Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2005.11a
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- Pages.303-304
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- 2005
The Characteristics of Thermal Resistance for Fluxless Eutectic Die Bonding in High Power LED Package
Fluxless eutectic die bonding을 적용한 high power LED 패키지의 열저항 특성
- Shin, Sang-Hyun (Samsung Electro-Mechanics) ;
- Choi, Sang-Hyun (Samsung Electro-Mechanics) ;
- Kim, Hyun-Ho (Samsung Electro-Mechanics) ;
- Lee, Young-Gi (Samsung Electro-Mechanics) ;
- Choi, Suk-Moon (Samsung Electro-Mechanics)
- Published : 2005.11.10
Abstract
In this paper, we report a fluxless eutectic die bonding process which uses 80Au-20Sn eutectic alloy. The chip LEDs are picked and placed on silicon substrate wafers. The bonding process temperatures and force are