• Title/Summary/Keyword: electrodeposited

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Investigation of Polypyrrole Coatings Containing Nanosized Metal Oxides for Corrosion Protection of AA2024 Al Alloy

  • Fekri, F.;Shahidi, M.;Foroughi, M.M.;Kazemipour, M.
    • Journal of Electrochemical Science and Technology
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    • v.10 no.2
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    • pp.148-158
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    • 2019
  • The corrosion protection of AA2024 PPy coated samples doping with nanosized metal oxides, including $TiO_2$ and $CeO_2$ nanoparticles and $Nd_2O_3$ nanorods, during exposure to the solutions of 0.1 M $H_2SO_4$ and 3.5% NaCl was evaluated by electrochemical impedance spectroscopy (EIS) and linear polarization resistance (LPR) techniques. The nanorods of $Nd_2O_3$ were synthesized by cathodic pulse electrochemical deposition technique. The barrier properties of the different PPy coatings containing nanosized metal oxides immersed in $H_2SO_4$ solution were ranked as follows: $Nd_2O_3$ > $TiO_2$ > $CeO_2$. Therefore, the $Nd_2O_3$ coating sample provided the highest corrosion protection at any time of immersion up to 72 hours after immersing in $H_2SO_4$ solution. On the other hand, the $CeO_2$ coating sample displayed the best anticorrosive properties among the other coating samples after immersion in NaCl solution up to 28 days. This is due to the inhibition effect of cerium ions on aluminum alloys at near-neutral solutions.

Microstructural Evolution and Optical Properties of Electrodeposited ZnO Nanorods with Deposition Time (전착 시간에 따른 ZnO 나노막대의 미세조직 변화와 광학적 성질)

  • Jeong, Yoon Suk;Moon, Jin Young;Kim, Hyunghoon;Lee, Ho Seong
    • Korean Journal of Metals and Materials
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    • v.49 no.5
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    • pp.406-410
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    • 2011
  • ZnO nanorods were prepared by the electrodeposition route on conductive Au/Si substrates. The effects of deposition time on the microstructural evolution and optical properties of ZnO nanorods were investigated. With increasing deposition time from 1 h to 20 h, the diameter and length of the ZnO nanorods increased gradually to about 328 nm and 6.55${\mu}m$, respectively. The ZnO nanorods were dense and vertically well-aligned. The photoluminescence (PL) peaks corresponding to the near band edge of ZnO were observed. With increasing deposition time, the intensity of PL peaks increased with nanorod growth up to 4 h and then decreased. This might be due to the degradation of crystal quality caused by merging of nanorods.

Effect of Hexa-methylenetetramine (HMT) on Nucleation and Growth Behaviors of Ni(OH)2 Nanosheets Produced by Electrodeposition (전착법으로 제작한 Ni(OH)2 나노 시트의 핵 형성과 성장 거동에 미치는 헥사-메틸렌테트라민(HMT)의 영향)

  • Kim, Dong Yeon;Son, Injoon;Choi, Mun-Hyun
    • Journal of Surface Science and Engineering
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    • v.54 no.1
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    • pp.37-42
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    • 2021
  • Electrodeposition is a synthetic method that allows fine control of the nucleation and growth factors of metals and is a suitable method for studying the nucleation and growth of Ni(OH)2. Hexa-methylenetetramine (HMT) helps to form Ni(OH)2 nanosheets by increasing the OH- of the nickel precursor solution and helps to improve the electrochemical properties of the electrode. In this study, the structural properties of Ni(OH)2 nanosheets according to the HMT concentration change using electrodeposition were studied. As the concentration of HMT increased, the size and thickness of the Ni(OH)2 nanosheet adsorbed on the surface increased and porosity increased. Also, the Scharifker-Hills nucleation theory model and experimental data were compared. In conclusion, the nanosheet shape of the HMT 7.5 mM sample electrodeposited with -0.85 V vs. Ag/AgCl grew most uniformly, and the best result was obtained as an electrode material for a pseudocapacitor.

