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Heat Transfer Enhancement of a Piezoelectric Fan for Cooling of Electronic Devices

전자기기 냉각용 압전팬의 열전달 향상

  • Kim, Eun-Pil (Department of Refrigeration And Air-Conditioning Engineering, Pukyong National University) ;
  • Yoon, Jung-In (Department of Refrigeration And Air-Conditioning Engineering, Pukyong National University)
  • 김은필 (부경대학교 냉동공조공학과) ;
  • 윤정인 (부경대학교 냉동공조공학과)
  • Received : 2013.05.31
  • Accepted : 2013.08.06
  • Published : 2014.02.28

Abstract

Piezoelectric fans are thin elastic beams whose vibratory motion is actuated by means of a piezoelectric material bonded to the beam. These fans have found use as a means to enhance convective heat transfer while requiring only small amounts of power. This study presents new types of models with heat sink having air passage and investigates experimentally their heat transfer characteristics. From the comparison results for four models, the heat transfer coefficients of model 1 are approximately 44~66% higher than those of the reference model 0. The model 1 show the best overall performance about heat transfer and cooling capability. As shown in above results, it is necessary to design the heat sink with air pass for cooling of electronic devices, in order to increase the convective heat transfer coefficient of a piezoelectric fan for electronic cooling.

Keywords

References

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