• Nuclear Engineering and Technology
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• 제37권4호
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• pp.395-400
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• 2005

An environmental radon monitoring system, comprising a radon-cup, an etching system, and a track counting system, was constructed. The radon cup is a cylindrical chamber with a radius of 2.2 cm and a height of 3.2 cm in combination with a CR-39 detector. Carbon is impregnated in the bodies of the detector chamber to avoid problem of an electrostatic charge. The optimized etching condition for the CR-39 exposed to a radon environment turned out to be a 6 N NaOH solution at 70^{\circ}$ over a 7hour period. The bulk etch rate under the optimized condition was $1.14{\pm}0.03\;{\mu}m\;h^{-1}$. The diameter of the tracks caused by radon and its progeny were found to be in the range of $10\~25\;{\mu}m$ under the optimized condition. The track images were observed with a track counting system, which consisted of an optical microscope, a color charged couple device (CCD) camera, and an image processor. The calibration factor of this system is obtained to be $0.105{\pm}0.006$ tracks $cm^2$ per Bq $m^{-3}$ d.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.165-165
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• 2000

Glass slides were chemically etched with sulfuric acid using five different methods. we investigated the effects of the chemical etching conditions on such properties as chemical composition, surface roughness, and the thermal stability of the glass. Sodium and carbon atoms in the surface of the glass are effectively eliminated by chemical etching with sulfuric acid. The glass slides were boiled for 30 min in 95% sulfuric acid and were depth profiled at room temperature with X-ray photoelectron spectroscopy (XPS), the Na ls signal was not detected in the detection limit of XPS. Surface morphology of the glass was very different depending on the concentration of sulfuric acid. The surface of the glass etched with 50% sulfuric acid was rougher than that of glass etched with 95% sulfuric acid. The sodium concentration of the glass boiled for 30 min in 95% sulfuric acid was nearly zero at the glass surface, and the sodium composition changed very little with annealing temperatures up to 35$0^{\circ}C$ in a vacuum environment. However the sulfur concentration at the glass surface due to the sulfuric acid increased with increasing temperature.

• 한국표면공학회지
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• 제42권1호
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• pp.53-57
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• 2009

Recovery of heavy-metallic component from a waste solution of factory was undertaken by the solar cell electricity. The solution was obtained from an electrolytic etching process of 316L stainless steel. The electrolysis of the solution for recovery of heavy metallic components was made with platinum plated titanium mesh anode and copper plate cathode. Analysis for the solution and electro-winned materials were made by EDS, XRD and SEM. Iron, chromium, and sulfur components were recovered on the cathode from the solution. Result of EDS analysis for the electro-winned materials revealed that some metal oxide were contained in the recovered material. The recovered materials were expected to have metallic form only by the electrolysis, but metal compounds were contained because of weak solar cell power. Nickel and manganese component in the solution doesn't recovered by this electrolysis process, but they made a sludge with phosphoric acid in the solution.

• 대한치과보철학회지
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• 제45권5호
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• pp.589-600
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• 2007

Statement of Problem: Titanium has many advantages of high biocompatibility, physical porperties, low-weight, low price and radiolucency, but it is incompatible with conventional dental porcelain due to titanium's oxidative nature. Many previous studies have shown that they used the method of sandblast surface treatment prior to porcelain application, the researchs are processing about the method of acid etching or surface coating. Purpose: The purpose of this research is to study the effect on bond strength between titanium and porcelain when using macro-surface treatment and micro-surface treatment and macro and micro surface treatment. Material and method: In this study, we evaluated the bond strength by using 3-point bending test based on ISO 9693 after classified 7 groups-group P : polished with #1200 grit SiC paper, group SS : sandblasted with $50{\mu}m$ aluminum oxides, group LS : sandblasted with $250{\mu}m$ alumium oxides, group HC : treated with 10% hydrochloric acid, group NF : treated with 17% solution of fluoric acid and nitric acid, group SHC : treated with 10% hydrochloric aicd after sandblsting with $50{\mu}m$ alumium oxides, group SNF treated with 17% solution of fluoric acid and nitric acid. Results : Within the confines of our research, the following results can be deduced. 1. Group SS which was sandblasted with $50{\mu}m$ aluminum oxides showed the highest bond strength of 61.74 MPa and significant differences(P<0.05). The bond strengths with porcelain in groups treated acid etching after sandblasting decreased more preferable than the group treated with sandblasting only. It gives significant differences(P<0.05). 2. After surface treatments, the group treated with sandblasting showed irregular aspect formed many undercuts, in the SEM photographs. The group treated with hydrochloric acid had the sharp serrated surfaces, the group treated with the solution of fluoric acid and nitric acid had the smooth surfaces, the group with sandblasting and hydrochloric acid had irrigular and porous structure, the group with sandblasting and the solution of fluoric acid and nitric acid had crater-like surfaces. But all of the groups treated with acid etching was not found and undercut. Conclusion: In above results, average surface roughness increase, bond strength also increase, but surface topographs influences more greatly on bond strengths.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.552-555
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• 2002

