• Bulletin of the Korean Chemical Society
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• v.33 no.11
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• pp.3589-3592
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• 2012

Carbon composite bipolar plates with various carbon black contents were prepared by a compression molding method. The electrical conductivity and electrochemical stability of the bipolar plates have been evaluated. It is found that the electrical conductivity increases with increasing carbon black contents up to 15 wt %. When the carbon black contents are greater than 15 wt %, the electrical conductivity decreases because of a poor compatibility between epoxy resin and carbon black, and a weakening of compaction in the carbon composite bipolar plate. Based on the results, it could be concluded that there are optimum carbon black contents when preparing the carbon composite bipolar plate. Corrosion tests show that the carbon composite bipolar plate with 15 wt % carbon black exhibits better electrochemical stability than a graphite bipolar plate under a highly acidic condition. When the optimized carbon composite bipolar plate is applied to vanadium redox flow cells, the performance of flow cells with the carbon composite bipolar plate is comparable to that of flow cells with the graphite bipolar plate.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.41-48
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• 1999

Silica is the most popular materials as a filler of EMC for microelectronic packaging. However, because of its low thermal conductivity, the use of silica is restricted to parts requiring high thermal dissipation. The superior fluidity of EMC can be achieved with a combination of filler size distribution. In this study, physical properties of EMC filled with the crystalline silica(13$\mu\textrm{m}$) which have high fluidity and low cost and the AlN(2 $\mu\textrm{m}$) which have high thermal conductivity and low coefficient of thermal expansion were evaluated by changing the AlN/silica ratios. As a result of the evaluation of physical properties of EMC, the optimum mixing ratio of AlN/crystalline silica was 0.3/0.7. In this condition, binary mixture(AlN/crystalline silica) filled EMC showed superior properties, i.e., in the thermal conductivity, CTE, dielectric constant, flexural strength, and thermal shock resistance without reduction of fluidity.

• Composites Research
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• v.34 no.1
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• pp.47-50
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• 2021

In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

• Composites Research
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• v.19 no.2
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• pp.7-12
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• 2006

Graphite particle/carbon fiber hybrid conductive polymer composites were fabricated by the compression molding technique. Graphite particles were mixed with an epoxy resin to impart the electrical conductivity in the composite materials. In this study, graphite reinforced conductive polymer composites with high filler loadings were manufactured to accomplish high electrical conductivity above 100S/cm. Graphite particles were the main filler to increase the electrical conductivity of composites by direct contact between graphite particles. While high filler loadings are needed to attain good electrical conductivity, the composites becomes brittle. So carbon fiber was added to compensate weakened mechanical property. With increasing the carbon fiber loading ratio, the electrical conductivity gradually decreased because non-conducting regions were generated in the carbon fiber cluster among carbon fibers, while the flexural strength increased. In the case of carbon fiber 20wt.% of the total system, the electrical conductivity decreased 27%, whereas the flexural strength increased 12%.

• Advances in nano research
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• v.15 no.1
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• pp.49-57
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• 2023

As composite materials are used in many applications, the modern world looks forward to significant progress. An overview of the application of composite fiber materials in sports equipment is provided in this article, focusing primarily on the advantages of these materials when applied to sports equipment, as well as an Analysis of the influence of sports equipment of fiber-reinforced composite material on social sports development. The present study investigated surface morphology and physical and mechanical properties of S-glass fiber epoxy composites containing Al₂O₃ nanofillers (for example, 1 wt%, 2 wt%, 3 wt%, 4 wt%). A mechanical stirrer and ultrasonication combined the Al₂O₃ nanofiller with the matrix in varying amounts. A compression molding method was used to produce sheet composites. A first physical observation is well done, which confirms that nanoparticles are deposited on the fiber, and adhesive bonds are formed. Al₂O₃ nanofiller crystalline structure was investigated by X-ray diffraction, and its surface morphology was examined by scanning electron microscope (SEM). In the experimental test, nanofiller content was added at a rate of 1, 2, and 3% by weight, which caused a gradual decrease in void fraction by 2.851, 2.533, and 1.724%, respectively, an increase from 2.7%. The atomic bonding mechanism shows molecular bonding between nanoparticles and fibers. At temperatures between 60 ℃ and 380 ℃, Thermogravimetric Analysis (TGA) analysis shows that NPs deposition improves the thermal properties of the fibers and causes negligible weight reduction (percentage). Thermal stability of the composites was therefore presented up to 380 ℃. The Fourier Transform Infrared Spectrometer (FTIR) spectrum confirms that nanoparticles have been deposited successfully on the fiber.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.9
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• pp.535-540
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• 2017

