• 제목/요약/키워드: electronic device cooling

검색결과 77건 처리시간 0.024초

A STUDY ON HEAT TRANSFER THROUGH THE FIN-WICK STRUCTURE MOUNTED IN THE EVAPORATOR FOR A PLATE LOOP HEAT PIPE SYSTEM

  • ;성병호;최지훈;유정현;서민관
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2008년도 추계학술대회B
    • /
    • pp.2137-2143
    • /
    • 2008
  • This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.

  • PDF

압전세라믹 냉각팬에 대한 수치해석적 연구 (A Numerical Analysis in Piezoelectric Fan Systems)

  • 박지호;김은필
    • Journal of Advanced Marine Engineering and Technology
    • /
    • 제35권8호
    • /
    • pp.994-1000
    • /
    • 2011
  • 본 논문은 압전소자의 주기적인 발진운동을 탄성 변환하여 유체유동을 유발하는 압전소자 팬의 수치해석 모델에 대한 연구이다. LED 모듈 등의 고밀도 열이 발생하는 소형 전자장치의 냉각에 적용이 가능한 압전소자 냉각팬의 성능 향상을 위해 CFD 도구를 이용하였다. 본 논문의 결과는 압전소자의 길이 5cm와 방열판의 길이 3cm라는 비율이 효과적이었다. 이는 기하학적으로 비슷한 형태를 가지고 다른치수를 가지는 모델에서 기초적인 설계를 하는데 도움이 될 것이다.

열전달 및 압력강하 특성을 고려한 채널 내 핀-휜 구조물의 설계 (Design of a Pin-Fin Structure in a Channel Considering the Heat Transfer and Pressure Drop Characteristics)

  • 신지영;손영석;이대영
    • 설비공학논문집
    • /
    • 제18권6호
    • /
    • pp.459-467
    • /
    • 2006
  • Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

세라믹 패키지를 이용한 표면실장형 다이오드의 제작과 특성평가 (Manufacture of Surface Mounted Device Type Fast Recovery Diode with Ceramic Package)

  • 전명표;조상혁;한익현;조정호;김병익;유인기
    • 한국전기전자재료학회논문지
    • /
    • 제20권5호
    • /
    • pp.415-420
    • /
    • 2007
  • Generally, a diode package consists of the synthetic resin that has good durability but low thermal conductivity. The surface mounted type fast recovery diode was fabricated by using ceramic package. Its main manufacture processes are composed of soldering, sillicon coating and side termination. And it has various advantages that diode is small, easy manufacture and fast cooling. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5.28 ns, 1322 V, 1.08 V, $0.45\;{\mu}A$, respectively.

전자장비에서 벽면의 대류열방출 및 통기구의 효과를 고려한 3차원 자연대류 냉각 (Three-dimensional natural convection cooling of the electronic device with the effects of convective heat dissipation and vents)

  • 이관수;백창인;임광옥
    • 대한기계학회논문집
    • /
    • 제19권11호
    • /
    • pp.3072-3083
    • /
    • 1995
  • The numerical simulation on the three-dimensional natural convection heat transfer in the enclosure with heat generating chip is performed, and the effects of convective heat loss and vents are also examined. The effects of the Rayleigh number and outer Nusselt number (Nu$_{0}$) on the maximum chip temperature and the fractions of heat loss from the hot surfaces are investigated. The results show that conduction through the substrate is dominant in heat dissipation. With the increase of Rayleigh number, heat dissipation through the chip surfaces increases and heat loss through the substrate decreases. Maximum dimensionless temperature with vents is found to decrease about 40% compared to the one without vents at Nu$_{0}$=0.l. It is also shown that effects of size and location of the vents are negligible.ble.

고정도 엔진 지압계에 관한 연구 (1) <온도 특성에 의한 영점이동의 보상> (A Study on the Precision Engine Indicatior(I) (Zero-shift Compensation of the Engine Indicator with a Electronic Device))

  • 박상길;문덕홍;안수길
    • Journal of Advanced Marine Engineering and Technology
    • /
    • 제7권1호
    • /
    • pp.34-39
    • /
    • 1983
  • Development of modern internal combustion engine requires more precise indicator. In the case of strain gage-strain tube type indicator, thermal expansion of the indicator's fixed part makes zero-shift in spite of water cooling. Therefore, the authors analyzed the cause of zero-shift phenomenon on strain gage-strain tube type indicator and proposed a new device to compensate the zero-shift of indicator by electrical method without detoriorating the dynamic charcteristic. As the results, we found that the zero-shift is varied linearlly according to temperature variation of the indicator's fixed part and appling a new device, we can improve the zero-shift of indicator about 0.63% (0.63 kg/$cm^2$) of full scale, though we got 10% of it without the device at the cylinder head operating temperature (c.a. $200^{\circ}C$).

  • PDF

Thermal Analysis of Water Cooled ISG Based on a Thermal Equivalent Circuit Network

  • Kim, Kyu-Seob;Lee, Byeong-Hwa;Jung, Jae-Woo;Hong, Jung-Pyo
    • Journal of Electrical Engineering and Technology
    • /
    • 제9권3호
    • /
    • pp.893-898
    • /
    • 2014
  • Recently, the interior permanent synchronous motor (IPMSM) has been applied to an integrated starter and generator (ISG) for hybrid electric vehicles. In the design of such a motor, thermal analysis is necessary to maximize the power density because the loss is proportional to the power of a motor. Therefore, a cooling device as a heat sink is required internally. Generally, a cooling system designed with a water jacket structure is widely used for electric motors because it has advantages of simple structure and cooling effectiveness. An effective approach to analyze an electric machine with a water jacket is a thermal equivalent network. This network is composed of thermal resistance, a heat source, and thermal capacitance that consider the conduction, convection, and radiation. In particular, modeling of the cooling channel in a network is challenging owing to the flow of the coolant. In this paper, temperature prediction using a thermal equivalent network is performed in an ISG that has a water cooled system. Then, an experiment is conducted to verify the thermal equivalent network.