• Current Photovoltaic Research
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• v.4 no.4
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• pp.140-144
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• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1116-1122
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• 2010

Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.59-59
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• 2013

Ni-P 도금 피막층에 W를 함유시켜 고내식성을 목적으로 하는 Ni-W-P 도금에 대하여 연구 하였다. 도금액 조건의 최적화 및 도금온도와 pH 등이 가 피막특성에 미치는 영향을 조사하여 피막 크랙이 발생하지 않고 내식성 및 내마모성이 우수한 무전해 Ni-W-P 도금 공정을 확립하였다.

• Journal of the Korean institute of surface engineering
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• v.19 no.2
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• pp.31-43
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• 1986

The properties of the electroless nickel deposit mainly depends on the pH of the bath, the plating temperature, and the molar ratio of nickel to hypophosphite but they are also affected by its formulation and concentration of complexing and buffering agents. According to changeing the concentration of triethanolamine and boric acid, phosphorous contents, microsturcture, crystalline, hardness and wear resistance of deposits obtained from ammoniacal alkaline bath were investigated by EPMA, differential thermal analyser, X-ray diffractometer and wear tester. The results are as follows; (1) Increasing concentration of triethanolamine in the bath, the deposits is slightly inclined to increase its phosphorous content(3.7% P). (2) In the as-plated state, the deposits are not crystallized state but they are thermally unstable phase, and they are crystallized with precipitating $Ni_3P$ at 400$^{\circ}C$. (3) The deposit containing 2.3% P has higher hardness value in the as plated and heat treated state at below 300$^{\circ}C$ than those of 3.7% phosphorous deposit (1090Hk). But in the case of heat treating at 400$^{\circ}C$, the former has lower hardness value (1000Hk) than the latter and has remarkably Ni(III) orientation by heat treatment. (4) The 3.7% phosphorous deposit heat treated at 400$^{\circ}C$ has better wear resistance than hard chromium plating.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.349-349
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• 2015

최근 고용량의 리튬이온전지 개발이 절실하다. 흑연의 용량을 뛰어넘는 고용량 음극재료로서 흑연의 10배가 넘는 이론용량을 가지는 실리콘이 차세대 음극재료로 주목받고 있다. 그러나 실리콘은 큰 부피팽창과 낮은 전기전도도와 같은 문제점을 안고 있으므로 이를 해결하는 것이 시급하다. 따라서 본 연구에서는 이러한 실리콘 음극재료의 전기전도도 향상을 위해 무전해 Ni-B 도금을 이용하여 실리콘 파우더 표면에 Ni 금속을 부분적으로 형성시켰다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Transactions of the Korean hydrogen and new energy society
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• v.3 no.2
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• pp.9-15
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• 1992

Electroless copper plating method using an alkaline bath have been employed in copper coating of the (LM)Ni4.5Co0.1MnO.2A10.2 hydrogen storage alloy powders for electrode preparation. The plating were conducted without any pretreatment of alloy powders. For the preparation of the electrodes, about 0.12g of the copper coated alloy powder (copper to alloy ratio 1/3 by weight) was compacted with pressure of 6 tons/cm2 at room temperature. The disk-type compacts had a diameter of 10mm and thickness of about 0.24mm. The electrode characteristics were examined through SEM observations and electrochemical measurements in a half cell. The electrochemical measurement showed that the maximum discharge capacity of the electrodes prepared by using alkaline bath were 245mAh per gram of coated alloy (327mAh per gram of alloy) and appeared a considerable degradation with increasing number of cycles. The decrease of the discharge capacity after 100 cycles was about 30% It can be suggested that, with a slight of improvement, this electroless copper plating method could be applied to the preparation of the rare earth-nickel based alloy electrode.

• Journal of the Korean Electrochemical Society
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• v.10 no.2
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• pp.88-93
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• 2007

Nano-sized Sn particles were coated with Ni-P layer using an electroless deposition method and their anodic performance was tested for lithium secondary batteries. Uniform coating layers were obtained, of which the thickness was controlled by varying the $Ni^{2+}$ concentration in the plating bath. It was found that the Ni-P layer plays two important roles in improving the anodic performance of Sn powder electrode. First, it prevents the inter-particle aggregation between Sn particles during the charge/discharge process. Second, it provides an electrical conduction pathway to the Sn particles, which allows an electrode fabrication without an addition of conductive carbon. A pseudo-optimized sample showed a good cyclability and high capacity ($>400mAh\;g^{-1}$) even without conductive carbon loading.

• Journal of the Korean institute of surface engineering
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• v.27 no.4
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• pp.193-206
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• 1994

A wear behavior of electroless (Ni-P-X, X: SiC, $Al_2O_3$, Diamond) composite coating layers, formed under various conditions on commerical grade low carbon steel, has been investigated using Taber abrasion tester and scanning electron microscope. Several factors, which are type of particles, co-deposited content, particle size, distribution of particles and heat-treatment, influenced the wear resistance. The wear resistance of the composited coating layers after heat-treatment at $400^{\circ}C$ for 1 hr was increased 70 times with diamond, 15 times with SiC and 8 times with $Al_2O_3$, compared with the electroless nickel plating layer without heat-treatment.