• The Journal of the Acoustical Society of Korea
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• v.31 no.8
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• pp.514-522
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• 2012

The temperature dependence of the characteristics in a PZT-5 piezoelectric ceramic vibrator with the transverse mode was investigated in the range of $-100^{\circ}C$ to $90^{\circ}C$ using a thermal vacuum chamber to utilize the vibrator in aerospace industries. As the results, at room temperature, the resonant and anti-resonant frequencies had the minimum value, whereas, the dielectric constant increased linearly from about 2500 to 7500 in the given temperature range. The mechanical loss decreased linearly from 0.08 to 0.03. Through the regression analysis, the temperature dependence functions of the characteristics were derived to linear and square regression functions. Applying the functions, the input admittance characteristics of the piezoelectric vibrator were calculated, and the results showed good agreement with measured ones. It can be confirmed that this method is useful to estimate the characteristics change of the piezoelectric vibrator caused by the temperature change under the space environment.

• Polymer(Korea)
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• v.31 no.6
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• pp.543-549
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• 2007

We synthesized various polyurethanes(PU) haying different hard segments with different molecular weights of the soft segment to explore the effect of structure on the dispersion of silver particle in the phase of synthesized polyurethanes matrix. The thermal stability was increased by increasing the number of aromatic compound, while the degree of dispersion for silver particle was decreased. Silver particles showed better dispersion in the PU matrix having aromatic compounds when the soft segments were held constant. On the contrary, when the hard segment was held constant, silver particles on the PU matrix haying low $M_w$ of soft segment showed better dispersion than high $M_w$ of soft segment because poor chain mobility of low $M_w$ of soft segment restricted re-aggregation of silver particle. A sheet resistance of composite materials showed different aspects. In this case, the inter connection between silver particles was more important than its dispersion. In this study, the NDI-PEG 900/silver particle composite film showed the best thermal stability and electro conductivity.

• Korean Chemical Engineering Research
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• v.47 no.2
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• pp.203-207
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• 2009

In the NCAs(non-conductive adhesive) for adhesion of Micro Electro Mechanical System(MEMS), there are some problems such as delamination and cracking, because of the differences of CTE(coefficients of thermal expansion) between NCAs and substrates. Addition of inorganic particle or flexibilizer have been performed to solve those problems. In this study, to improve the flexibility of epoxy adhesive, epoxy/siloxane composites were prepared by adding 1, 3, or 5 phr of amino modified siloxane(AMS). Glass transition temperatures(Tg), moduli and CTE of those composites were measured to confirm effects of siloxane on thermal/mechanical properties of siloxane/epoxy-composites. Tg of AMS/epoxy-composites decreased from $134^{\circ}C$ to $122^{\circ}C$ with increasing AMS contents and moduli decreased from 2,425 MPa to 2,143 MPa with increasing AMS contents. But CTE of AMS/epoxy-composites increased from $67ppm/^{\circ}C$ to $71ppm/^{\circ}C$ with increasing AMS contents. In short, the addition of siloxane is effective for enhancing the flexibility of epoxy but leads to the decrease of Tg.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.1-7
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• 2006

In this paper, warpage magnitude and shape of printed-circuit board in case that properties of core and thickness of solder resist are varied are investigated. The cause of warpage is coefficient of thermal expansion differences of stacked materials. Therefore, we need small difference of coefficient of thermal expansion that laminated material, and need to decrease asymmetric of top side and bottom side in structure shape. Also, we can control occurrence of warpage heightening hardness of core in laminated material. Composite material that make core are exploited in connection with the structural bending twisting coupling resulting from directional properties of fiber reinforced composite materials and from ply stacking sequence. If we use such characteristic, we can control warpage with change of material properties. In this paper, warpage of two layer stacked chip scale package is investigated, and evaluate improvement result using an experiment and finite element method tool.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.43 no.2
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• pp.149-155
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• 2015

MEMS-based louver and shutter type conventional variable emissivity radiators change their emissivity properties in accordance with a temperature condition to achieve efficient thermal control performance. However, there are some drawbacks such as a structural safety of the mechanical moving parts under sever launch environment and constant power consumption to maintain the intended emissivity. In this study, to overcome above drawbacks, we proposed a MEMS-based variable emissivity radiator, which can change the emissivity property according to the polarity change of electrodes by using electric charge of the bead. The effectiveness of the optimized radiator design has been demonstrated through the comparison of efficiency with the fixed emissivity radiator.

