• Transactions of the Korean Society of Mechanical Engineers B
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• v.22 no.2
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• pp.253-266
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• 1998

A numerical study on the cooling performance for electronic components mounted with heat sink in an electronic system has been performed. The model of electronic system consisted with lower and upper modules in which the electronic components mounted with heat sink were arrayed. To find better configuration under a given fan power for effective cooling, the cases called 'No heat sink','Both heat sinks','Lower heat sinks', and 'Upper heat sinks' were tested. The results showed that the cooling performance in 'Upper heat sinks' was the best among four cases.

• Journal of the Korean Society of Industry Convergence
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• v.20 no.4
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• pp.325-332
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• 2017

The engine cooling system is a device that maintains the temperature in the engine room at an appropriate level by driving a cooling fan when the temperature in the engine room generated during the vehicle operation occurs over a certain temperature. In recent years, the vehicle cooling system has changed to an electronic system. Therefore, in this paper, we design and develop a hall sensor based electronic engine cooling system. In this paper, a hall sensor module and an actuator module for engine cooling control system are designed. In order to verify the performance of the designed module, the magnetic field control was verified through the simulation of the diameter and the head of the coil.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.6
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• pp.854-861
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• 2008

Heat transfer characteristics of protruding electronic components in a horizontal channel are studied numerically. The system consists of two horizontal channels formed by two covers and one printed circuit board which has three uniform protruding heat source blocks. A two-dimensional numerical model has been developed to predict the conjugate heat transfer. and the finite volume method is used to solve the problem. Five different cooling methods are considered to examine the heat transfer characteristics of electronic components according to the different cooling methods. The velocity and temperature of cooling medium and the temperature of the heat source blocks are obtained. The results of the five different cooling methods are compared to find out the most efficient cooling method in a given geometry and heat sources.

• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.7
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• pp.2356-2366
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• 1996

High-power electronic chips have been advanced to such an extent that the heat dissipation capability of a system design has become one of the primary limiting factors. Therefore, thermal design must be considered in the early stage of the electronic system development. In present paper, the results of an experimental study on the forced convection cooling are presented to evaluate cooling performance of an electronic cabinet which in generally used for telecommunication system. Temperatures and thermal resistances are applied to compare the heat transfer characteristics for various locations of a fan unit as well as various configuration of non-uniform powering modules. As a result, the optimal configuration of a fan unit and powering configuration is suggested for the effective thermal design of telecommunication system.

• Journal of the Korean Society of Industry Convergence
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• v.21 no.5
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• pp.241-246
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• 2018

The engine cooling system is a device that keeps the temperature of the engine room at a proper level by driving the cooling fan when the engine room temperature that occurs during driving is above a certain temperature. Recently, the vehicle cooling system has been changed to electronic system. Therefore, in this paper, we will analyze the clutch operation characteristics for designing a superior electronic fan clutch. For this purpose, an electronic fan clutch was designed and a test bed for performance evaluation was constructed and analyzed.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.1
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• pp.46-55
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• 2004

Thermal characteristics of the various cooling methods in electronic equipment are studied numerically. A common chip cooling system is modeled as a parallel channel with protruding heat sources. A two-dimensional model has been developed for the numerical analysis of compressible. viscous. laminar flow. and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The assembly consists of two channels formed by two covers and one printed circuit board that is assumed to have three uniform heat source blocks. Various cooling methods are considered to find out the efficient cooling method in a given geometry and heat sources. The velocity and the temperature fields. the local temperature distribution along the surface of blocks. and the maximum temperature in each block are obtained. The results are compared to examine the thermal characteristics of the different cooling methods both quantitatively and qualitatively.

• Journal of Power System Engineering
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• v.18 no.1
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• pp.14-21
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• 2014

Piezoelectric fans are thin elastic beams whose vibratory motion is actuated by means of a piezoelectric material bonded to the beam. These fans have found use as a means to enhance convective heat transfer while requiring only small amounts of power. This study presents new types of models with heat sink having air passage and investigates experimentally their heat transfer characteristics. From the comparison results for four models, the heat transfer coefficients of model 1 are approximately 44~66% higher than those of the reference model 0. The model 1 show the best overall performance about heat transfer and cooling capability. As shown in above results, it is necessary to design the heat sink with air pass for cooling of electronic devices, in order to increase the convective heat transfer coefficient of a piezoelectric fan for electronic cooling.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.31-36
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• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.2
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• pp.137-146
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• 1998

The experimental study is concerned with two-phase closed thermosyphons, (i.e., wickless heat pipes) for the cooling of high power electronic components in telecommunication system. The thermosyphon which can deal with a high heat flux of up to $4.9W/cm^2$ is developed, and the cooling characteristics of thermosyphon is analyzed according to design parameters which are the types of and quantity of working fluid, number of pipes, wire insertion in pipe, inclination angle of thermosyphon, and cooling air velocity. Using water as working fluid is superior cooling performance compared to using acetone, and cooling performance is improved as the number of thermosyphon becomes larger, inserting wires in the pipes, and inclination of $30~60^{\circ}$.