• Title/Summary/Keyword: epoxy group

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DGEBA-MDA-SN-Hydroxyl Group System and Composites -Cure Kinetics and Mechanism in DGEBA/MDA/SN/HQ System- (DGEBA-MDA-SN-Hydroxyl계 복합재료의 제조 -DGEBA-MDA-SN-HQ계의 경화반응 속도론 및 메카니즘-)

  • Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.5 no.3
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    • pp.517-523
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    • 1994
  • The effects of cure kinetics and mechanism of DGEBA(diglycidyl ether of bisphenol A)/MDA(4,4'-methylene dianiline) with SN(succinonitrile) and HQ(hydroquinone) as an additive and accelerator were investigated. Cure kinetics was evaluated by Kissinger equation and fractional-life method through DSC analysis. The activation energy has hydroxyl group as an accelerator, the activation energy and the starting cure-temperature were lower than those of DGEBA/MDA/SN system. Cure mechanism of those systems was investigated through FT-IR according to the various SN contents. The ratio was SN : HQ = 4 : 1. It has been known that the cure reactions of an epoxy-diamine system are composed of primary amine-epoxy reaction, secondary amino-epoxy reaction and epoxy-hydroxyl group reaction. But in DGEBA/MDA/SN system, primary amino-CN group reaction and CN group-hydroxyl group reaction were added to the above mentioned reactions. These reactions attributed to the long main chain and the low crossliking density. And in DGEBA/MDA/SN/HQ system, hydroxyl group of HQ formed a transition state with epoxide group and amime group and also opened the ring of the epoxide group rapidly, then amino-epoxy reaction took place easily.

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Radiolytic Immobilization of Lipase on Poly(glycidyl methacrylate )-grafted Polyethylene Microbeads

  • Choi Seong-Ho;Lee Kwang-Pill;Kang Hee-Dong;Park Hyun Gyu
    • Macromolecular Research
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    • v.12 no.6
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    • pp.586-592
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    • 2004
  • Poly(glycidyl methacrylate)-grafted polyethylene microbeads (POPM) presenting epoxy groups were prepared by radiation-induced graft polymerization of glycidyl methacrylate on the polyethylene microbead. The obtained POPM was characterized by IR spectroscopic, X-ray photoelectrons spectroscopy (XPS), scanning electron microscope (SEM), and thermal analyses. Furthermore, the abundance of epoxy groups on the POPM was determined by titration and elemental analysis after amination. The epoxy group content was calculated to be in the range 0.29-0.34 mmol/g when using the titration method, but in the range 0.53-0.59 mmol./g when using elemental analysis (EA) after amination. The lipase was immobilized to the epoxy groups of the POPM under various experi­mental conditions, including changes to the pH and the epoxy group content. The activity of the lipase-immobilized POPM was in the range from 160 to 500 unit/mg-min. The activity of the lipase-immobilized POPM increased upon increasing the epoxy group content. The lipase-immobilized POPM was characterized additionally by SEM, elec­tron spectroscopy for chemical analysis (ESCA), and EA.

Numerical Simulation of Guided Ultrasonic Waves for Inspecting Epoxy Thickness in Aluminum-Epoxy-Aluminum Adhesive Plates (알루미늄-에폭시-알루미늄 접착판에서 에폭시 두께 검사를 위한 유도초음파 수치시뮬레이션)

  • Lee, Ju-Won;Na, Won-Bae
    • Journal of Ocean Engineering and Technology
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    • v.23 no.6
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    • pp.117-123
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    • 2009
  • This paper presents a numerical simulation of guided ultrasonic waves propagating in aluminum-epoxy-aluminum adhesive plates. In particular, this study investigated the effect of the epoxy thickness on the dispersive patterns, such as the phase velocity and group velocity of guided ultrasonic waves. In addition to investigating the dispersive curves, a numerical simulation using the pulse-echo method was carried out. This simulation showed that the degree of sensitivity of the epoxy thickness is dependent on the curvature of the phase and group dispersion curves, the maximum amplitude of the received time signals, and the peak frequency of the real components of the Fourier transform. Then, the linear relations between the epoxy thickness and the received and transformed signals were constructed to estimate the epoxy thickness.

Effects of TiO$_2$ Photodegradation on Leaching from Epoxy Resin Chemical in Water and Biological Toxicity (수용액에 용출된 에폭시수지 화합물의 TiO$_2$ 광분해효과와 생물독성에 미치는 영향)

  • Yeo Min Kyeong;Cho Eun Joung
    • Environmental Analysis Health and Toxicology
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    • v.19 no.3
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    • pp.271-278
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    • 2004
  • Epoxy resins are mostly used as a molding material for drinking water tank. Bisphenol A is used at a constituent material for epoxy resins and is widely suspected to act as an endocrine disrupter. In this study, we investigated embryo hatching in zebrafish reared in water undergone leaching process of expoxy resin, and found a decreased survival rate. Bisphenol A eluted from epoxy resin in drinking water tank was completely degraded by TiO$_2$ photocatalysis. We detected 7.8 ng/ml of bisphenol A in epoxy resin tank, and observed that the concentration was undetectable after 48h photocatalysis over TiO$_2$. There was no toxicity in hatching rates in zebrafish and morphogenesis after photocatalysis. The effect of TiO$_2$ photocatalytic reactions on the catalase activities in the f]y stage of zebrafish was also examined. At 1 week post hatching, cataiase activities were higher both in the group of epoxy resin with 48 h TiO$_2$ photocatalysis and in the TiO$_2$ photocatalysis for 48 hours were higher than control group. However catalase activities of the treatment group of epoxy resin by TiO$_2$ photocatalysis for 48 hours were similar to control in 5 weeks post hatching fries. In conclusion, the toxicity of TiO$_2$ photocatalysis was not observed in this zebrafish.