The changes in the electrical characteristics of CMOS ICs due to coupling with a narrow-band electromagnetic wave were analyzed in this study. A magnetron (3 kW, 2.45 GHz) was used as the narrow-band electromagnetic source. The DUT was a CMOS logic IC and the gate output was in the ON state. The malfunction of the ICs was confirmed by monitoring the variation of the gate output voltage. It was observed that malfunction (self-reset) and destruction of the ICs occurred as the electric field increased. To confirm the variation of electrical characteristics of the ICs due to the narrow-band electromagnetic wave, the pin-to-pin resistances (Vcc-GND, Vcc-Input1, Input1-GND) and input capacitance of the ICs were measured. The pin-to-pin resistances and input capacitance of the ICs before exposure to the narrow-band electromagnetic waves were $8.57M{\Omega}$ (Vcc-GND), $14.14M{\Omega}$ (Vcc-Input1), $18.24M{\Omega}$ (Input1-GND), and 5 pF (input capacitance). The ICs exposed to narrow-band electromagnetic waves showed mostly similar values, but some error values were observed, such as $2.5{\Omega}$, $50M{\Omega}$, or 71 pF. This is attributed to the breakdown of the pn junction when latch-up in CMOS occurred. In order to confirm surface damage of the ICs, the epoxy molding compound was removed and then studied with an optical microscope. In general, there was severe deterioration in the PCB trace. It is considered that the current density of the trace increased due to the electromagnetic wave, resulting in the deterioration of the trace. The results of this study can be applied as basic data for the analysis of the effect of narrow-band high-power electromagnetic waves on ICs.

• Analytical Science and Technology
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• v.18 no.1
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• pp.5-12
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• 2005

It has been established that soft error of high precision electronic circuits can be induced by alpha particles emitted from the naturally occurring radioactive impurities such as U, and Th. As the electronic circuits have recently become lower dimension and higher density, these alpha-particle emitting radioactive impurities have to be strictly controlled. The aim of this study is to develop of NAA (Neutron Activation Analysis) and gamma-spectrometry to improve the analytical sensitivity and precision of U and Th. A new NAA method has been established using the HTS (Hydrulic transfer system) irradiation facility which has been used to produce radioisotopes for industries and medicines instead of the PTS (pneumatic transfer system) irradiation facility which has been used in general NAA. When the ultratrace impurities have to be analyzed by NAA, background gamma-ray spectra induced from $^{222}Rn$ and its progenies in air is serious problem. This unstable background has been eliminated or stabilized by the use of a nitrogen purging system. Ultra trace amounts of U (0.1 ng/g) and Th (0.01 ng/g) in high purity silica used for EMC could be analyzed by the use of HTS-NAA and low background gamma-spectrometry.

• Composites Research
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• v.36 no.1
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• pp.1-15
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• 2023

Demand for energy consumption reduction is increasing according to the development expectations of future mobility. Lightweight structural materials are known as a method to reduce greenhouse gas emissions and improve energy efficiency. In particular, fiber reinforced polymer composite (FRP) is attracting attention as a material that can replace existing metal alloys due to its excellent mechanical properties and light weight. In this paper, industrial applications and research trends of carbon fiber reinforced composites (CFRP, carbon FRP) and self-reinforced composites (SRC) were reviewed based on the reinforcement, polymer matrix, and manufacturing process. In order to overcome the expensive process cost and long manufacturing time of the epoxy resin-based autoclave method, which is mainly used in the aircraft field, mass production of CFRP-applied electric vehicles has been reported using a high-pressure resin transfer molding process including fast-curing epoxy. In addition, thermoplastic resin-based CFRP and interface enhancement methods to solve the recycling issue of carbon fiber composites were reviewed in terms of materials and processes. To form a perfect matrix-reinforcement interface, which is known as the major factor inducing the excellent mechanical properties of FRP, studies on SRC impregnated with the same matrix in polymer fibers have been reported. The physical and mechanical properties of SRC based on various thermoplastic polymers were reviewed in terms of polymer orientation and composite structure. In addition, a copolymer matrix strategy for extending the processing window of highly drawn polypropylene fiber-based SRC was discussed. The application of CFRP and SRC as lightweight structural materials can provide potential options for improving the energy efficiency of future mobility.