• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.27 no.4
• /
• pp.1-7
• /
• 2013

Optical characteristics including the view angle and color temperature uniformity of LED packages with an integrated lens fabricated by compression molding method are investigated according to lens shape, lens materials, and phosphor coating methods. Four types of lens shape are designed and their optical output power dependence on the refractive index of silicone encapsulant are evaluated. Also, spatial color temperature uniformities of packages fabricated with different phosphor coating methods-direct coating on a chip vs. uniformly mixed with silicone encapsulant- are compared at various view angles. As the result, it is found that phosphor coating method is more effective on color temperature uniformity than lens shape. The maximum color temperature difference of a package with direct coating of phosphor on a chip is 1,340K according to the view angle at the color temperature of 5,000K, and that of a package with uniformly mixed phosphor is 250K, which indicates 1,090K improvement of color uniformity for the latter case.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.26-28
• /
• 2005

In this paper, degradation in field-aged PV modules including degradation of interconnect, discoloration of encapsulant and hot spot have been observed and analyzed. From the results, photovoltaic module installed for 15 years shows around 13~20% drop of electrical properties due to the interconnect degradation and PV module passed 19 years has been found to drop of around 20% mainly by the encapsulant discoloration. Fill factor of the electrode oxidized photovoltaic module has been dropped by the amount of 6~10% due to the change of irradiance. It is because maximum voltage(Vmp) decreases according to the increase of irradiance.

• Current Photovoltaic Research
• /
• v.11 no.4
• /
• pp.108-113
• /
• 2023

Pressure to reduce costs in the current solar market is driving the development and implementation of new module designs and prompting the use of new materials and components. In order to utilize the variability of each material that makes up the module, it is essential to understand the basic characteristics of the material. In this article, we evaluate light degradation after UV irradiation as an encapsulation material. Measure and analyze the results of various characteristic tests for discoloration, optical and electrical property degradation before and after UV accelerated testing. To evaluate weathering stability, UV tests were performed comparing existing EVA and UVT-EVA, POE and improved low-cost POE. Even in the weather resistance test with a total UV exposure of 60 kW/m², the properties of the encapsulants were mostly stable. EVA and POE-based encapsulants showed slight differences, and these slight differences are believed to pose a threat to long-term stability. This study is a basic analysis of encapsulation research for PV modules and will be helpful in understanding future development and encapsulant properties.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.17 no.12
• /
• pp.737-742
• /
• 2016

We prepared five different ethylene-propylene copolymers (EPCs) for use as the encapsulant of a photovoltaic module. All of the polymers were of commercial grade from ExxonMobile company and had different ethylene/propylene compositions. The crystallization behaviors and crystal structures of the polymers were analyzed by differential scanning calorimetry and wide angle X-ray scattering diffractometry, respectively. We observed the general trend that the degree of crystallization, density and glass transition temperature of the EPCs decreased with increasing ethylene content. However, an unexpected result was also observed: the EPC with the highest ethylene content (22.2 mol. %) showed the highest melting temperature. As a result, the EPC with 22.2 mol. % of ethylene shows the highest light transmittance, due to its having the lowest degree of crystallization and highest thermal creep resistance. This abnormal result is attributed to the blocky structure prepared by ExxonMobile's special catalyst technology. It was also observed that new additional melting peaks appeared as the crystallization time increased. Using wide angle X-ray scattering diffractometry, it was confirmed that these additional peaks originated from the formation of a new crystal structure caused by annealing.

• Polymer(Korea)
• /
• v.36 no.6
• /
• pp.721-726
• /
• 2012

Thermoplastic polyurethane (TPU) elastomer is used as an encapsulant in undersea sonar devices. A new material for sonar encapsulant exhibiting better mechanical strength than TPU along with a lower swelling ratio for seawater and oil is required to prolong its application. TPU grafted silica nanoparticles (TPU-g-silica) were prepared and then they were melt mixed with TPU to fabricate desirable composites for underwater applications. The composite containing silica nanoparticles exhibited better tensile strength and lower swelling ratios in the seawater and oil than TPU regardless of the surface treatment of the silica particles. At fixed silica content in the composite, the TPU/TPU-g-silica composite exhibited better tensile strength and lower swelling ratio than the TPU composite with the pristine silica particles. Furthermore, the TPU/TPU-g-silica composite exhibited enhanced tensile strength as compared to TPU after being impregnated with oil.

• New & Renewable Energy
• /
• v.16 no.3
• /
• pp.1-12
• /
• 2020

Shingled technology is the latest cell interconnection technology developed in the photovoltaic (PV) industry due to its reduced resistance loss, low-cost, and innovative electrically conductive adhesive (ECA). There are several advantages associated with shingled technology to develop cell to module (CTM) such as the module area enlargement, low processing temperature, and interconnection; these advantages further improves the energy yield capacity. This review paper provides valuable insight into CTM loss when cells are interconnected by shingled technology to form modules. The fill factor (FF) had improved, further reducing electrical power loss compared to the conventional module interconnection technology. The commercial PV module technology was mainly focused on different performance parameters; the module maximum power point (Pmpp), and module efficiency. The module was then subjected to anti-reflection (AR) coating and encapsulant material to absorb infrared (IR) and ultraviolet (UV) light, which can increase the overall efficiency of the shingled module by up to 24.4%. Module fabrication by shingled interconnection technology uses EGaIn paste; this enables further increases in output power under standard test conditions. Previous research has demonstrated that a total module output power of approximately 400 Wp may be achieved using shingled technology and CTM loss may be reduced to 0.03%, alongside the low cost of fabrication.

• Applied Chemistry for Engineering
• /
• v.10 no.6
• /
• pp.949-953
• /
• 1999

Because epoxy molding compound(EMC) for semi-conductor encapsulants contains high concentrations of fillers, its flow behaviors are affected much by the concentrations and properties of those fillers. This paper reports the effects of a filler concentration, shape, size, and size distributions on the viscosity behavior of EMC(epoxy/silica). In addition, the prediction of viscosity behavior was performed using the Mooney equation. The maximum packing volume in the Mooney equation was calculated by Ouchiyama's packing model and Taguchi's optimization method, while the shpae factor was determined by fitting the experimental data. The results showed that the Mooney equation predicted the viscosity behavior of EMC very well.

• Applied Chemistry for Engineering
• /
• v.10 no.8
• /
• pp.1175-1179
• /
• 1999

The rheological properties of highly filled epoxy molding compound(EMC) for semi-conductor encapsulants are greatly affected by the content of filler loaded. In this study, the change of viscosity of EMC for semi-conductor encapsulants with the filler content was investigated. Also, both of Cox-Merz and modified Cox-Merz equations were applied to convert the viscosity change as a function of frequency to that of shear rate. It was ovserved that shear thinning and yield stress occured at high filler contents and that the Cox-Merz equation could not be applied at high filler contents because of the difference of viscosity according to the various strains. When the modified Cox-Merz equation was applied, the all the curves having different strain tend to be represented by one master curve, even though some deviation was obseved at high filler content and strain.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.1
• /
• pp.51-59
• /
• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.1
• /
• pp.43-50
• /
• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.