• Earthquakes and Structures
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• v.11 no.6
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• pp.1077-1099
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• 2016

One of the main shortcomings in the current passive base isolation system is lack of adaptability. The recent research and development of a novel adaptive seismic isolator based on magnetorheological elastomer (MRE) material has created an opportunity to add adaptability to base isolation systems for civil structures. The new MRE based base isolator is able to significantly alter its shear modulus or lateral stiffness with the applied magnetic field or electric current, which makes it a competitive candidate to develop an adaptive base isolation system. This paper aims at exploring suitable control algorithms for such adaptive base isolation system by developing a close-loop semi-active control system for a building structure equipped with MRE base isolators. The MRE base isolator is simulated by a numerical model derived from experimental characterization based on the Bouc-Wen Model, which is able to describe the force-displacement response of the device accurately. The parameters of Bouc-Wen Model such as the stiffness and the damping coefficients are described as functions of the applied current. The state-space model is built by analyzing the dynamic property of the structure embedded with MRE base isolators. A Lyapunov-based controller is designed to adaptively vary the current applied to MRE base isolator to suppress the quake-induced vibrations. The proposed control method is applied to a widely used benchmark base-isolated structure by numerical simulation. The performance of the adaptive base isolation system was evaluated through comparison with optimal passive base isolation system and a passive base isolation system with optimized base shear. It is concluded that the adaptive base isolation system with proposed Lyapunov-based semi-active control surpasses the performance of other two passive systems in protecting the civil structures under seismic events.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• IEMEK Journal of Embedded Systems and Applications
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• v.17 no.4
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• pp.191-197
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• 2022

This study proposes an image-based Pose Intention Network (PIN) algorithm for rehabilitation via patients' intentions. The purpose of the PIN algorithm is for enabling an active rehabilitation exercise, which is implemented by estimating the patient's motion and classifying the intention. Existing rehabilitation involves the inconvenience of attaching a sensor directly to the patient's skin. In addition, the rehabilitation device moves the patient, which is a passive rehabilitation method. Our algorithm consists of two steps. First, we estimate the user's joint position through the OpenPose algorithm, which is efficient in estimating 2D human pose in an image. Second, an intention classifier is constructed for classifying the motions into three categories, and a sequence of images including joint information is used as input. The intention network also learns correlations between joints and changes in joints over a short period of time, which can be easily used to determine the intention of the motion. To implement the proposed algorithm and conduct real-world experiments, we collected our own dataset, which is composed of videos of three classes. The network is trained using short segment clips of the video. Experimental results demonstrate that the proposed algorithm is effective for classifying intentions based on a short video clip.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.38-38
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• 2008

무선 통신에 사용되는 기판에서 passive device는 대부분 기판 위에 개별적으로 표면 실장 되고 있으며 전체 기판면적에 80% 정도를 차지하고 있다. 따라서 기판의 소형화, 경량화를 위하여 많은 면적을 차지하는 수동소자들을 다층인쇄회로기판(multi-layer circuit board)에 내장하는 내장형 수동소자(embedded passive device) 기술이 연구되고 있다. 본 연구원에서 개발한 복합재료는 무기물 충전제 $SrTiO_3$를 사용하였으며, 열가소성 수지로는 cyclo-olefin-polymer계열의 수지를 바탕으로 제작 하였고, 유전율7~7.5이고 유전손실은 0.0045이다. 또한 $SrTiO_3$/유기물 복합재료는 공정온도가 낮고 경제적인 유기물에 높은 유전상수를 갖는 무기물이 분산되어 있는 형태이며, 우수한 유전 특성, 화학적 안정성, 저온 제조공정, 제조단가의 감소, 패키징 크기의 감소 등의 장점을 갖는다. 개발된 재료를 기반으로 Multi-layer 구조를 이용한 다양한 용량대의 capacitor를 구현 하였으며, spiral inductor 와 내장형 spiral inductor를 구현하여 다양한 용량대의 inductor를 구현 하였다. 그리고 각각의 구조에 따른 inductance와 Q factor를 분석 하였으며, Q factor가 100이상인 high Q inductor도 구현하였다. 이렇게 구현된 내장형 수동소자는 기판의 크기의 감소와 제조 단가의 절감, 최소 크기의 기판을 구현하는데 응용이 가능 할 것으로 예상 된다.

