• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.4
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• pp.67-75
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• 2020

This paper proposes a methodology for gantry route optimization in order to maximize the productivity of a odd-type surface mount device (SMD). A odd-type SMD is a machine that uses a gantry to mount electronic components on the placement point of a printed circuit board (PCB). The gantry needs a nozzle to move its electronic components. There is a suitability between the nozzle and the electronic component, and the mounting speed varies depending on the suitability. When it is difficult for the nozzle to adsorb electronic components, nozzle exchange is performed, and nozzle exchange takes a certain amount of time. The gantry route optimization problem is divided into the mounting order on PCB and the allocation of nozzles and electronic components to the gantry. Nozzle and electronic component allocation minimized the time incurred by nozzle exchange and nozzle-to-electronic component compatibility by using an mixed integer programming method. Sequence of mounting points on PCB minimizes travel time by using the branch-and-price method. Experimental data was made by randomly picking the location of the mounting point on a PCB of 800mm in width and 800mm in length. The number of mounting points is divided into 25, 50, 75, and 100, and experiments are conducted according to the number of types of electronic components, number of nozzle types, and suitability between nozzles and electronic components, respectively. Because the experimental data are random, the calculation time is not constant, but it is confirmed that the gantry route is found within a reasonable time.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.69-77
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• 2024

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2003.05a
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• pp.394-401
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• 2003

We consider a PCB grouping problem arising from the electronic industry. Given a surface mounting device, several types of PCBs and a number of component feeders used to assemble the PCBs. the optimization problem is the PCB grouping problem while minimizing setup time of component feeders. We formulate the problem as an Integer programming model and propose a column generation approach to solve the Integer programming formulation. In this approach we decompose the original problem Into master problem and column generation subproblem Starting with a few columns in the master problem. we generate new columns successively by solving subproblem optimally. To solve the subproblem. we use a branrh-and-rut approach. Computational experiments show that our solution approach gives high quality solutions in a reasonable computing time.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.41-47
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• 2007

Today lots of investigations on Embedded Passive Technology using materials and chip components have been carried out. We fabricated diplexers with 1005 sized-passives, which were made by burying chips in PCB substrate and surface mounting chip on PCB. 6 passive chips (inductors and capacitors) were used for the frequency divisions of $880\;MHz{\sim}960\;MHz(GSM)$ and $1.71\;GHz{\sim}1.88\;GHz(DCS)$. Two types of diplxer were characterized with Network analyzer. The chip buried diplexer showed extra 5db loss and a little deviation of 0.6GHz at aimed frequency areas, whereas the chip mounted diplexer showed man. 0.86dB loss within GSM field and max. 0.68dB within DCS field respectively. But few degradations were observed after $260^{\circ}C$ for 80min baking and $280^{\circ}C$ for 10sec solder floating.

• Journal of Aerospace System Engineering
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• v.18 no.2
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• pp.12-20
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• 2024

The application of reinforcement design to ensure the structural safety of electronics in small satellites is limited by the spatial constraints of the satellite structure during launch vibrations. Additionally, a reliable evaluation approach is needed for mounting highly integrated devices that are susceptible to fatigue failure. Although the Steinberg fatigue failure theory has been used to assess the structural integrity of electronic devices, recent studies have highlighted its theoretical limitations. In this paper, we propose a structural methodology based on the critical strain theory to design the digital control unit (DCU) of the X-band SAR payload component for the small SAR technology experimental project (S-STEP), a small satellite constellation. To validate the design, we conducted modal and random analyses using simplified modeling techniques. Based on our methodology, we ultimately demonstrated the structural safety of the electronics through analysis results, safety margin derivation, and functional tests conducted both before and after the launch test.