• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.2
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• pp.236-242
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• 2003

Thermal bubbles find their diverse application areas in the MEMS (MicroElectroMechanial Systems) technology, including bubble jet printers, microactuators, micropumps, etc.. Especially, microactuators and micropumps, which use a microbubble growing by a controlled heat input, frequently involve mechanical and thermal interaction of the bubble with a solid structure, such as a cantilever beam and a membrane. Although the concept is experimentally verified that an internal pressure of the bubble can build up high enough to deflect a thin solid plate or a beam, the physics of the entire process have not yet been thoroughly explored. This work reports the experimental study of the growth of a thermal bubble while deflecting a thin cantilever beam. A physical model is presented to predict the elastic response of the cantilever beam based on the experimental measurements. The scaling law constructed through this work can provide a design guide for micro- and nano-systems that employ a thermal bubble for their actuation/pumping mechanism.

• Journal of Electrical Engineering and Technology
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• v.12 no.1
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• pp.284-287
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• 2017

This paper introduces liquid crystal (LC) alignment and its electro-optical properties in the LC cells with silver nanowire (AgNW) networks. The AgNW network was used as an electrode of LC cell as a substitute for an indium-tin-oxide (ITO) film. LC alignment characteristics in the LC cell using AgNW networks, which have two different sheet resistances of $60{\Omega}/m^2$ and $80{\Omega}/m^2$, were observed. The LC alignment characteristics including pretilt angle, LC alignment state, and thermal stability are similar irrespective of sheet resistance of AgNW network. However, twisted-nematic (TN)-LC cell normally operated when using AgNW network with sheet resistance of $80{\Omega}/m^2$. Electrooptical properties of TN-LC cell exhibited competitive performance compared to those of TN-LC cell based on conventional ITO electrode, which allow new approaches to replace conventional ITO electrode in display technology.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.709-712
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• 2002

For the electro-discharge machining of an electro-conductive anisotropic composite, an unsteady state formulation was established and solved by Galerkin's finite element method. The distribution of temperature on work piece, the shape of the crater and the material removal rate were obtained in terms of the process parameters. As the spark was initiated the workpiece immediately started to melt and the heat affected zone was formed. The moving boundary of the crater was also identified with time. When the radial and axial conductivities were increased separately the temperature distribution and the shape of the crater were shifted in the same direction respectively and the material removal rate was found to be higher in the case of increasing radial conductivity rather than the axial conductivity.

• Proceedings of the KIEE Conference
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• 2001.04a
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• pp.44-46
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• 2001

This paper describes the use of the PHOENICS CFD package for the simulation of the high-current period of the arcing process in a hybrid rotating arc/auto expansion by interrupter. The operating principle of this device depends on rapid arc rotation due to the magnetic field created by the fault current through a coil which is mounted on contacts and also relies on the principle of thermal expansion created by arc energy in extinguishing chamber and finally causes pressure rise in expansion volume. This paper is divided into three main sections. The first gives a brief overview of the interrupter. The second section gives a full description of the methods used in the calculation. The final section presents some sample results for the hybrid interrupter.

• Journal of the Optical Society of Korea
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• v.16 no.3
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• pp.282-287
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• 2012

In this paper, we have proposed a principle to design a compact and temperature independent electro-optic switch based on a slotted photonic crystal directional coupler (SPCDC). Infiltration of the slotted silicon photonic crystal with polymer enhances the slow light and decreases the switching length, whereas the different signs of thermo-optic coefficients of the polymer and silicon make the proposed switch stable within $25^{\circ}C$ to $85^{\circ}C$ temperature range. The SPCDC structure is modified to increase poling efficiency of the polymer in the slot and to flatten the dispersion diagram of the even mode to minimize the switching length.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.559-560
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• 2006

Inkjet Printing is very attractive method for direct patterns with no masks, In order to Achieve direct printing with nano metal, It is often necessary to print them with highly concentrated Ink We research the High Concentrated silver nano ink. Formulation which has a good thermal stability and storage stability and jet stability using a ethylene glycol ether. Normally Alcohol-based inks can be sensitive But High boiling point ethylene glycol ether base Ink is creating a stable meniscus and minimum maintenance issues. We are reaching a 50~60wt% high Silver Ink using a Hydrophilic Ag Nano powder. (30~50nm)

• Structural Engineering and Mechanics
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• v.71 no.1
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• pp.23-35
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• 2019

In this study we derive the governing equations of a functionally graded piezoelectric disk, subjected to thermo-electro-mechanical loads. First order shear deformation theory is used for description of displacement field. Principles of minimum potential energy is used to derive governing equations in terms of components of the displacement field and the electric potential. The governing equations are derived for a disk with variable thickness. The numerical results are presented in terms of important parameters of the problem such as profile of variable thickness, in-homogeneous index and other related parameters.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Current Optics and Photonics
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• v.1 no.2
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• pp.143-149
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• 2017

LED arrays with pixel numbers of $3{\times}3$, $4{\times}4$, and $5{\times}5$ have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of $280{\times}280{\mu}m$) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the $3{\times}3$, $4{\times}4$, $5{\times}5$ arrays were $52^{\circ}C/W$, $69.7^{\circ}C/W$, and $84.3^{\circ}C/W$. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with $40{\mu}m$ pixel pitch and $150{\mu}m$ substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.10
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• pp.894-900
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• 2006

This paper reports the fabrication and characterization of $32{\times}32$ thermal cantilever array for nano-scaled memory device applications. The $32{\times}32$ thermal cantilever array with integrated tip heater has been fabricated with micro-electro-mechanical systems(MEMS) technology on silicon on insulator(SOI) wafer using 9 photo masking steps. All of single-level cantilevers(1,024 bits) have a p-n junction diode in order to eliminate any electrical cross-talk between adjacent cantilevers. Nonlinear electrical characteristic of fabricated thermal cantilever shows its own thermal heating mechanism. In addition, n-channel high-voltage MOSFET device is integrated on a wafer for embedding driver circuitry.