• 한국정밀공학회지
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• 제18권12호
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• pp.192-199
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• 2001

Chemical mechanical planarization (CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There hale been serious problems in CMP in terms of repeatability and deflects in patterned wafers. Especial1y, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasives and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using CeO$_2$is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method fur developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• 대한금속재료학회지
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• 제49권5호
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• pp.400-405
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• 2011

ZnO nanotube arrays were synthesized by a two-step process: electrodeposition and selective dissolution. In the first step, ZnO nanorod arrays were grown on an Au/Si substrate by using a homemade electrodeposition system. ZnO nanorod arrays were then selectively dissolved in an etching solution composed of 0.125 M NaOH, resulting in hollow ZnO nanotube arrays. It is suggested that the formation mechanism of the ZnO nanotube arrays might be attributed to the preferred surface adsorption of hydroxide ion ($OH^{-1}$) on a positive polar surface followed by selective dissolution of the metastable Zn-terminated ZnO (0001) polar surface caused by the difference in the surface energy per unit area between the ZnO nanorod and nanotube.

• Journal of Ceramic Processing Research
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• 제20권1호
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• pp.48-53
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• 2019

Carbon fiber reinforced SiC composites (C/SiC) have high-temperature stability and excellent thermal shock resistance, and are currently being applied in extreme environments, for example, as aerospace propulsion parts or in high-performance brake systems. However, their low thermal conductivity, compared to metallic materials, are an obstacle to energy efficiency improvements via utilization of regenerative cooling systems. In order to solve this problem, the present study investigated the bonding strength between carbon fiber and matrix material within ceramic matrix composite (CMC) materials, demonstrating the relation between the microstructure and bonding, and showing that the mechanical properties and thermal conductivity may be improved by treatment of the carbon fibers. When fiber surface was treated with a nitric acid solution, the observed segment crack areas within the subsequently generated CMC increased from 6 to 10%; moreover, it was possible to enhance the thermal conductivity from 10.5 to 14 W/m·K, via the same approach. However, fiber surface treatment tends to cause mechanical damage of the final composite material by fiber etching.

• Journal of Periodontal and Implant Science
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• 제36권2호
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• pp.319-334
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• 2006

Mechanical and chemical methods are the two ways to treat the implant surfaces. By using mechanical method, it is difficult to eliminate bacteria and by-products from the rough implant surface and it can also cause the structural change to the implant surface. Therefore, chemical method is widely used in order to preserve and detoxicate the implant surface more effectively. The purpose of this study is to evaluate the effect of tetracylcline-hydrochloride(TC-HCI) on the change of implant surface microstructure according to application time. Implants with pure titanium machined surface, SLA surface and porous surface were used in this study. Implant surface was rubbed with sponge soaked in 50mg/ml TC-HCI solution for $\frac{1}{2}$ min., 1 min., $1\frac{1}{2}$ min., 2 min., and $2\frac{1}{2}$ min. respectively in the test group and with no treatment in the control group. Then, specimens were processed for scanning electron microscopic observation. 1. Both test and control group showed a few shallow grooves and ridges in pure titanium machined surface implants. There were not significant differences between two groups. 2. In the SLA surfaces, the control specimen showed that the macro roughness was achieved by large-grit sandblasting. Subsequently, the acid-etching process created the micro roughness, which thus was superimposed on the macro roughness. Irrespective of the application time of 50mg/ml TC-HCI solution, in general, test specimens were similar to control. 3. In the porous surfaces, the control specimen showed spherical particles of titanium alloy and its surface have a few shallow ridges. The roughness of surfaces conditioned with tetracycline-HCI was lessened and seen crater-like irregular surfaces relative to the application time. In conclusion, pure titanium machined surfaces and SLA surfaces weren't changed irrespective of the application time of tetracycline-HCI solution. But the porous surfaces conditioned with tetracycline-HCI solution began to be slightly changed from 2 min. This results are expected to be applied to the regenerative procedures for peri-implantitis treatment.

• 마이크로전자및패키징학회지
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• 제15권3호
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• pp.27-33
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• 2008

PDA, 핸드폰과 같은 포터블 제품의 사용이 급증함에 따른 전자 제품의 사용 환경의 변화는 제품의 솔더 조인트 신뢰성을 더욱 필요로 하게 되었다. 무전해 니켈/금 도금 표면 처리는 솔더링 특성이 우수하고, 표면처리 두께가 균일하며 패키징 공정에서 사용되는 광학설비에서 인식이 잘되기 때문에 미세피치 SMT 디바이스와 BGA 기판에 폭넓게 사용되고 있다. 그러나 무전해 니켈/금 도금 표면과 솔더 계면에서 발생되는 취성 파괴가 문제점으로 지적되고 있다. 솔더의 취성 파괴는 솔더링시 금속간 화합물과 무전해 니켈층 사이에 형성된 P-rich 영역의 갈바닉 니켈 부식에 의한 black pad 현상에 기인한다. 이론적으로 평탄한 무전해 Ni표면은 무전해 금도금 과정 중 도금액의 균일하게 순환되기 때문에 black pad 발생을 억제하는 장점을 가지고 있다. 그러나 이러한 장점에도 불구하고 무전해 Ni층의 표면형상을 어떻게 제어 할지에 대한 연구는 충분히 이루어 지지 않고 있다. 본 연구에서는 Cu 하지층의 표면 형상이 무전해 Ni층의 표면 형상에 미치는 영향에 대하여 분석하였다. 이를 위해 Cu 에칭액과 Cu에칭 처리 횟수를 변화시켜 Cu 하지층의 표면 형상을 다양하게 변화시켰다.

