• Title/Summary/Keyword: etched surface

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Removal torque of sandblasted large grit, acid etched treated mini-implant (Sandblasted large grit, acid etched 표면처리에 따른 교정용 미니 임플랜트의 제거회전력에 관한 연구)

  • Oh, Nam-Hee;Kim, Seong-Hun;Kook, Yoon-Ah;Lee, Keun-Hye;Kang, Yoon-Goo;Mo, Sung-Seo
    • The korean journal of orthodontics
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    • v.36 no.5
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    • pp.324-330
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    • 2006
  • Objective: The purposes of this study were to evaluate the differences between sand blasted, large grit and acid-etched (SLA) treated mini-implants and smooth surface orthodontic mini-implants in relation to the removal torque as well as the histologic analysis. Methods: Custom-made, screw-shaped, titanium implants with a length of 9.5 mm and an outer diameter of 1.8 mm were divided into 2 groups; the SLA group (20 SLA treated orthodontic mini-implants) and the smooth surface group (20 smooth surface mini-implants), and placed In the tibia metaphysis of 10 rabbits. Each rabbit had 4 mini-implants placed, 2 in each tibia. The right tibia were implanted with the SLA group mini-implants and the left tibia had the smooth group mini-implants placed. Each mini-implant group were immediately applied with a continuous traction force of 150 g using a Ni-Ti coil spring. The rabbits were sacrificed 6 weeks post-surgically. Subsequently, the legs were stabilized, the Ni-Ti coil springs were removed and the mini-implants were removed under reverse torque rotation with a digital torque gauge. Results: 6 weeks after placement, the SIA group presented a higher mean removal torque value (8.29 Ncm) than the smooth group (3.34 Ncm) and histologic analysis revealed a higher new bone formation aspect along the screw in the SLA group. Conclusion: Results of this study indicates that SLA treated mini-implants may endure higher orthodontic forces without loosening.

EFFECTS OF VARIOUS ETCHING TIMES ON DEPTH OF ETCH AND SHEAR BOND STRENGTH OF AN ORTHODONTIC RESIN TO BOVINE ENAMEL (부식시간이 소의 법랑질 부식깊이와 교정용 레진의 전단결합강도에 미치는 영향)

  • Kim, Jeong-Hoon;Lee, Ki-Soo;Park, Young-Guk
    • The korean journal of orthodontics
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    • v.23 no.1 s.40
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    • pp.75-88
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    • 1993
  • Recent reports indicate that shorter etching times than 60 seconds can be adopted without affecting the bond strength and clinical disadvantages. The purpose of this in vitro study was to compare the shear bone strength and to measure depth of etch at different etching time length. One hundred and eight extracted bovine lower central incisors were embedded each in a tooth cup with cold-cure acrylic resin. The facial surfaces of the teeth were ground wet with 600-, 800-, 1000-, and 1200-grit Sic papers, and finally polished with a water slurry of extrafine silicon carbide powder, washed with tap water, and dried with hot air. Nine groups of nine prepared teeth were etched with a commercial($38\%$ phosphoric acid solution) for 0, 5, 10, 15, 20, 30, 60, 90, and 120 seconds, respectively, rinsed with tap water, and dried with hot air. One conditioned teeth from every group was selected randomly for the scanning electron microscopic examination, and the remaining eight teeth of the groups were used for measuring the push shear bond strength after bonding brackets and immensing them in the $36.5^{\circ}C$ water for 24 hours. Another nine groups of three teeth were used for measuring the depth of etch and surface roughness with a surface profilometer. after pieces of adhesive tape of 3mm inner diameter positioned on the ground enamel surfaces, and etched with the above mentioned. The data obtained form the above expeiments were analysed statistically with one way ANOVA and Dunkan's multiple range test with the $95\%$ confidence level. The results and conclusion of the study were as follows; 1. The results of shear bond strength for the given experimental etching times were not statistically different, but showed the tendency of decreasing shear bone strength after over 60 seconds etching times. 2. On the scanning election microscopic examination, it was observed that the morphological patterns of etched enamel surface for 5 to 20 seconds were similar and consitent, and those for 30 to 120 seconds showed increasing over-etched patterns depending on the length of etching times. 3. The depth of etch was increased almost proportionally by the length of etching times, but it was not associated with the shear bond strength. 4. The surface roughness increased depending on the length of etching times, but it was not associated with the shear bond strength. 5. This experiment indicated that proper etching time with $38\%$ phosphoric acid solution is in the range of 5 to 30 seconds.

