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Development of Clamp Type Transferring Mechanism for Package Substrate's Wet Process  

Ryu, Sun-Joong (Equipment Development Group, Samsung Electro-Mechanics Co. LTD.)
Heo, Jun-Yeon (Equipment Development Group, Samsung Electro-Mechanics Co. LTD.)
Cho, Seung-Hyun (Dept. of Mechanical Engineering, Dongyang Mirae University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.28, no.2, 2011 , pp. 193-201 More about this Journal
Abstract
Clamp type transferring mechanism for package substrate's wet processes was newly developed instead of conventional roller type transferring mechanism. Clamp type transferring mechanism has the advantages of reducing the panel deflection and of minimizing the contact problem between the panel and the transferring mechanism. Individual clamp of the mechanism has two distinct mechanical functions which are perfectly fixing a panel during the transferring and generating adequate tension for the panel. To determine the mechanical parameters of the clamp, panel deflection simulation was conducted and the result was verified by the panel deflection measurement. Also, fixing angle of a clamp could be determined by the free body force analysis of individual clamp. Finally clamp type transferring mechanism was actually manufactured and the transferring performance was verified during the water spraying condition of the package substrate's wet processes.
Keywords
Package Substrate; Wet Process; Transferring Roller; Clamp; Tension; CCI; Deflection; Flip Chip; Spray; Nozzle;
Citations & Related Records
Times Cited By KSCI : 6  (Citation Analysis)
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