Design Variables of Chemical-Mechanical Polishing Conditioning System to Improve Pad Wear Uniformity (패드 마모 균일성 향상을 위한 CMP 컨디셔닝 시스템 설계 변수 연구)

  • Park, Byeonghun;Park, Boumyoung;Jeon, Unchan;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.38 no.1
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    • pp.1-7
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    • 2022
  • Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.

LARGE MAGNETORESISTANCE OF SPUTTERED BI THIN FILMS AND APPLICATION OF SPIN DEVICE

  • M. H. Jeun;Lee, K. I.;Kim, D. Y.;J. Y. Chang;K. H. Shin;S. H. Han;J. G. Ha;Lee, W. Y.
    • Proceedings of the Korean Magnestics Society Conference
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    • 2003.06a
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    • pp.66-67
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    • 2003
  • Bismuth (Bi) has been an attractive materials for studying spin dependent transport properties because it shows very large magnetoresistance (MR) resulting from its highly anisotropic Fermi surface, low carrier concentrations, long carrier mean free path 1 and small effective carrier mass m*[1-3]. With all the intriguing properties, difficulty in fabrication of high quality Bi thin films may have prevented extensive application of Bi in magnetic field sensing and spin-injection devices. Previous works found that the surface roughness and small grain size in 100-200 nm of Bi thin film made by evaporation and sputtering are major causes of low MR. Although relatively higher MR in electrodeposited Bi followed by annealing was reported, it still suffers from rough sulfate roughness which is so severs that it is hardly able to make a field sensing and spin-injection device using conventional photolithography process.

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Synthesis of Silver Nanoparticles using Pulse Electrolysis in 1-n-butyl-3-methylimidazolium Chloride Ionic Liquid

  • Jeonggeun Jang;Jihee Kim;Churl Kyoung Lee;Kyungjung Kwon
    • Journal of Electrochemical Science and Technology
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    • v.14 no.1
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    • pp.15-20
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    • 2023
  • Ionic liquids are considered as a promising, alternative solvent for the electrochemical synthesis of metals because of their high thermal and chemical stability, relatively high ionic conductivity, and wide electrochemical window. In particular, their wide electrochemical window enables the electrodeposition of metals without any side reaction of electrolytes such as hydrogen evolution. The electrodeposition of silver is conducted in 1-n-butyl-3-methylimidazolium chloride ([C4mim]Cl) ionic liquid system with a silver source of AgCl. This study is the first attempt to electrodeposit silver nanoparticles without using co-solvents other than [C4mim]Cl. Pulse electrolysis is employed for the synthesis of silver nanoparticles by varying applied potentials from -3.0 V to -4.5 V (vs. Pt-quasi reference electrode) and pulse duration from 0.1 s to 0.7 s. Accordingly, the silver nanoparticles whose size ranges from 15 nm to ~100 nm are obtained. The successful preparation of silver nanoparticles is demonstrated regardless of the kinds of substrate including aluminum, stainless steel, and carbon paper in the pulse electrolysis. Finally, the antimicrobial property of electrodeposited silver nanoparticles is confirmed by an antimicrobial test using Staphylococcus aureus.

Pulse Electrodeposition of Polycrystalline Si Film in Molten CaCl2 Containing SiO2 Nanoparticles

  • Taeho Lim;Yeosol Yoon
    • Journal of Electrochemical Science and Technology
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    • v.14 no.4
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    • pp.326-332
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    • 2023
  • The high cost of Si-based solar cells remains a substantial challenge to their widespread adoption. To address this issue, it is essential to reduce the production cost of solar-grade Si, which is used as raw material. One approach to achieve this is Si electrodeposition in molten salts containing Si sources, such as SiO2. In this study, we present the pulse electrodeposition of Si in molten CaCl2 containing SiO2 nanoparticles. Theoretically, SiO2 nanoparticles with a diameter of less than 20 nm in molten CaCl2 at 850℃ have a comparable diffusion coefficient with that of ions in aqueous solutions at room temperature. However, we observed a slower-than-expected diffusion of the SiO2 nanoparticles, probably because of their tendency to aggregate in the molten CaCl2. This led to the formation of a non-uniform Si film with low current efficiency during direct current electrodeposition. We overcome this issue using pulse electrodeposition, which enabled the facile supplementation of SiO2 nanoparticles to the substrate. This approach produced a uniform and thick electrodeposited Si film. Our results demonstrate an efficient method for Si electrodeposition in molten CaCl2 containing SiO2 nanoparticles, which can contribute to a reduction in production cost of solar-grade Si.