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SHEAR BOND STRENGTHS OF COMPOSITE RESIN TO PORCELAINS AMONG PORCELAIN REPAIR SYSTEMS (도재 수리시스템에 따른 도재와 복합레진의 전단결합강도)

  • Kim, Kyoung-Kyu;Shin, Sang-Wan;Lee, Jeong-Yeol;Kim, Young-Su
    • The Journal of Korean Academy of Prosthodontics
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    • v.45 no.4
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    • pp.419-430
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    • 2007
  • Purpose: This in vitro study evaluated shear bond strengths of surface treatment porcelains with four porcelain repair systems simulating intraoral bonding of composite resin to feldspathic porcelain or pressable porcelain. Material and methods: Eighty Porcelain disks were prepared. Group A: forty disk specimens were fabricated with Feldspathic Porcelain($Omega^{(R)}900$, Vident, Menlo Park, CA, USA). Group B: forty disk specimens were fabricated with Pressable Porcelain(IPS Empress 2 ingot, Ivoclar-Vivadent, Schaan, Liechtenstein, Germany). Each groups was divided into 4 subgroups and composite resin cylinders were bonded to specimen with one of the following four systems: Clearfil Porcelain Bond(L. Morita, Tustin, CA, USA), Ulradent Porcelain Etch. (Ultradent, Salt Lake City UT, USA), Porcelain Liner-M(Sun Medical Co., Kyoto, Japan), Cimara Kit(Voco, Germany). After surface conditioning with one of the four porcelain repair systems substrate surfaces of the specimen were examined microscopically(SEM). Shear bond strengths of specimens for each subgroup were determined with a universal testing machine (5mm/min crosshead speed) after storing them in distilled water at $37{\pm}1^{\circ}C$ for 24 hours. Stress at failure was measured in $MP_a$, and mode of failure was recorded. Differences among four repair systems were analyzed with two way ANOVA and Duncan test at the 95% significance level. Results: In the scanning electron photomicrograph of the treated porcelain surface, hydrofluoric acid etched group appeared the highest roughness. The shear bond strength of the phosphoric acid etched group was not significantly(p>0.05) different between feldspathic porcelain and pressable porcelain. But in no treatment and roughened with a bur group, the shear bond strength of the feldspathic porcelain was significantly higher than that of the pressable porcelain. In hydrofluoric acid etched group, the shear bond strength of the pressable porcelain was significantly higher(p<0.05). Conclusion: 1. Treatment groups showed significantly greater shear bond strengths than no treatment group(p<0.05). 2. Group with more roughened porcelain surface did not always show higher shear bond strengths. 3. In phosphoric acid etched group, there was no significant difference in shear bond strength between feldspathic porcelain and pressable porcelain(p>0.05). However in the other groups, there were significant differences in shear bond strengths between feldspathic porcelain and pressable porcelain(p<0.05).

Acid etching of glass-infiltrated zirconia and its biological response

  • Vu, Van Thi;Oh, Gye-Jeong;Yun, Kwi-Dug;Lim, Hyun-Pil;Kim, Ji-Won;Nguyen, Thao Phuong Thi;Park, Sang-Won
    • The Journal of Advanced Prosthodontics
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    • v.9 no.2
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    • pp.104-109
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    • 2017
  • PURPOSE. The purpose of this study was to evaluate the influence of acid etching treatment on surface characteristics and biological response of glass-infiltrated zirconia. MATERIALS AND METHODS. A hundred zirconia specimens were divided into four groups depending on surface treatments: untreated zirconia (group Z); acid-etched zirconia (group ZE); glass-infiltrated zirconia (group ZG); and glass-infiltrated and acid-etched zirconia (group ZGE). Surface roughness, surface topography, surface morphology, and Vickers hardness of specimens were evaluated. For biological response test, MC3T3-E1 cell attachment and proliferation on surface of the specimens were examined. The data were statistically analyzed using one-way ANOVA and Tukey's HSD test at a significance level of 0.05. RESULTS. Group ZGE showed the highest surface roughness ($Ra=1.54{\mu}m$) compared with other groups (P < .05). Meanwhile, the hardness of group Z was significantly higher than those of other groups (P < .05). Cell attachment and cell proliferation were significantly higher in group ZGE (P < .05). CONCLUSION. We concluded that effective surface roughness on zirconia could be made by acid etching treatment after glass infiltration. This surface showed significantly enhanced osteoblast cell response.

