Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Moisture Absorption Properties of Organic-Inorganic Nano Composites According to the Change of Epoxy Resins for Next Generation Semiconductor Packaging Materials

차세대 반도체용 유-무기 나노 복합재료의 에폭시 수지변화에 따른 흡습특성

  • Kim, Whan Gun (Department of Chemical and Biological Engineering, Seokyeong University) ;
  • Kim, Dong Min (Department of Chemical and Biological Engineering, Seokyeong University)
  • 김환건 (서경대학교 화학생명공학과) ;
  • 김동민 (서경대학교 화학생명공학과)
  • Received : 2013.02.20
  • Accepted : 2013.03.18
  • Published : 2013.03.31
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Abstract

Epoxy resins are widely used in microelectronics packaging such as printed circuit board and encapsulating for semiconductor manufacturing. Water can diffuse into and through the epoxy matrix systems and moisture absorption at boarding interfaces of matrix resin systems can lead to a hydrolysis at the interfaces resulting in delamination of encapsulating materials. In the study, the changes of diffusion coefficient and moisture content ratio of epoxy resin systems with nano-sized fillers according to the change of liquid type epoxy resins were investigated. RE-304S, RE-310S, RE-810NM and HP-4032D as a epoxy resin, Kayahard AA as a hardener, and 1B2MI as a catalyst were used in these epoxy resin systems. After curing, moisture content ratios were measured with time under the 85 and 85% relative humidity condition using a thermo-hydrostat. The maximum moisture absorption ratio and diffusion coefficient of EMC decrease with the filler content. It can be seen that these decreases are due to the increase of filler surface area and the decrease of moisture through channel with the content of nano-sized filler.

Keywords

References

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