellular network, and this ${\gamma}/{\gamma}'$ was composed of coarse and fine ${\gamma}/{\gamma}'$ regions. In this study, it is suggested that the ${\gamma}/{\gamma}'$ phase was a coupled peritectic.The solidification procedure of the ${\gamma}/{\gamma}'$ between dendrites is also discussed.

• 연구논문집
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• s.25
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• pp.163-168
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• 1995

The intermetallic compound $Ni_3Al$ causes a peritectic reaction at the composition and temperature very close to the eutectic reaction in Ni-Al system. Although the phase diagram accepted for this system by ASM Handbook has the eutectic forming between the $\gamma$ and $\gamma$ phases, directional solidification study has shown that the eutectic occurs between $\beta$ and $\gamma$. This work examines the liquidus region using quenched, directional solidification experiments that preserve the microstructrues formed at the solidification front. It is also shown that under certain composition and growth conditions a metastable eutectic between the $\beta$ and $\gamma$ phases forms in this system. Finding of the metastable eutectic provided an important information to understand the phase equilibria near the $Ni_3Al$ composition.

• Journal of Korea Foundry Society
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• v.24 no.2
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• pp.79-84
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• 2004

In this study, the electromagnetic vibration is adopted for modifying eutectic Si phase and reducing its size. The higher the current density and frequency of electromagnetic vibration(EMV), the finer the size of eutectic Si phase. The tensile strength and elongation of EMVed alloy were highly improved. Measured twin probability of EMVed alloy at a frequency of 1000 Hz was approximately six times as high as that of the normal alloy. The mechanism for the increase in twin density due to EMV during solidification could be supposed from the fact that the preferential growth along <112> in silicon was suppressed by preventing Si atom from attaching to the growing interface of Si phase and by changing the solid/liquid interfacial energy of silicon. According to the result of UTS test, because of modification of eutectic Si, UTS and elongation are highly increased.

• Journal of Korea Foundry Society
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• v.28 no.2
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• pp.69-73
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• 2008

In the present study, microstructural evolution and mechanical properties of Ti-Fe-Sn ultrafine eutectic alloys have been investigated. Ultrafine eutectic microstructure consisting of a mixture of ${\beta}$-Ti solid solution and TiFe intermetallic compound homogeneously formed in $(Ti_{70.5}Fe_{29.5})_{100-x}Sn_x$ alloys with x = 0, 1 and 3. Addition of Sn is effective to modify the eutectic colony into the spherical shape with decreasing the lamellar spacing and colony size. This results in enhancing the macroscopic plasticity up to 3.1% of the Ti-Fe-Sn ultrafine eutectic alloys.

• Journal of Korea Foundry Society
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• v.10 no.1
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• pp.50-56
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• 1990

Continuous casting of the $Al-Al_3Ni$: eutectic composite was carried out by the upward continuous casting process. The morphology of the eutectic growth and the stability of solid-liquid interface were investigated under various growth conditions in an upward continuous casting. The effect of growth conditions on the mechanical properties of the $Al-Al_3$ Ni eutectic composit was also investigated, and the results were compared with those by the Bridgman method. As for the results, it was possible to get the planar solid-liquid interface at the condition of $G_L/R$＝$1.04{\times}10^3^{\circ}Csec/mm^2$. And the inter-rod spacing of $Al-Al_3Ni$ eutectic composite was decreased with the increase of pulling speed. The reduction of inter-rod spacing & value of $G_L/R$ caused the increase of ultimate tensile strength in $Al-Al_3Ni$: eutectic composite. The ultimate tensile strengths of $Al-Al_3Ni$ by the upward continuous casting were higher then those by the Bridgman method.

• Journal of Korea Foundry Society
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• v.17 no.6
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• pp.608-614
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• 1997

The effect of mold preheating temperature on the microstructure such as grain size, eutectic silicon morphology was investigated for the Al-7wt%Si-0.3wt%Mg alloy. Microstructural variations have been characterized as a function of Sr addition and cooling rate during solidification. Microstructures were correlated with cooling rate, local solidification time and eutectic nucleation temperature, etc. In this study, Sr addition caused increase of local solidification time, undercooling and reduction of eutectic plateau temperature. In logarithmic scale, local solidification time was in inverse proportion to cooling rate. Eutectic nucleation temperature was in inverse proportion to cooling rate of logarithmic scale. Increasing the cooling rate refined dendrite arm spacing and eutectic silicon. Dendrite arm spacing was logarithmically in inverse proportion to cooling rate. Without modifier addition, eutectic silicon was modified at cooling rate of $7^{\circ}C/s$ or higher.

• Journal of Korea Foundry Society
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• v.8 no.4
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• pp.453-458
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• 1988

Al-Si alloy powder produced by the gas atomizer showed fine eutectic structure between ${\alpha}-dendrites$, that was grown by coupled growth, and there remained small amount of ${\alpha}$ in Al - 20 wt% Si alloy. The morphology of Si in the eutectic structure was largely influenced by the recalescence caused by solidification latent heat, and that was thought to be due to decrement of the surface energy of Si. In modified eutectic Si by rapid solidification, fine twin about $0.01\;{\mu}m$ was observed and growth direction of eutectic Si was <112>. This fact implied that the growth mechanism of eutectic Si in rapid solidification was related to TPRE mechanism. Due to rapid solidification Si was soluble in ${\alpha}-phase$ in Al - 12.6wt%Si alloy up to about 3.4wt%, and the solubility of Si in ${\alpha}-phase$ reaches the equilibrium solubility stare after 60min, holding when it was held isothermally at $253-296^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.303-304
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• 2005

In this paper, we report a fluxless eutectic die bonding process which uses 80Au-20Sn eutectic alloy. The chip LEDs are picked and placed on silicon substrate wafers. The bonding process temperatures and force are $305\sim345^{\circ}C$ and 10$\sim$100gf, respectively. The bonding process was performed on graphite heater with nitrogen atmosphere. The quality of bonding are evaluated by shear test and thermal resistance. Results of fluxless eutectic die bonding show that shear strength is Max. 3.85kgf at 345$^{\circ}C$ /100gf and thermal resistance of junction to die bonding is Min. 3.09K/W at 325$^{\circ}C$/100gf.