• Advanced Composite Materials
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• v.17 no.4
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• pp.333-341
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• 2008

A novel manufacturing method for hybrid composites filled with carbon nanotubes (CNTs) and aramid fibers is proposed. To disperse the CNTs in the epoxy matrix with the presence of aramid fibers, CNT/polyethyleneoxide (PEO) composites are prepared and utilized because PEO is miscible in the epoxy resin. After thin films are made of the CNT/PEO composite and placed together with the aramid fibers, the epoxy resin is infused to them. The PEO is dissolved in the epoxy and then the CNTs are dispersed in the PEO/epoxy matrix between aramid fibers before the pre-heated matrix is cured. It is found that the PEO is completely miscible with the epoxy resin and CNTs are dispersed well in the space between the aramid fibers.

• Polymer(Korea)
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• v.38 no.2
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• pp.171-179
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• 2014

Low temperature cure prepregs are being developed for use in the preparation of large-structured fiber-reinforced polymer (FRP) composites with good performance. Cure behavior and chemorheology of low temperature cure epoxy resin system, based on epoxy resin, curing agent, and accelerators, were investigated to provide a matrix resin suitable for the prepreg preparation. Characteristics of cure reaction were studied in both dynamic and isothermal conditions by means of differential scanning calorimetry and rheometry. The low temperature cure epoxy resin system suggested in this study as a matrix resin was curable at $80^{\circ}C$ for 3 h, and showed the gel times of 120 and 20 min at 80 and $90^{\circ}C$, respectively. Thermal and mechanical properties of the cured sample were almost the same as high temperature cure counterparts.

• Applied Chemistry for Engineering
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• v.2 no.4
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• pp.301-310
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• 1991

Epoxy resins have been widely used for many applications along with good processibility. However, epoxy resin systems have poor hot/wet performance properties and brittleness after resin curing and have limited to apply for environmental resistant materials. In order to improve the toughness of epoxy resin, this review article deals with incorporation method of rubber and high performance thermoplastics into the matrix resin. In addition, molecular design of epoxy resin and modification of thermoplastic have been introduced for improving hot/wet properties of epoxy resin.

• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.23-28
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• 2013

Epoxy resins are widely used in microelectronics packaging such as printed circuit board and encapsulating for semiconductor manufacturing. Water can diffuse into and through the epoxy matrix systems and moisture absorption at boarding interfaces of matrix resin systems can lead to a hydrolysis at the interfaces resulting in delamination of encapsulating materials. In the study, the changes of diffusion coefficient and moisture content ratio of epoxy resin systems with nano-sized fillers according to the change of liquid type epoxy resins were investigated. RE-304S, RE-310S, RE-810NM and HP-4032D as a epoxy resin, Kayahard AA as a hardener, and 1B2MI as a catalyst were used in these epoxy resin systems. After curing, moisture content ratios were measured with time under the 85 and 85% relative humidity condition using a thermo-hydrostat. The maximum moisture absorption ratio and diffusion coefficient of EMC decrease with the filler content. It can be seen that these decreases are due to the increase of filler surface area and the decrease of moisture through channel with the content of nano-sized filler.

• Polymer(Korea)
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• v.38 no.6
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• pp.726-734
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• 2014

Three different types of additives, thiokol, epoxidized natural rubber (ENR) and epoxidized linseed oil (ELO), were dispersed in an epoxy matrix before being used in glass fiber (GF) composites, and their effects on the mechanical and dielectric properties of epoxy resin and glass fiber reinforced epoxy composites (GF/EP) were examined. The addition of each of 7 phr ENR, 9 phr ELO and 5 phr thiokol into the epoxy resin increased the fracture toughness significantly by 56.9, 43.1, and 80.0%, respectively, compared to the unmodified resin. The mode I interlaminar fracture toughness of the GF/EP at propagation was also improved by 26.9, 18.3 and 32.7% when each of 7 phr ENR, 9 phr ELO, and 5 phr thiokol, respectively, was dispersed in the epoxy matrix. Scanning electron microscopy showed that the additives reduced crack growth in the GF/EP, whereas their dielectric measurements showed that all these additives had no additional effect on the real permittivity and loss factor of the GF/EP.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.10a
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• pp.76-81
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• 1997

In the past polyester was usually used as the matrix of all fiber-reinforced plastic (FRP). Nowadays, however, epoxy resin has taken the place of polyester due to its superior properties. If the cutting properties of epoxy resin are unknown, It is difficult to find the optimum cutting conditions of all fiber-reinforced plastic such as CFRP. AFRP. GFRP. In this paper, I will study the cutting properties of epoxy resin by testing surface roughness.

• Carbon letters
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• v.25
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• pp.43-49
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• 2018

This study suggests the novel thermoplastic toughening agent, which can be applied in the monomer forms without increasing the viscosity of the epoxy resin and polymerized during the resin curing. The diazide (p-BAB) and dialkyne (SPB) compounds are synthesized and mixed with the epoxy resin and the carbon fiber reinforced epoxy composites are prepared using vacuum infusion process (VIP). Then, flexural and drop weight tests are performed to evaluate the improvement in the toughness of the prepared composites to investigate the potential of the novel toughening agent. When 10 phr of p-BAB and SPB is added, the flexural properties are improved, maintaining the modulus as well as the toughness is improved. Even with a small amount of polytriazolesulfone polymerized, due to the filtering effect of the solid SPB by the layered carbon fabrics during the VIP, the toughening and strengthening effect were observed from the novel toughening agent, which could be added in monomer forms, p-BAB and SPB. This suggests that the novel toughening agent has a potential to be used for the composites prepared from viscosity sensitive process, such as resin transfer molding and VIP.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.110-113
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• 2001

Dielectrometry has been used to monitor the cure of epoxy resin using composite matrix. In this investigation, physical properties of the mixture of epoxy resin(LY564), bisphenol A type, and cycloaliphatic hardener(HY 2954) were observed. Activation energy at maximum tan $\delta$ and gelation point was determined during isothermal scanning. From IonViscosity data, it was found that vitrification peak after gelation was appeared on slow heating rate. It was also measured that the duration time for full cure was necessary and it was about 24 hr at $145^{\circ}C$. Therefore, epoxy resin used in this research is required the extended time for full cure.

• Korea-Australia Rheology Journal
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• v.12 no.1
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• pp.77-81
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• 2000

Rheological behavior of thermoset/thermoplastic blends of epoxy/polyethersulphone (PES) was monitored during curing of the epoxy resin. During the isothermal curing of the mixture, a fluctuation in viscosity just before the abrupt viscosity increase was observed. This fluctuation is found to be due to the phase separation of PES from the matrix epoxy resin during the curing. The experimentally observed viscosity fluctuation is simulated with a simple two phase suspension model in terms of the increase in domain size. The viscosity profiles obtained experimentally at different isothermal curing temperatures are in good agreement with the predictions from the simple model taking into account the viscosity change due to the growth of PES domain and the network formation of the epoxy matrix.

• Proceedings of the Korean Fiber Society Conference
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• 1998.10a
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• pp.61-65
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• 1998

Epoxy resins are currently one of the most widely used thermoset polymers. Applications on epoxy-based materials range from common to structural adhesives as well as to matrix materials for high performance composites. The outstanding versatility of this resin can be related to the reactivity of the epoxy group, which can be opened by a large number of different chemical compounds, such a aliphatic and aromatic amines, anhydrides and poly-amides. (omitted)