• Clean Technology
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• v.17 no.2
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• pp.103-109
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• 2011

The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

• Journal of the Korean Geotechnical Society
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• v.18 no.1
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• pp.49-57
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• 2002

During the electrokinetic remediation, direct current applied to a soil-water-electrolyte system derives the variations of fluid transport phenomena in soil-water system and soil-water interface characteristics. Therefore, these variations affect the electrokinetic reaction. In this study, lab-scale electrokinetic remediation tests were performed to characterize the electrical and chemical parameters variation in soil. During the test, voltage gradient, electrical current, zeta potential and pH variations were measured. On the basis of experimental results, computer modeling techniques predicting the variations of these parameters are suggested.