• Transactions of the Korean Society of Automotive Engineers
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• v.14 no.2
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• pp.174-183
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• 2006

The resistance spot-welded region in most current finite element crash models is characterized as a rigid beam at the location of the welded spot. The region is modeled to fail with a failure criterion which is a function of the axial and shear load at the rigid beam. The role of this rigid beam is simply to transfer the load across the welded components. The calculation of the load acting on the rigid beam is important to evaluate the failure of the spot-weld. In this paper, numerical simulation is carried out to evaluate the calculation of the load at the rigid beam. The load calculated from the precise finite element model of the spot-welded region considering the residual stress due to the thermal history during the spot welding procedure is regarded as the reference value and the value of the load is compared with the one obtained from the spot-welded model using the rigid beam with respect to the element size, the element shape and the number of imposed constraints. Analysis results demonstrate that the load acting on the spot-welded element is correctly calculated by the change of the element shape around the welded region and the location of welded constrains. The results provide a guideline for an accurate finite element modeling of the spot-welded region in the crash analysis of vehicles.

• Journal of the Korean Magnetics Society
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• v.24 no.6
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• pp.186-190
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• 2014

To establish the coating conditions for $^{57}Co$, non-radioactive Co ions are dissolved in an acid solution and electroplated on to a copper plate. Then, the thermal diffusion of electroplated Co into a copper matrix was studied to apply a $^{57}Co$ $M{\ddot{o}}ssbauer$ source. Nanocrystalline Co particles were coated on a Cu substrate using DC electro-deposition at a pH of 1.89 to 5 and $20{\sim}30mA/cm^2$. The average grain size was up to 54 nm as the pH increased to 5. The second phase of Co-oxide was formatted as the pH was increased above 4. The diffusion degree was evaluated by mapping using scanning electron microscopy (SEM). The influence of different annealing conditions was investigated. The diffusion depth of Co depends on the annealing temperature and time. The results obtained confirm that the deposited Co diffused almost completely into a copper matrix without substantial loss at an annealing temperature of $900^{\circ}C$ for 2 hours.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.22 no.6
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• pp.565-572
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• 2009

This work intends to establish the reliability and fracture toughness $K_{IC}$ criterion of welded joints by EGW for high strength EH36-TMCP ultra thick plate. For this, firstly thermo elasto-plastic analysis has been carried out on two pass X-groove butt joint model to clarify the thermal and mechanical behaviour(residual stress, plastic strain, magnitude of stress and their distribution and production mechanism). Moreover, to establish fracture criterion, analysis of fracture toughness $K_{IC}$ has been performed under the notch machined and residual stress with the load condition on EGW welded joints. A quantitative fracture criterion for EGW welded joints is suggested by using $K_{IC}$.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Polymer(Korea)
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• v.37 no.6
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• pp.736-743
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• 2013

Novel carbazole based copolymers were synthesized by Suzuki coupling polymerization. (Diphenylene)vinylene and n-octyl was introduced to carbazole as pendants for reducing band gap and improving solubility, respectively. Thermal, photoluminescence and electro-luminescence of copolymers were studied for applying the emitting layer of polymer light emitting diode (PLED). Maximum UV-vis absorption and photoluminescence (PL) emission wavelength of copolymers showed 333~340 nm and 409~464 nm in solution state, respectively. The relative quantum yield using 9,10-diphenylanthracene as a reference was 25.8%. These copolymers exhibited high thermal stability ($T_d$ = $350^{\circ}C$) and good film forming ability. Good luminance was obtained at voltages lower than 8 V and the onset voltage was observed at 4.0 V.