• Smart Structures and Systems
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• v.23 no.6
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• pp.695-702
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• 2019

The number of cable-stayed bridges has been increasing worldwide, causing issues in maintaining the structural safety and integrity of bridges. The stay cable, one of the most critical members in cable-stayed bridges, is vulnerable to wind-induced vibrations owing to its inherent low damping capacity. Thus, vibration mitigation of stay cables has been an important issue both in academia and practice. While a semi-active control scheme shows effective vibration reduction compared to a passive control scheme, real-world applications are quite limited because it requires complicated equipment, including for data acquisition, and power supply. This study aims to develop an Arduino-based integrated cable vibration control system implementing a semi-active control algorithm. The integrated control system is built on the low-cost, low-power Arduino platform, embedding a semi-active control algorithm. A MEMS accelerometer is installed in the platform to conduct a state feedback for the semi-active control. The Linear Quadratic Gaussian control is applied to estimate a cable state and obtain a control gain, and the clipped optimal algorithm is implemented to control the damping device. This study selects the magnetorheological damper as a semi-active damping device, controlled by the proposed control system. The developed integrated system is applied to a laboratory size cable with a series of experimental studies for identifying the effect of the system on cable vibration reduction. The semi-active control embedded in the integrated system is compared with free and passive mode cases and is shown to reduce the vibration of stay-cables effectively.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.9
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• pp.1615-1620
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• 2010

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.

• Journal of the Korea Society of Computer and Information
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• v.16 no.3
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• pp.1-7
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• 2011

An attack aircraft such as a fighter needs an accurate location information of a target for the exact air-to-air or air-to-ground attack. In this paper a method is proposed that generates a location information of an air-to-ground target just in use of HMD without the target tracking sensors such as the radar and the FLIR. HMD is an embedded device to induce the seeker header to indicate the direction of a pilot's head. As a simulation result, it is founded that the target location information is able to be generated with a high degree of precision by using of HMD as a passive sensor.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.19-22
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• 2013

Recently, high speed transmission and large information demand have been increased. Also, researches of integrated optical device for large production and high-efficient planar lightwave circuit (PLC) have been increased. In this paper, integrated optical alignment is proposed which makes passive alignment between optical device and optical fiber possible. The integrated optical device consists of splitter structures which have one input and two outputs. The proposed integrated structure was fabricated by roll-to-roll (RTR) processing method. This method enables to manufacture continuously and the processing time can be shortened. Optical property of the fabricated optical device showed 3.9 dB insertion loss and 0.2 dB optical uniformity using the light source with 1550 nm wavelength.

• Transactions on Electrical and Electronic Materials
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• v.15 no.2
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• pp.100-102
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• 2014

$Ag(Ta,Nb)O_3$ materials have a perovskite structure with a low loss tangent. These materials have been widely researched for their applications as high-frequency, passive components. Also, $Ag(Ta,Nb)O_3$ materials have weak frequency dispersion with high dielectric permittivity which gives them enormous potential for use in electronic components, including the filters, and embedded capacitors. Therefore, our research will discuss the structural and electrical relaxation properties of $Ag(Ta_{0.8}Nb_{0.2})O_3$ ceramics for device applications. We will investigate using X-ray diffraction to understand their structural properties and will analyze voltage dependent leakage current and timedependent relaxation behavior to understand their material properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.339-339
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• 2007

Metal coating on ceramic powder has long been attracting interest for various applications such as superconductor where the brittle nature of high temperature ceramic superconductor was complemented by silver coating and metalloceramics where mechanical property improvement was achieved via electroless plating. More recently it has become of great interest in embedded passive device applications since metal coating on ceramic particles may result in the enhancement of the dielectric properties of ceramic-polymer composite capacitors. In our study, nickel ion-containing solution was used for coating commercial capacitor-grade $BaTiO_3$ powder. After filtering process, the powder was dried and heat-treated in 5% forming gas at $900^{\circ}C$. XRD and TEM were utilized for the observation of crystallization behavior and morphology of the particles. It was found that the nickel coating characteristics were strongly dependent on the several parameters and processing variables, such as starting $BaTiO_3$ particle size, nickel source, solution chemistry, coating temperature and time. In this paper, the effects of these variables on the coating characteristics will be presented in some detail.