• Composites Research
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• v.28 no.6
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• pp.389-394
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• 2015

The sound absorption coefficient and sound transmission loss of graphite intercalation compound (GIC) included epoxy composites were investigated. Epoxy resin was infused into the expanded GIC and the impedance tube method was employed to measure the sound absorption coefficient and sound transmission loss. Scanning electron microscopy photographs showed uniform distribution of the GIC in the epoxy matrix. The surface density of epoxy/GIC (20 wt%) composites decreased about 56% compared to that of pure epoxy. The sound absorption coefficient of composites increased about 3 times at the frequency range of 500~1000 Hz compared to the pure epoxy. The sound transmission loss of composites decreased with increasing the GIC content and it is attributed to the increase of pores in the composites.

• Elastomers and Composites
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• v.49 no.1
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• pp.59-65
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• 2014

In this study, in order to complete curing reaction of the molding compound comprising an epoxy/anhydride at $71^{\circ}C$ for 40 hours, metal coordination complexes such as cobalt (II) acetylacetonate, potassium acetylacetonate, iron (III) acetylacetonate and chromium (III) octoate as a catalyst were applied to the epoxy/anhydride compounds respectively. The weight ratio of an epoxy part/an anhydride part was adjusted to improve the mechanical properties of the molding compound. According to the experimental results, an epoxy/anhydride compound containing chromium (III) octoate showed a high conversion at $71^{\circ}C$ for 40 hours as well as a proper processability at room temperature among the several metal coordination complexes. For the mechanical properties of the cured epoxy/anhydride compound, the compounds containing weight ratio from 0.9/1 to 0.5/1 of the epoxy part/anhydride part with chromium (III) octoate showed the high flexural strength, and higher compressive strength was shown with increasing of the hardener part.

• Bulletin of the Korean Chemical Society
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• v.27 no.10
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• pp.1542-1548
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• 2006

Maleimide modified epoxy compounds were prepared by reacting N-(4-hydroxyphenyl) maleimide (HPM) with diglycidylether of bisphenol-A. Triphenylphosphine was used as catalyst and methylethylketone as solvent. The resulting compound possessed both the oxirane ring and maleimide group. The curing reaction of the maleimide epoxy compound with amine curing agents such as 1-(2-aminoethyl) piperazine (AEP) and 5-amino-1,3,3-trimethylcyclohexane methylamine isophorone diamine, IPDA) were studied. Incorporation of maleimide groups in the epoxy resin provides cyclic imide structure and high cross-linking density to the cured resins. The cured samples were found to have good thermal stability, chemical resistance (acid/alkali/solvent) and water absorption resistance.

• 전자공학회논문지 IE
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• v.43 no.4
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• pp.83-92
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• 2006

EMC(epoxy moulding compound) when operate with residual quantity processing after fixed quantity moulding inverse close way of designing by mechanical action inhalation so that may occur, solved of needle tip residual quantity and cause of thread extend phenomenon. In this paper, design to connect directly gun, washer tank and measuring beforehand amount that washing is easy and want minuteness fixed quantity that essential equipment in semi-conductor packaging process because develop EMC so that can molding with high speed consider.

• Textile Coloration and Finishing
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• v.29 no.1
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• pp.25-36
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• 2017

This study worked on the synthesis of waterborne polyurethane/epoxy hybrid resins containing aminosilane compound to replace conventional phenol resins used for a coating material for loudspeaker dampers, which are not harmful to human being. Waterborne polyurethane resins were synthesized from two diisocyanate of 4,4'-diphenylethane diisocyanate and toluene diisocyanate, two polyols of polyester polyols(PEP), polycarbonatediol(PCD), including and anionic center of dimethylol butanoic acid, a chain extenders of ethylenediamine(EDA), and a neutral agent of triethylamine. Synthesized polyurethane resins and commercially available bisphenol A type waterborne epoxy resin were blended in weight ratios of 80:20 to prepare polyurethane/epoxy hybrid resins. The synthesized waterborne polyurethane/epoxy hybrid resins were reacted with aminosilane compound to improve mechanical properties. Aminosilane-treated polyurethane /epoxy hybrid resins showed better mechanical properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.5 no.2
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• pp.77-83
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• 1991

In this study the investigation were carried out on short-term breakdown characteristics of the compound material dependent on change of filler quantity, ambient temperature(room temperature~[$190[^{\circ}C$]) and kinds of voltage sources for the compound materials of Bisphenol- A epoxy resins filled with $SiO_2$ particles. As the results, obtained the dielectric breakdown strength generally decrease as increasing the quantity of filler and the distance, spacing of each's particles, decrease as increasing the quantity of filler, when the distance is less than [$7.5\mu\textrm{m}$], dielectric breakdown strength is nearly constant. In the case on AC voltage dielectric strength of filled epoxy resins is stronger than nonfilled epoxy resins on temperature region more than $130[^{\circ}C$].

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1645-1647
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• 1999

Epoxy compound has been used as insulation material in electrical equipment because of its properties 1) Nowadays, becoming higher voltage system, the properties of interface between epoxy and its metal insert become more important. In this paper, we suggest two types semiconducting paste. One is epoxy type and the other is olephine type. After sprayed the semiconducting paste on metal insert sanded, we procedure the test one is the adhesion strength test, the other is electrical breakdown strength test. So we knew that the epoxy type paste became more higher adhesion strength than olephine type paste because of its homogeneity at the interfaces. And at the breakdown strength test, olephine type paste became less higher than epoxy type paste because of its volatility. So in this study, we suggest the optimum interface condition by adjusting the semiconducting paste and surface roughness.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.168-173
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• 2010

Flame retardant halogen containing compounds have been replaced as environmentally safe material which does not contain hazardous materials generating toxic gas. Self-extinguishing epoxy resin compositions have been studied in order to produce eco-friendly epoxy molding compound, which is used as insulating materials in semiconductor. We developed self-extinguishing epoxy resin compositions which do not contain halogen compounds with new epoxy resin (E3). The new epoxy molding compound (EMC-1) showed high flame resistance (UL-V0) and high thermal resistance ($451.9^{\circ}C$ at 5 wt% loss) enough to use as eco-friendly material.

• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.