• 대한치과교정학회지
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• 제35권1호
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• pp.43-50
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• 2005

본 연구는 교정용 브라켓 부착 시 사용되는 접착제 중 two paste type의 실런트 레진 적용이 법랑질 탈회에 미치는 영향을 알아보고자 시행되었다. 건전한 표면을 가진 발치된 소의 상악절치 48개를 실험재료로 하여 법랑질 처리 방법에 따라 4개 군으로 분류하고 각 군을 Phase II (Reliance, Itasca III)를 이용하여 치면처리 하였다. 대조군으로서 아무런 처리를 하지 않은 Group 1.37% 인산으로 30초간 산부식을 시행한 Group 2, 산부식 후 실런트 A와 B를 동량으로 혼합하여 도포한 Group 3과 산부식 후 실런트를 도포하고 레진 페이스트 A와 B를 동량으로 혼합하여 도포한 Group 4로 분류하여 각 군을 인공탈회용액에서 탈회시킨 다음 공초점 레이저 주사현미경을 이용하여 각각의 탈회된 깊이를 측정한 후 비교한 결과, 탈회된 법랑질의 평균 깊이는 $47.4{\mu}m$ (Group 1). $61.8{\mu}m$ (Group 2). $13.9{\mu}M$(Group 3) $8.2{\mu}n$ (Group 4) 로 나타났다. 산부식 후 인공탈회용액에 노출되는 군 (Group 2) 은 산부식 없이 노출도는 군 (Group 1) 센 비해 탈회된 깊이가 더 깊은 것으로 나타났으며 (p<0.05) 실런트 레진을 도포한 군 (Group 3: 은 산부식 없이 노출되는 군 (Group 1)이나 산부식 후 노출되는 군 (Group 2) 에 비해 탈회된 법랑질 깊이가 유의성 있게 감소하였다. (p<0.05). 접착레진으로 부착된 군 (Group 4)은 법랑질 탈회가 거의 나타나지 않았다. 이상의 연구결과는 교정치료 시 법랑질 탈회 가능성을 줄이기 위해서 브라켓 부착 시 실런트 레진의 도포가 유용함을 시사하였다.

• 한국재료학회지
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• 제10권5호
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• pp.375-381
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• 2000

전해콘텐서용 알루미늄박을 ammonium adipate 용액을 이용하여 $65^{\circ}C$에서 10분간 100V 및 140V로 각각 양극 산화시켜 산화 알루미늄 유전체를 만들었다. 유전층의 두께, 화학양론적 관계, 결정구조 등을 RBS 및 TEM을 이용하여 분석하였고, 알루미늄박의 에칭시 황산 첨가로 인한 표면적의 변화는 임피던스 분석법으로 조사 하였다. 생성된 유전피막은 100V 및 140V의 전압을 사용했을 경우 각각 약 130nm 및 190nm 두께의 비정질로 나타났으며 피막의 알루미늄과 산소원소의 화학양자론적 비는 약 2:3의 비율로 존재했다. 또한 유전피막은 전자빔은 조사에 의해 쉽게 $${\gamma}$-Al_2$$O_3$ 형태의 결정질로 변태 되었다. 염산 에칭욕에 황산 첨가시 나타나는 알루미늄박의 표면변화는 임피던스 분석결과와 정전 용략의 변화가 일치하는 경향을 나타냈다.

• 한국재료학회지
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• 제23권7호
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• pp.379-384
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• 2013

