• Transactions on Electrical and Electronic Materials
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• v.12 no.4
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• pp.135-139
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• 2011

In an effort to develop new electrical insulation materials, four different kinds of organically modified layered silicate were incorporated into an epoxy matrix to prepare nanocomposites for electrical insulation. Five wt% of organically modified layered silicates were processed in a planetary centrifugal mixer in an epoxy matrix, and the thermal, mechanical, and electrical properties of the cured epoxy/layered silicate were investigated. The morphology of the nanoscale silicate dispersed in the epoxy matrix was observed using transmission electron microscopy, and the interlayer distance was measured by wide-angle X-ray scattering diffraction analysis.

• Advanced Composite Materials
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• v.17 no.4
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• pp.333-341
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• 2008

A novel manufacturing method for hybrid composites filled with carbon nanotubes (CNTs) and aramid fibers is proposed. To disperse the CNTs in the epoxy matrix with the presence of aramid fibers, CNT/polyethyleneoxide (PEO) composites are prepared and utilized because PEO is miscible in the epoxy resin. After thin films are made of the CNT/PEO composite and placed together with the aramid fibers, the epoxy resin is infused to them. The PEO is dissolved in the epoxy and then the CNTs are dispersed in the PEO/epoxy matrix between aramid fibers before the pre-heated matrix is cured. It is found that the PEO is completely miscible with the epoxy resin and CNTs are dispersed well in the space between the aramid fibers.

• Proceedings of the Korea Concrete Institute Conference
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• 2006.11a
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• pp.465-468
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• 2006

This paper investigates the effect of curing conditions on the strength improvement of polymer-modified mortars using epoxy resin with various curing methods. The polymer-modified mortars using epoxy resin are prepared with various polymer-cement ratios, and subjected to standard, hot water, heat cure and autoclave cures. The epoxy-modified mortars are tested for flexural and compressive strengths at desired curing methods. From the test results, the flexural and compressive strengths of the epoxy-modified mortars are hardly improved by the autoclave and hot water cures compared to the ideal cure of $20^{\circ}C$. Among the four types of curing methods, the strengths of the heat cured epoxy-modified mortars is largely improved. Especially, it is obtained in the mortars sealed with PVDC film.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2013.05a
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• pp.53-55
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• 2013

Nitrite-Type hydrocalumite (calumite) is a material that can provied a self-corrosion inhibition function to the reinforce concrete. In this study, bisphnol A·F type epoxy-midified mortars without hardner contaning calumite is prepared with various polimer-binder ratios, calumite contents and tow types of curing condition, and tested for flexural and compressive strength tensile strength and corrosion-inhibition. As a result, in the case of wet/dry curing condition, strengths of bisphnol A·F type epoxy-modified mortars without hardener contaning calumite is inclined to decrease with increasing of polymer-binder ratio and calumite content. However, dry cured specimens are slightly improved by using bisphnol A·F type epoxy resin. Finally, regardless of polymer-binder ratios and calumite contents, corrosion-inhibition of bisphnol A·F type epoxy-modified mortars without hardener containing calumite is superior than that of unmodified mortar.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.136-139
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• 2000

Epoxy materials are used as insulation material for electric power cables. In the case of a flow of excess current due to the temperature difference which occurs between the heat of the conductor and the atmosphere, heat degrades connection point of the cables. Also, the mechanical stress, which occurs due to the thermal expansion coefficient of cable connection electrode system and epoxy insulation materials along with the gap between thermal conduction based on the extra high voltage of transmitted voltage, increases possibility of cracks to occur. The relationship between mechanical stress and electrical breakdown mechanism is verified for the epoxy materials such as high toughness epoxy materials, which comes to be used contemporarily, and for the breakdown mechanism of epoxy materials on the multi-stresses (mechanical and electrical) due to the variation of the temperature.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.53 no.6
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• pp.368-371
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• 2004

The quench current characteristics of the superconducting solenoids with large diameter were experimentally investigated. Three solenoids with inside diameter of 450mm were fabricated with different tensions and different types of epoxy applications. The quench current of each solenoid was measured according to the various ramping rates of current. The highest quench current was obtained in the solenoid impregnated with epoxy after winding with tension of 20 percents of the yield strength of the superconducting wire. It was found that the quench currents were almost independent of the ramp rate of current. From the results, although the training effect in the solenoid appeared with epoxy impregnation, the quench current of solenoid impregnated with epoxy was higher than that without epoxy impregnated The test results are presented and discussed.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.153-156
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• 2012

In order to develop electrical insulation materials, epoxy/micro-silica composite (EMC) and epoxy/micro-silica/nano-silicate composite (EMNC) were prepared, and their tensile and flexural strength, AC insulation breakdown strength and thermal conductivity and thermal expansion coefficient were compared. Nano-silicate was prepared in an epoxy matrix by our AC electric field process. All properties of the neat epoxy were improved by the addition of micro-silica, which was improved much further by the addition of nano-silicate to the EMC system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.57-60
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• 2000

In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.2
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• pp.213-218
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• 2013

In this study, epoxy/mica composite was prepared by mixing with mechanical stirrer together with homogenizer, and the effect of amino-type silane coupling agent was also studied. To reduce the viscosity without any decrement of other properties, 1,4-Butanediol diglycidyl ether (1,4-BDGE) as an aliphatic epoxy reactive diluent was introduced to the epoxy/mica composite in order to use as vanish for high voltage motor and generator stator winding. It was confirmed by scanning electron microscopy (SEM) observation that interfacial characteristics between organic epoxy and inorganic mica was modified by coupling agent treatment so that glass transition temperature increased, and tensile strength and electrical breakdown strength increased. The properties were estimated by Weibull statistical analysis and the ac electrical breakdown strength was 20.2% modified by treating silane coupling agent.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.390-391
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• 2007

LED Packaging 과정 중 Die bond 재료로 Silver epoxy를 사용하여 Packaging 한 후 T3Ster 장비로 열 저항 값(Rth)을 측정하였다. Silver epoxy 의 접착 두께를 조절하여 열 저항 값을 측정하였고, 열전도도 값이 다른 Silver epoxy를 사용하여 열 저항 값을 측정하였다. Silver epoxy 접착 두께가 충분하여 Chip 전면에 고루 분포되었을 경우 그렇지 않은 경우보다 평균 4.8K/W 낮은 13.23K/W의 열 저항 값을 나타내었고, 열전도도가 높은 Silver epoxy 일수록 열전도도가 낮은 재료보다 평균 4.1K/W 낮은 12K/W의 열 저항 값을 나타내었다.