• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.38-42
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• 2003

The use of VPI impregnated mica tape as high voltage insulation for large rotating electric machines requires a careful balance of processes and materials to obtain the desired electrical, mechanical and thermal characteristics. The stator insulation systems such as epoxy bonded high voltage mica tape have been produced for many years. One such system employing an epoxy and anhydride impregnating resin developed by Hyundai Heavy Industries, Co. (hereafter, HHI), to satisfy customer requests for an epoxy bonded insulation system. HHI applies the following electrical and thermal evaluations such as dielectric breakdown, voltage endurance, dissipation factor vs. temperature, isothermal weight loss, and so on. A detailed laboratory evaluation can describe specific physical limitations for an insulation system and permit development of long-term operation guidelines that permit full utilization of the proposed system. HHI has found these evaluations very helpful in qualifying insulation system for the repair of both large motors and generators.

• Journal of Adhesion and Interface
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• v.25 no.1
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• pp.162-168
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• 2024

The effect of maleinized polybutadiene (MPB) on the mechanical properties of epoxy resins including adhesion strength, elongation and impact peel resistance was investigated in this study, in which MPB is an anhydride-functionalized polybutadiene prepolymer. Different molecular weights (3.1K and 5.6K) of MPB were added to diglycidyl ether bisphenol-A (DEGBA), an epoxy resin, to increase its impact peel strength and elongation. At various loading percent (5, 10, 15, 20 and 25 wt%) of MPB in the epoxy resin, significant improvements of mechanical properties were observed. According to the comparative analysis results, the modified epoxy system with 15 wt% (3.1K) MPB exhibited the highest lap shear strength, about 40% higher than that of neat epoxy. The tensile strength and elongation steadily and simultaneously increased as the loading percent of MPB increased. The impact peel strengths at low (-40℃) and room (23℃) temperatures were substantially improved by MPB incorporation into epoxy resins. Reactive and flexible MPB prepolymer seems to construct strong nano-structured networks with rigid epoxy backbones without sacrificing the tensile and adhesion strengths while increasing impact resistance/toughness and elongation properties. For higher impact peel while maintaining adhesion and tensile strengths, approximately 10-15 wt% MPB loading in epoxy resin was suggested. Consequently, incorporation of functionalized MPB prepolymer into epoxy system is an easy and efficient way for improving some crucial mechanical properties of epoxy resins.

• Transactions on Electrical and Electronic Materials
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• v.16 no.2
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• pp.74-77
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• 2015

The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. A cycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was 88.9 kJ/mol and pre-exponential factor was 2.64×10¹² min⁻¹, while the activation energy and pre-exponential factor for epoxy/silica composite were 97.4 kJ/mol and 9.21×10¹² min⁻¹, respectively. These values showed that the silica particles have effects on the cure kinetics of the neat epoxy matrix.

• Polymer(Korea)
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• v.24 no.1
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• pp.65-71
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• 2000

The latent properties and cure kinetics of an acid anhydride-cured epoxy resin have been investigated by a near-infrared (NIR) reflection spectroscopy. The assignments of the latent properties and cure behaviors were performed by the measurements of the NIR reflectance for epoxide and hydroxyl groups at different temperatures. A comprehensive analysis of the origin, location, and shifts during reaction of all major NIR absorption peaks in the spectral range from 4000 to 7100 $cm^{-1}$ / was provided. The extent of reaction was determined from NIR absorption band at the 4530 $cm^{-1}$ / depending on epoxide concentration and cure temperature.

• Proceedings of the Korean Fiber Society Conference
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• 1994.10a
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• pp.130-130
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• 1994

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.21-27
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• 2000

To develop the underfill materials which are required for the new process of semi-conductor industry, the properties of epoxy/anhydride/cobalt(II) catalyst system with two types of fused silica(1 $\mu\textrm{m}$, 8 $\mu\textrm{m}$) are studied as a function of filler fraction. According to the curing profile, the optimum catalyst amount was 1.0 wt% for full curing at the conditions of $160^{\circ}C$/l5 min., and we could conclude that the viscosity has superior effect on the real flaw through the relationship between surface tension and viscosity data. The underfills which were filled with 1 $\mu\textrm{m}$ fused silica did not show good flowability, but they should be useful by improving the viscosity for a future process which has small gaps. The underfills which were filled with 8 $\mu\textrm{m}$ fused silica showed good flowability when the filler contents were 55~60 vol%. The model which was referred by Matthew can predict the real flow length only when the underfill has high viscosity and low surface tension.

• Polymer(Korea)
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• v.33 no.6
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• pp.530-536
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• 2009

A cycloaliphatic epoxy/acidic anhydride system incorporating short carbon fibers (SCF) and short glass fibers (SGF) was fabricated and thermal/mechanical properties were characterized. At low filler content both SCF- and SGF-reinforced composites showed a similar decrease in coefficient of thermal expansion (CTE), measured by a thermomechanical analyzer, with increasing loadings, above which SCF became more effective than SGF at reducing the CTE. Experimental CTE data for the SCF-reinforced composites is best described by the rule of mixtures at lower SCF contents and by the Craft-Christensen model at higher SCF contents. Storage modulus (E') at $30^{\circ}C$ and $180^{\circ}C$ was greatly enhanced for short fiber-filled composites compared to unfilled specimens, Scanning electron microscopy of the fracture surfaces indicated that the decreased CTE and the increased E' of the short fiber-reinforced composites resulted from good interfacial adhesion between the fibers and epoxy matrix.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.118-121
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• 2001

The investigation of cure kinetics and morphology studies on DGEBA/PEI/Anhydride system were performed by differential scanning calorimetry and scanning electron microscopy. Autocatalystic kinetics model was applied by isothermal scan test. Ozawa method and Kissinger method was applied by temperature scan. Activation energy was 95kJ/mol for neat DGEBA/NMA, 120kJ/mol for DGEBA/PEI(10p.h.r.)/NMA. The generation of secondary phase of PEI was observed and its size was grown up by increasing contents of PEI.

• Elastomers and Composites
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• v.38 no.3
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• pp.213-226
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• 2003

The cure and rheological behavior of diglycidyl ether of bisphenol F/nadic methyl anhydride resin system with the kinds of imidazole were studied using a differential scanning calorimeter (DSC) and a rotational rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/ anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at $20{\sim}40 %$ of the reaction. The rate constants ($k_1,\;k_2$) showed temperature dependance, but reaction order did not. The reaction order (m+n) was calculated to be close to 3. There are two reaction mechanisms with the kinds oi catalyst. The gel time was determined by using G'-G" crossover method, and the activation energy was obtained from this results. From measurement of rheological properties it was found that the logarithmic 1:elation time of fused silica filled DBEBF epoxy compounds linearly increased with the content of filler and decreased with temperature. The highly filled epoxy compounds showed typical pseudoplastic behavior, and the viscosity of those decreased with increasing maximum packing ratio.

• Journal of Welding and Joining
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• v.29 no.4
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• pp.54-60
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• 2011

Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.