The Effect of Electroplating Parameters on the Compositions and Morphologies of Sn-Ag Bumps (Sn-Ag 범프의 조성과 표면 형상에 영향을 미치는 도금 인자들에 관한 연구)

  • Kim, Jong-Yeon;Yoo, Jin;Bae, Jin-Soo;Lee, Jae-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.4
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    • pp.73-79
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    • 2003
  • With the variation of Ag concentration in bath, current density, duty cycle, additive and agitation for electroplating of Sn-Ag solder, the compositions and the morphologies of solder were studied. It was possible to controll Ag content in Sn-Ag solder by varying Ag concentration in bath and current density. The microstructure size of Sn-Ag solder decreased with increasing current density. Duty cycle of pulse electroplating and quantity of additive affected on Ag content of deposit and surface roughness. In this work eutectic Sn-Ag solder bumps with fine pitch of 30 $\mu\textrm{m}$ and height of 15 $\mu\textrm{m}$ was formed successfully. The Ag content of electrodeposited solder was confirmed by EDS and WDS analyses and the surface morphologies was analyzed by SEM and 3D surface analyzer.

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Characterization of the Cu-layer deposition time on Cu2ZnSnS4 (CZTS) Thin Film Solar Cells Fabricated by Electro-deposition (Cu층 증착시간에 따른 Cu2ZnSnS4 (CZTS) 박막의 특성)

  • Kim, Yoon Jin;Kim, In Young;Gang, Myeng Gil;Moon, Jong Ha;Kim, Jin Hyeok
    • Current Photovoltaic Research
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    • v.4 no.1
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    • pp.16-20
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    • 2016
  • $Cu_2ZnSnS_4$ (CZTS) thin films were fabricated by successive electrodeposition of layers of precursor elements followed by sulfurization of an electrodeposited Cu-Zn-Sn precursor. In order to improve quality of the CZTS films, we tried to optimize the deposition condition of absorber layers. In particular, I have conducted optimization experiments by changing the Cu-layer deposition time. The CZTS absorber layers were synthesized by different Cu-layer conditions ranging from 10 to 16 minutes. The sulfurization of Cu/Sn/Zn stacked metallic precursor thin films has been conducted in a graphite box using rapid thermal annealing (RTA). The structural, morphological, compositional, and optical properties of CZTS thin films were investigated using X-ray diffraction (XRD), Field emission scanning electron microscopy (FE-SEM), Raman spectroscopy, and X-ray Flourescenece Spectrometry (XRF). Especially, the CZTS TFSCs exhibits the best power conversion efficiency of 4.62% with $V_{oc}$ of 570 mV, $J_{sc}$ of $18.15mA/cm^2$ and FF of 45%. As the time of deposition of the Cu-layer to increasing, the properties were confirmed to be systematically changed. And we have been discussed in detail below.

Study on the Surface Morphology and Control of Impurity by Organic Additive for Tin electro-refining (주석 전해정련에서 유기첨가제에 따른 표면형상 및 전해불순물 제어에 관한 연구)

  • Park, Sung Cheol;Son, Seong Ho;Kim, Yong Hwan;Han, Chul Woong;Lee, Ki-Woong
    • Resources Recycling
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    • v.25 no.4
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    • pp.49-53
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    • 2016
  • The electro-refining process was performed to purify the casted tin crude metal from waste tin in methanesulfonic acid. The surface morphologies of electrodeposited tin on cathode were observed, the dendrite and delamination were inhibited by glycol group of organic additive. The impurity concentrations of tin crude metal and deposited metal were analyzed using ICP-OES. Quantitative analysis on casted tin crude metal showed that it consists of tin with 97.280 wt.% and several impurity metals of Ag, Cu, Pb, Ni, and etc. After tin electro-refining, the purity of tin increased up to 99.956 wt.%. Reduction current by cyclic voltammetry seems to be closely related to behavior of impurity in tin electro-refining.