In order to achieve higher performance and low cost a-Si TFT-LCD panel, new material architecture and its process integration for a-Si TFT array manufacturing method were developed. Material combination of low resistant dry-etchable metal and new pixel electrode under currently adopted 4 mask process made it possible to get more-simplified manufacturing method and better device performance for the a-Si TFT-LCD application. Proposed 4 mask process architecture with optimized wet etchants and dry etching process was applicable to various devices such as notebook, monitor and TV.

• 공업화학
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• 제27권1호
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• pp.21-25
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• 2016

리드프레임에 구리합금소재를 사용할 경우 구리이외의 고농도의 철, 니켈, 아연 등이 포함되며 여기서 발생되는 에칭폐액은 지정폐기물로 지정되어 있다. 따라서 본 연구에서는 전기도금용 산화구리(II)를 제조하기 위해 고농도 중금속을 함유한 리드프레임 에칭폐액의 맞춤형 정제과정을 설계하였다. 리드프레임 에칭폐액의 경우 중금속 함유량이 높아 이온교환수지법 단독으로는 중금속을 제거하는데 한계가 있었다. 따라서 본 연구에서는 물에 대한 용해도차를 이용한 환원-산화법을 연계하여 염화구리(I)을 제조한 후 산화제인 과황산나트륨을 이용하여 염화구리(II)로 재회수하는 방법을 사용하였다. 최적 환원제로는 하이드라진을 선택하였고, 최적 첨가량은 구리 1.0 mol당 1.4 mol이다. 환원-산화법과 이온교환수지법을 연결하여 중금속을 제거할 경우 3회 반복 시 $Fe^{3+}$ (4.3 ppm), $Ni^{2+}$ (2.4 ppm), $Zn^{2+}$ (0.78 ppm)로 전기도금용 산화구리(II) 제조용 원료로 사용이 가능할 것으로 사료된다.

• 한국염색가공학회지
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• 제22권2호
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• pp.123-131
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• 2010

Shape and size controlled synthesis of gold particles has been studied by using wet-chemical method. When ${AuCl_4}^-$ in aqueous $HAuCl_4$ precursor was reduced using $Na_2SO_3$ as a reducing agent, mixtures of spherical, triangular and hexagonal particles were prepared in a few minutes. It was found that the shape selective oxidative etching by ${AuCl_4}^-\;+\;Cl^-$ anions and crystal growth took place simultaneously. As the ${AuCl_4}^-$ and $Cl^-$ concentration increased, yields of large triangular and hexagonal plate type particles increased, while the spherical particles decreased in most cases. Possible etching and growth mechanisms are discussed.

• 한국재료학회지
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• 제11권11호
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• pp.923-928
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• 2001

An electrolytic silver plating process has been successfully developed for terminated electrode parts of dielectric ceramic resonator. High adhesion strength and high Qu is obtained and blister occurance is minimized under plating condition with $HNO_3$750 $m\ell/\ell$ and HF $ 250m\ell/\ell$ solution at $25^{\circ}C$ for 20 minutes. Adhesion strength has the highest value, 3.2 kg/mm$^2$ at etching temperature of $25^{\circ}C$. Adhesion strength, Qu and blister occurance are monotonically increased with the thickness of electrodeposition layer. In case of electrodeposition of Ag, Qu value of 380 has obtained higher than in case of electrolytic Cu plating with Qu value of 325. Therefore, terminated electrode parts of dielectric ceramic resonator reducing dielectric loss can be obtained using prensent process.

• 한국정밀공학회지
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• 제31권1호
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• pp.75-81
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• 2014

Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1529_1530
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• 2009

The process conditions for fabricating p-type silicon pillars were optimized by controlling current density, bath temperature. To get best process flexibility for pillar arrays formation, three factors affecting pillar formation were changed. First, the solution bath was designed to keep constant temperature during the experiment irrespective of external temperature. Second, the counter Pt electrode was changed from rod type to mesh to obtain uniform distribution of current density. Third, Cr-Cu alloy electrode instead of Cu was used to increase electrode current density.