• Korean Journal of Materials Research
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• v.29 no.11
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• pp.670-676
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• 2019

We study substrate support structures and materials to improve uptime and shorten preventive maintenance cycles for chemical vapor deposition equipment. In order to improve the rolling of the substrate support, the bushing device adopts a ball transfer method in which a large ball and a small ball are mixed. When the main transfer ball of the bushing part of the substrate support contacts the substrate support, the small ball also rotates simultaneously with the rotation of the main ball, minimizing the resistance that can be generated during the vertical movement of the substrate support. As a result of the improvement, the glass substrate breakage rate is reduced by more than 90 ~ 95 %, and the equipment preventive maintenance and board support replacement cycles are extended four times or more, from once a month to more than four months, and the equipment uptime is at least 15 % improved. This study proposes an optimization method for substrate support structure and material improvement of chemical vapor deposition equipment.

• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.100-105
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• 2020

Recently, as display and semiconductor devices have been miniaturized and highly integrated, there is a demand for optimization of the structural characteristics of the thin film accordingly. The sputtering device has the advantage of stably obtaining a desired thin film depending on the material selected for the target. However, due to the structural characteristics of the sputtering equipment, the structural characteristics of the film may be different depending on the incidence angle of the sputtering target material to the substrate. In this study, the characteristics of the thin film material according to the scattering angle of the target material and the incidence position of the substrate were studied to find the optimization design rule of the sputtering equipment. To this end, a Si thin film of 1 ㎛ or less was deposited on the Si(100) substrate, and then the microstructure, reflectance, surface roughness, and thin film crystallinity of the thin film formed for each substrate location were investigated. As a result of the study, it was found that as the sputter scattering angle increased and the substrate incident angle decreased, the gap energy along with the surface structure of the thin film increased from 1.47 eV to 1.63 eV, gradually changing to a non-conductive tendency.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.11-15
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• 2006

Expose equipment system that is used for manufacturing process of Flat Panel Display, is most important equipment in whole process. Expose equipment that is for making pattern of mask on substrate, consists of optical part, stage part and transport part. The stage is an important part that aligns mask and substrate for delivering pattern of mask to substrate exactly. In this paper, control system of expose stage that is able to use mask and substrate of diverse size, with PC controller using GUI interface instead of PLC control system. The existing PLC control system does not have the suitable structure for using mask of diverse size. GUI interface integration control system is based on PC. So it has the advantage of convenient use and active operation. We embodied PLC control system in integration control system based on PC, and verified utility possibility through the standard test course.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.7-10
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• 2007

In an effort to reduce weaknesses of existing laser displacement sensor-based system, a sensing device for distance and balance of mask-substrate gap using touch-type displacement sensor was suggested. The device suggested in this study is expected to solve the problems of prices and reflections, by means of a touch-type sensor. LCD exposure equipment stage system including suggested sensing device was realized to assess the characteristics of sensing the balance and gap between mask and substrate. It was verified that a touch-type displacement sensor-based device to adjust the balance and distance of mask-substrate gap suggested in this study can be applicable to LCD expose equipment in practice.

• Proceedings of the KWS Conference
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• 1996.10a
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• pp.186-190
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• 1996

Laser cladding is a technique for modification on surface in materials. This study describes a laser cladding equipment design and the results of laser cladding nickel on rolled steel for general structure. The laser clsdding equipment designed to consider continuous supply, a fixed quantity. The material used MC plastic. Laser cladding condition is found out by processing parameters. The experiment advanced to suppy substrate with powder. The substrate is rolled steel for general structure(KS D 3503) and powder is using the nickel powder for the corrosion resitance, wear resistance and surface hardness of materials. When the substrate travel on X-Y table, laser beam irradiates to prevent from oxidize with shielding gas on it. The obtained specimens measure the victors hardness test. For the research laser cladding results make a comparative study the microstructure.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.193-201
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• 2011

Clamp type transferring mechanism for package substrate's wet processes was newly developed instead of conventional roller type transferring mechanism. Clamp type transferring mechanism has the advantages of reducing the panel deflection and of minimizing the contact problem between the panel and the transferring mechanism. Individual clamp of the mechanism has two distinct mechanical functions which are perfectly fixing a panel during the transferring and generating adequate tension for the panel. To determine the mechanical parameters of the clamp, panel deflection simulation was conducted and the result was verified by the panel deflection measurement. Also, fixing angle of a clamp could be determined by the free body force analysis of individual clamp. Finally clamp type transferring mechanism was actually manufactured and the transferring performance was verified during the water spraying condition of the package substrate's wet processes.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.113-118
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• 2011

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.133-136
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• 2002

It is very important to get a stable and large-capacity organic effusion source for achievement of OLED mass-production equipment. We present an organic effusion source with film uniformity less than ${\pm}$ 5%, the material charge volume, 300cc for $400{\times}400\;mm^2$ substrate. The fine metal shadow mask alignment technology, one of the color forming technique, also have to support more accurate and fast operating in mass-production. In this paper, we will describe the OLED mass-production equipment with the large volume effusion source and the precision shadow mask alignment technique.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.81-85
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• 2022

Mist-CVD is known to have advantages of low cost and high productivity method since the precursor solution is misting with an ultrasonic generator and reacted on the substrate under vacuum-free conditions of atmospheric pressure. However, since the deposition distribution is not uniform, various efforts have been made to derive optimal conditions by changing the angle of the substrate and the position of the outlet to improve the result of the preceding study. Therefore, in this study, a deposition distribution uniformity model was derived through the shape and position of the substrate support and the conditions of inlet flow rate using the particle tracking method of computational fluid dynamics (CFD). The results of analysis were compared with the previous studies through experiment. It was confirmed that the rate of deposition area was improved from 38.7% to 100%, and the rate of deposition uniformity was 79.07% which was higher than the predicted result of simulation. Particle tracking method can reduce trial and error in experiments and can be considered as a reliable prediction method.