Comparison of shear, tensile and shear/tensile combined bonding strengths in bracket base configurations (브라켓 기저부 형태에 따른 전단, 인장, 전단/인장복합결합강도의 비교)

  • Lee, Choon-Bong;Lee, Seong-Ho;Kim, Jong-Ghee
    • The korean journal of orthodontics
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    • v.29 no.5 s.76
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    • pp.599-611
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    • 1999
  • The purpose of this study was to evaluate shear, tensile and shear/tensile combined bond strengths(SBS, TBS, S/TBS) in various orthodontic brackets bonded to human teeth with chemically cured adhesive (Ortho-one, Bisco, USA). Five types of metal brackets with various bracket base configurations (Micro-Loc base(Tomy, Japan), Chessboard base(Daesung, Korea), Non-Etched Foil Mesh base(Dentarum, Germany), Micro-Etched Foil Mesh base(Ortho Organiners, USA), Integral base(Unitek, USA)) were used in this study. Shear, tensile and shear/tensile combined bond strengths according to the direction of force were measured by universal testing machine. The bracket base surface after bond strength test were examined by stereoscope and scanning electron microscope. The assessment of resin remnant on bracket base surface was carried out by ARI(adhesive remnant index). The results obtained were summarized as follows, 1. In all brackets, SBS was in the greatest value(p<0.05), TBS was in 50% level and S/TBS was in 30% level of SBS. 2. In bond strength, Micro-Loc base bracket showed the maximum bond strength($SBS:22.86{\pm}1.37kgf,\;TBS:11.37{\pm}0.42kgf,\;S/TBS:6.69{\pm}0.34kgf$) and Integral base bracket showed the minimum bond strength($SBS:10.52{\pm}1.27kgf,\;TBS:4.27{\pm}1.08kgf,\;S/TBS:2.94{\pm}0.58kgf) (p<0.05). 3. In bond strength per unit area, Integral base bracket showed the minimum value, Micro-Loc base and Chessboard base brackets were in similar value(p>0.05). Non-Etched Foil Mesh base and Micro-Etched Foil Mesh base bracket were similar in SBS and TBS(p>0.05), but Micro-Etched Foil Mesh base bracket was greater than Non-Etched Foil Mesh base bracket in S/TBS(p<0.05). 4. Bond failure sites were mainly between bracket base and adhesive, therefore ARI scores were low.

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The Study of Silica Surface Reaction with Fluorocarbon Plasma Using Inductively Coupled Plasma (Inductively Coupled Plasma에 의한 fluorocarbon 가스 플라즈마의 실리카 표면 반응 연구)

  • Park, Sang-Ho;Shin, Jang-Uk;Jung, Myung-Young;Choy, Tae-Goo;Kwon, Kwang-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.6
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    • pp.472-476
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    • 1998
  • The surface reactions of silica film($SiO_2-P_2O_5-B_2O_3-GeO_2$) with fluorocarbon plasma has been studied by using angle -resolved x-ray photoelectron spectroscopy(XPS). It has been confirmed that residual carbon consists of C-C and C-CFx bonds and fluorine mainly binds silicon in the case of etched silica by using $CF_4$ gas plasma. The surface reaction of silica with various fluorocarbon gases, such as $CF_4,C_2F_6 and CHF_3$ were investigated. XPS results showed that though the etching gases were changed, the elements and binding states of the residual layers on the etched silica by using various fluorocarbon gas plasma were nearly the same . This seems to be due to the high volatility of byproducts, that is, $SiF_4 and CO_2$ etc..

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Etch characteristics of ITO(Indium Tin Oxide ) using inductively coupled Ar/$CH_4$ plasmas (유도결합형 Ar/$CH_4$ 플라즈마를 이용한 ITO의 식각특성에 관한 연구)

  • 박준용;김현수;권광호;김곤호;염근영
    • Journal of the Korean Vacuum Society
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    • v.8 no.4B
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    • pp.565-571
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    • 1999
  • In this study, high-density plasma etching characteristics of ITO(indium tin oxide) films used for transparent electrode in dispaly devices were investigated. Plasma diagnostic and surface analysis tools were used to understand etch reaction mechanism. The etch rate of ITO was increased by the increase of reactive radicals such as H and $CH_3$ with the addition of moderate amount of $CH_4$ to Ar. However, the addition of excess amount of $CH_4$ decreased possibly due to the increased polymer formation on the ITO surface being etched. The increase of source power and bias boltage increased ITO etch rates but it decreased selectivities over under-layers $(SiO_2, Si_3N_4)$. The increase of working pressure up to 20mTorr also increased ITO etch rates, however the further increased of the pressure decreased ITO etch rates. From the analysis of XPS, a peak related to the polymer of hydrocarbon was observed on the etched ITO surface especially for high $CH_4$ conditions and it appears to affect ITO etch rates.