In order to produce size-controllable Ag nanoparticles and a nanomesh-patterned Si substrate, we introduce a rapid thermal annealing(RTA) method and a metal assisted chemical etching(MCE) process. Ag nanoparticles were self-organized from a thin Ag film on a Si substrate through the RTA process. The mean diameter of the nanoparticles was modulated by changing the thickness of the Ag film. Furthermore, we controlled the surface energy of the Si substrate by changing the Ar or $H_2$ ambient gas during the RTA process, and the modified surface energy was evaluated through water contact angle test. A smaller mean diameter of Ag nanoparticles was obtained under $H_2$ gas at RTA, compared to that under Ar, from the same thickness of Ag thin film. This result was observed by SEM and summarized by statistical analysis. The mechanism of this result was determined by the surface energy change caused by the chemical reaction between the Si substrate and $H_2$. The change of the surface energy affected on uniformity in the MCE process using Ag nanoparticles as catalyst. The nanoparticles formed under ambient Ar, having high surface energy, randomly moved in the lateral direction on the substrate even though the etching solution consisting of 10 % HF and 0.12 % $H_2O_2$ was cooled down to $-20^{\circ}C$ to minimize thermal energy, which could act as the driving force of movement. On the other hand, the nanoparticles thermally treated under ambient $H_2$ had low surface energy as the surface of the Si substrate reacted with $H_2$. That's why the Ag nanoparticles could keep their pattern and vertically etch the Si substrate during MCE.

• Journal of Periodontal and Implant Science
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• 제30권1호
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• pp.145-157
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• 2000

Cytotoxic substances in dental calculus and root cementum of periodontally diseased teeth inhibit new attachment and regeneration. The purpose of scaling and root planing is to remove pathologic structures harboring these cytotoxic substances in order to create a biologically acceptable root surface. However, these procedures inevitably leave a non-biocompatible smear layer. Conventionally, the smear layer has been removed with low pH etching agents such as citric acid, phosphoric acid and tetracycline hydrochloride(TC). Lately, a supersaturated neutral pH etching solution of ethylene diamine tetraacetic acid(EDTA) has been found to be as effective as low pH etchants with respect to smear removal and to be superior in exposing root surfaceassociated collagen. The aim of the present study was to determine the effect of root surface treatment using EDTA on the initial attachment of human gingival fibroblasts. 27 human teeth, extracted due to severe periodontitis, were cut into dentin slices after root planing. The specimens were divided into TC group(treated with $50㎎/m{\ell}$ tetracycline-HCl, pH 1.52), EDTA group(treated with 17% EDTA, pH 7.4), and non-treated control group. After sterilization, 5th subcultured human gingival fibroblasts were seeded in each culture well containing a prepared root slice and incubated for 15 min., 60 min., and 4 hours in 5% $CO_2$ incubator at $37^{\circ}C$. At each incubation time, the number of attached fibroblasts were counted on the microphotographs taken at a magnification of x100. The difference of the number of attached cells between groups was statistically analyzed by the ANOVA followed by Duncan test in SPSS/PC＋programs. The results were as follows : 1. After incubation for 15 min, the attached cells were significantly more in EDTA group and TC group than non-treated control group(p<0.05), but there was no significance in the difference between EDTA group and TC group(p>0.1). 2. After incubation for 60 min and 4 hours, there was no significant difference in the number of attached cells between all groups(p>0.1). 3. In both EDTA group and TC group, there was no significant difference in the number of attached cells between different incubation(p>0.1). But in control group, the number of attached cells was significantly increased after incubation for 60 min, compared with incubation for 15 min(p<0.05). The above results suggest that root surface treatment using EDTA could enhance the initial attachment of gingival fibroblasts to root surface as effective as tetracycline-HCl.

• 유기물자원화
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• 제31권1호
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• pp.5-14
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• 2023

연구에서는 실리카/티타니아 코어/쉘(STCS) 물질을 기반으로 환원 및 에칭을 통해 근적외선 반사율을 향상시킬 수 있는 라이다 반사형 중공구조 검은색(B-HST) 물질을 제조하였다. 또한, 에칭 폐액을 수거 및 재활용하여 합성한 실리카(e-SiO₂) 물질을 반도체 에폭시 몰딩 컴파운드용(EMC) 필러 소재로서 응용하였다. 상세히는, 연속적인 졸-겔법, 환원법 및 초음파법을 통해 제조한 B-HST 물질은 높은 NIR 반사율(31.1%)과 실제 검은색 페인트와 유사한 명도(L^*=13.2)를 나타내었으며, 이를 통해 성공적으로 라이다에 인식될 수 있는 소재가 제조되었음을 확인하였다. 추가적으로, B-HST 물질의 합성 과정에서 코어 실리카를 에칭하여 추출한 실라놀 전구체를 포함하는 에칭 폐액을 수거한 뒤, 졸-겔법을 통해 균일한 필러용 실리카로 합성하였으며, 에폭시 고분자 및 카본블랙과의 혼합을 통해 반도체 패키지용 소재인 EMC로 제조하였다. 실험으로 제조된 EMC는 상용화된 EMC 제품과 유사한 물리적-화학적 특성을 나타냄을 확인할 수 있었다. 본 연구 결과를 통해 물질의 합성과 효과적인 재활용법의 설계를 통하여 4차 산업시대에 부합하는 고부가 가치 소재들인 자율주행차 차량용 검은색 물질과 반도체용 EMC 물질들을 성공적으로 제조하고 미래 산업에서의 응용 가능성에 대해 제시하였다.