• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.205-206
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• 2011

Cu thin films for electromagnetic wave shielding were prepared on PET film and Ni-coated PET film by using Dry and Wet coating method, such as evaporation method, DC sputtering method and copper sulfate($CuSO_4$). After that, Zn thin film and Ni thin film were prepared onto the Cu thin films by using evaporation dry process and Ni electro plating wet process as a finishing treatment, respectively. The result of conductivity test and corrosion resistance test revealed Cu thin films which were formed with bigger grain size and high Cu composition rate have superior properties. Zn thin film by dry evaporation process and Ni thin film by wet electro plating process on Cu thin films were largely contributed to corrosion resistance. However, Ni thin film by wet process made conductivity of all specimen worse, the other hand, Zn thin film by dry process made it better to improve condictivity of specimens just prepared by dry process.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• 한국산학기술학회논문지
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• 제18권5호
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• pp.674-680
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• 2017

본 논문은 현재 개인 휴대기기 및 대형 디스플레이 장비의 제어에서 폭넓게 사용되고 있는 터치스크린 패널 (TSP; Touch Screen Panel)의 정상 작동 유무를 확인하기 위한 micro bump 제작 기술에 관한 연구이다. 터치스크린 패널은 감압식, 정전식 등의 여러 가지 방식이 있으나 지금은 편리성에 의하여 정전식 방식이 주도하고 있다. 정전식의 경우 해당하는 좌표의 접촉에 따라 전기적 신호가 변화하게 되고, 이를 통하여 접촉 위치를 확인할 수 있으며 따라서 접촉 위치에 따른 전기 특성 검사가 필수적이다. 검사공정에서 TSP의 모델이 변경됨에 따라 새로운 micro bump를 제작이 및 검사 프로그램의 수정이 필수적이다. 본 논문에서는 새로운 micro bump 제작 시 mask를 사용하지 않아 보다 경제적이며 변화에 대응이 유연한 maskless lithography 시스템을 이용하여 micro bump 제작 가능성에 대하여 확인하였다. 이를 위하여 제작되는 bump의 pitch에 따른 전기장 간섭 시뮬레이션을 진행하였으며, maskless lithogrphy 공정을 적용하기 위한 패턴 이미지를 생성하였다. 이후 MEMS 기술에 해당하는 PR(Photo Resist) 패터닝 공정에서 노광(Lithography) 공정 및 현상(Developing) 공정을 통하여 PR 마스크를 제작한 후 electro-plating 공정을 통하여 micro bump를 제작하였다.

• 폴리머
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• 제26권1호
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• pp.105-112
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• 2002

연구는 electro-active polymer(EAP)의 특성을 가지는 ion-exchange polymer metal composite(IPMC)을 이용하여 지능형 대장내시경 개발에 목적을 두고 있다. IPMC는 낮은 구동전압과 빠른 반응속도로 인하여 매우 매력적인 물질이다. 본 연구에서는 IPMC구동기의 전극을 무전의 도금 방법을 이용하여 용액함침-환원방법(impregnation-reduction method)으로 제조하였으며 코팅된 백금전극의 횟수에 따라 변위와 변화를 측정하였다. 구동특성을 알아보기 위하여 길이, 주파수에 대한 변위, 힘을 측정하였으며, 주파수 대역은 저주파 대역과 공명주파수 대역을 사용하는 것이 적합하다는 결론을 얻었다. 또한 다양한 구동적 특성과 수분의 함량에 따른 영향에 대해 고전적 적층 이론 (classical laminate theory, CLT)을 이용하여 이방성 IPMC의 응력분포와 수분이동에 따른 모멘트, 변형률, 곡률(cuvature)을 모델링 하였다.

• 한국표면공학회지
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• 제41권5호
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• pp.240-244
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• 2008

Composite plating is a method of co-deposition of plating layer with metallic and/or non-metallic particles to improve the plating layer properties such as high corrosion resistance and photolysis of organic compounds. The properties of nickel-ceramic composite plating are significantly depend on the surface characteristics of co-deposited particles as well as the quantity in electrolyte. In this study, Ni-$TiO_2$ composite coating layer was produced by electrodeposition technique from non-aqueous eletrolyte and its surface characteristics as well as photolytic properties were investigated. The amounts of immobilized $TiO_2$ particles increased with increasing the initial $TiO_2$ particles contents in the bath. Samples electroplated with the current density of $0.5\;A/dm^2$ showed the significantly improved homogeneous $TiO_2$ particles distribution. The corrosion resistance of Ni-$TiO_2$ composite coating layer also improved with increaing the amounts of $TiO_2$ particles. Etched sample showed about 10% increased photolytic rate of organic matter compare to that of the non-etched.

• 한국표면공학회지
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• 제51권4호
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• pp.191-196
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• 2018

The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.

• 대한금속재료학회지
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• 제49권5호
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• 한국가스학회지
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• 제26권3호
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• pp.21-26
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• 2022

아연은 인체에 유해한 카드뮴을 대체하여 금속재료에 수소가스가 침투하거나 금속재료 내부로부터 수소가 누출되는 것을 방지하기 위한 친환경 코팅 재료로 주목받고 있다. 일반적으로 수성 및 산성 분위기에서 수행되는 아연(Zn) 및 아연 합금의 전기도금은 낮은 쿨롱 효율, 부식 및 수소 누출과 같은 단점이 있어 산업적 이용이 어렵다. 본 연구에서는 염화콜린과 에틸렌글리콜을 이용하여 Deep-eutectic solvent를 합성하고 이를 용매로 사용하여 아연 도금용 전해질을 제조하여 STS 304 기판 위에 전기 도금하였다. 주사전자현미경(SEM)과 원자힘현미경(AFM)을 이용하여 표면 미세구조와 조도를 관찰하였다. X선회절분석(XRD)을 이용하여 도금 막의 결정구조를 분석하였다. 마지막으로 수소를 주입한 STS 304 기판에 최적화된 Zn 도금액을 코팅한 시료의 수소 방출 방지 효과를 분석하였다.

• 자원리싸이클링
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• 제10권3호
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• pp.23-28
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• 2001

Magnetite가 주성분인 산화철 폐촉매를 이용하여 도금폐수중 아연이온을 pH 2.0이상에서 98.7% 이상 회수하였다. 폐촉매의 포화자화값은 59.4 smug으로 폐수처리후 자기적방법에 의해 고.액분리가 가능하다. 산화철 .폐촉매에 의한 폐수중 아연이온의 회수메카니즘은 pH 3.0-8.5 범위에서는 폐촉매 표면에서 $Zn^{2+}$ 이온의 정전기적 흡착이며 pH 8.5 이상에서는 $Zn(OH)_2$의 침전이라고 생각한다.

• E2M - 전기 전자와 첨단 소재
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• 제9권1호
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• pp.51-58
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• 1996

This report describes thick traveling-wave electrode formation and microwave transmission characteristics of the fabricated electrodes. Effective refractive indices of the microwave in the 5 micron CPW type traveling-wave electrodes is around 2.45 according to the results of time domain S parameter measurements. The bandwidth of the electrodes is about 10 GHz and could be extended to 15 GHz through optimization of the process. The developed process technique that enables plating of micropatterns upto 20 micron can be applied to broadband optical intensity modulators.