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Dissolution Phenomenon in BaO-B2O3-ZnO Glass System by Acid Etching (산 에칭에 의한 BaO-B2O3-ZnO계 유리조성물의 용출 현상)

  • Kim, Jae-Myung;Hong, Kyung-Jun;Kim, Nam-Suk;Kim, Hyung-Sun
    • Journal of the Korean Ceramic Society
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    • v.43 no.1 s.284
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    • pp.33-37
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    • 2006
  • For producing the fine ribs structure of plasma display panel, the metal ions of barrier materials during the etching process should be understood on the etching mechanism with etching conditions. Etching was done on bulk glasses of the $BaO_B_2O_3-ZnO$ system with $HNO_3$ solution at $40^{\circ}C$. The surface structure of glasses and ion dissolution were analyzed by ICP (Inductive Coupled Plasma measurement). The structure and surface of the etched bulk glass were investigated by using scanning electron microscopy and nanoindenter. As a result, Ba (3-35 ppm/min) and Zn (2-27 ppm/min) ions as major components were leached in the solution and the leached layers were found to be phosphor-rich surface layers. A decrease of the bridge oxygen and relative increase of non bridge oxygen in the etched glass were found by X-ray photoelectron spectroscopy.

A Study on the Fabrication Method of Mold for 7 inch LCD-BLU by continuous microlens 200μm (연속마이크로렌즈 200μm 적용 7인치 LCD-BLU 금형개발)

  • Kim, J.S.;Ko, Y.B.;Min, I.K.;Yu, J.W.;Heo, Y.M.;Yoon, K.H.;Hwang, C.J.
    • Transactions of Materials Processing
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    • v.16 no.1 s.91
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    • pp.42-47
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    • 2007
  • LCD-BLU is one of kernel parts of LCD and it consists of several optical sheets: LGP, light source and mold frame. The LGP of LCD-BLU is usually manufactured by etching process and forming numerous dots with $50\sim300{\mu}m$ diameter on the surface. But the surface of the etched dots of LGP is very rough due to the characteristics of the etching process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. In order to overcome the limit of current etched dot patterned LGP, optical pattern with continuous microlens was designed using optical simulation CAE. Also, a mold with continuous micro-lens was fabricated by UV-LiGA reflow process and applied to 7 inch size of navigator LCD-BLU in the present study.

CHARACTERISITCS OF CHLORINE IND DUCTIVELY COUPLED PLASMAS AND THEIR SILICON ETCH PROPERTIES

  • Lee, Young-Jun;Kim, Hyeon-Soo;Yeom, Geun-Young;Oho, Kyung-Hee
    • Journal of the Korean institute of surface engineering
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    • v.29 no.6
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    • pp.816-823
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    • 1996
  • Chlorine containing high density plasmas are widely used to etch various materials in the microelectronic device fabrication. In this study, the characteristics of inductively coupled $Cl_2(O_2/N_2$) plasmas and their effects on the formation of silicon etching have been investigated using a Langmuir probe, quadrupole mass spectrometry(QMS), X-ray photoelectron spectroscopy(XPS), and Scanning Electron Microscopy(SEM). The addition of oxygen for chlorine plasmas reduced ion current densities and chlorine radical densities compared to the nitrogen addition by the recombination of oxygen with chlorine. Also, when silicon is etched in $Cl_2/O_2$ plasmas, etch products recombined with oxygen such as $SiCl_xO_y$ emerged. However, when nitrogen is added to chlorine, etch products recombined with nitrogen or Si-N bondings on the etched silicon surface were not found. All the silicon etch characteristics were dependent on the plasma conditions such as ion density, radical density, etc. As a result sub micron vertical silicon trench etch profiles could be effectively formed using optimized etch conditions for $Cl_2/O_2\; and \;Cl_2/N_2$ gas combinations.

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