Synthesis and Photopolymerization of Vinyl Ether and Epoxy-Functionalized Silicones

  • Pyun, Sang-Yong;Kim, Whan-Gi
    • Macromolecular Research
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    • v.11 no.3
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    • pp.202-205
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    • 2003
  • The reactive precursors, vinyl ethers, and epoxy-silicones, were synthesized. The vinyl ether monomers were prepared from primary alcohol and ethyl vinyl ether with mercury (II) acetate. The epoxy-functionalized silicones have been achieved by the controlled, rhodium-catalyzed, chemoselective hydrosilation of vinyl ether with siloxanes or silane. It was shown that the hydrosilation proceeds exclusively at the vinyl ether group of alkenyl vinyl ether without participation at the alkenyl group. The photoinduced cationic polymerization of these monomers was studied and found to be all highly reactive.

Improvement of Polyimide/Epoxy Adhesion Strength from the Modification of Polyimide Surface and Epoxy Adhesive (폴리이미드 표면개질과 에폭시접착제 개질을 통한 폴리이미드/에폭시의 접착력 향상)

  • Kim, Seong-Hun;Lee, Dong-U;Jeong, Gyeong-Ho
    • Korean Journal of Materials Research
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    • v.9 no.1
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    • pp.65-72
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    • 1999
  • In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

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Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials (새로운 반도체 Packaging용 Ethoxysilyl Bisphenol A Type Epoxy Resin System의 경화특성 연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.2
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    • pp.19-26
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    • 2017
  • The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

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Improvement of Mechanical Properties of Epoxy Composites Using NH2-HNT Manufactured by Dry Coating Device as Filler (건식코팅장치를 이용하여 제조한 NH2-HNT를 충진재로 응용한 에폭시 복합체의 기계적 물성 향상)

  • Moon il Kim
    • Journal of the Korean Society of Industry Convergence
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    • v.27 no.2_2
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    • pp.371-375
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    • 2024
  • Epoxy resins are widely used in various fields due to their high adhesion, mechanical strength, and solvent resistance. However, as the volume decreases during the hardening process and the cooling process after hardening, stress is generated and when an external force is applied, the brittle material exhibits destruction behavior. To complement this, research has been conducted using inorganic nanofillers such as halloysite nanotube(HNT). HNT has a nanotube structure with the chemical formula of Al2Si2O5(OH)4·nH2O and is a natural sediment of aluminosilicate. It has been used as additive to improve the mechanical properties of epoxy composites with exchange of amine group as a terminal functional group. In order to simplify complicated procedures of common wet method, a dry coating machine was designed and used for amine group exchange in previous research. In this study, they were applied as filler in epoxy composites, and mechanical properties such as tensile strength and flexural strength of composites were examined.

Mechanical Properties of Vapor Grown Carbon Fiber/Epoxy Nanocomposites With Different Dispersion Methods

  • Khuyen, Nguyen Quang;Kim, Byung-Sun;Kim, Jin-Bong;Lee, Soo
    • Journal of the Korean Applied Science and Technology
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    • v.24 no.3
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    • pp.264-271
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    • 2007
  • Effect of dispersion methods for Vapor Grown Carbon Fibers (VGCF) in epoxy caused the change in mechanical properties of VGCF/epoxy nanocomposites, such as tensile modulus and tensile strength. The influence of VGCF types - atmospheric plasma treated (APT) VGCF and raw VGCF - and their contents was discussed in detail. Treating VGCF with atmospheric plasma enhanced the surface energy, therefore improved the bonding strength with epoxy matrix. Two different methods used to disperse VGCF were ultrasonic and mechanical homogenizer methods. When using dispersion solutions, the VGCF demonstrated good dispersion in ethanol in both homogenizer and ultrasonic method. The uniform dispersion of VGCF was investigated by scanning electron microscopy (SEM) which showed well-dispersion of VGCF in epoxy matrix. The tensile modulus of raw VGCF/epoxy nanocomposites obtained by ultrasonic method was higher than that of one obtained by homogenizer method. APT VGCF/epoxy nanocomposites showed higher tensile strength than that of raw VGCF/epoxy nanocomposites.

Synthesis and Properties of Waterborne Polyurethane Using Epoxy Group (WPUE) (Epoxy를 사용한 수분산 폴리우레탄의 합성 및 물성)

  • Park, Ji-Yeon;Jeong, Boo-Young;Cheon, Jung-Mi;Ha, Chang-Sik;Chun, Jae-Hwan
    • Journal of Adhesion and Interface
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    • v.16 no.1
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    • pp.22-28
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    • 2015
  • In this study, Waterborne polyurethanes (WPU) using Epoxy group were synthesized with polyester polyol, epoxy resin, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylol propionic acid (DMPA) to improve the hydrolysis resistance and adhesion. In addition, the properties of the synthesized waterborne polyurethane was evaluated through DSC, UTM, adhesion strength. Tg of the synthesized waterborne polyurethane is shown in the vicinity of $-50^{\circ}C$. Tg were increased with as epoxy resin contents increased. The tensile strength was increased as the content of epoxy resin increases, elongation was decreased. Optimum adhesion and hydrolysis-resistance strength were obtained when polyol : epoxy ratio was 99 : 1.