• Korean Journal of Materials Research
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• v.23 no.10
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• pp.550-554
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• 2013

As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.50-54
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• 2004

A numerical system to extract effective elastic properties of polycrystalline thin-films for MEMS devices is already developed. In this system, the statistical model based on lattice system is used for modeling the microstructure evolution simulation and the key kinetics parameters of given micrograph, grain distributions and deposition process can be extracted by inverse method proposed in the system. In this work, the effects of kinetics parameters on the extraction of effective elastic properties of polycrystalline thin-films are studied by using statistical method. The effects of the fraction of the potential site( $f_{P}$ ) and the nucleation probability( $P_{N}$ ) among the parameters for deposition process of microstructure on the extraction of effective elastic properties of polycrystalline thin-films are studied.d.d.

• Transactions on Electrical and Electronic Materials
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• v.6 no.5
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• pp.238-242
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• 2005

The Pt counter electrode of a dye-sensitized solar cell (DSSC) plays a role in helping redox reaction of iodine ions in electrolyte, also, transferring electrons into electrolyte. In this case, it is expected that characteristics of Pt electrodes strongly depend on fabrication process and its surface condition. In this study, Pt electrodes were prepared by a electro-deposition and a RF magnetron sputtering. Electrochemical behavior of Pt electrodes was compared using cyclic-voltammetry and impedance spectroscopy. Surface morphology of Pt electrodes was investigated by FE-SEM and AFM. I-V characteristics of DSSC were measured and discussed in association with the surface properties of counter electrode. As a result, electrochemical properties of electro-deposited Pt electrode were superior to that of sputtered Pt electrode. This is likely that enlarged area of surface in electro-deposited Pt electrode in comparison with the case of sputtered Pt electrode playa role in enhancing such electrochemical properties.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.386.1-386.1
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• 2014

The ionic polymer-metal composite (IPMC), a type of electro-active polymer material, has received enormous interest in various fields such as robotics, medical sensors, artificial muscles because it has many advantages of flexibility, light weight, high displacement, and low voltage activation, compare to traditional mechanical actuators. Mostly noble metal materials such as gold or platinum were used to form the electrode of an IPMC by using electroless plating process. Furthermore, carbon-based materials, which are carbon nanotube (CNT) and reduced graphene-CNT composite, were used to alter the electrode of IPMC. To form the electrode of IPMC, we employ the synthesized graphene on copper foil by chemical vapor deposition method and use the transfer process by using a support of PET/silicone film. The properties of graphene were evaluated by Raman spectroscopy, UV/Vis spectroscopy, and 4-point probe. The structure and surface of IPMC were analyzed via field emission scanning electron microscope. The fabricated IPMC performance such as displacement and operating frequency was measured in underwater.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.597-598
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• 2006

In this study, we used the ESD method to prepare the protein microarrays for observation the stem cell responses to pattern size, space and shapes. The ESD method allows a reduction in spot size, high efficiency of substance transfer, and high rate in fabrication as a result of ability to simultaneously deposit thousands of identical spots. Typical electro spraying conditions for the deposition of proteins were a voltage of $3{\sim}5keV$ and the humidity under 30%. The patterns of masks have a variety of shapes, spaces, and hole sizes from 10 um to $300{\mu}m$. Three kinds of proteins(collagen, fibronectin, and vitronectin dissolved in PBS) are deposited in a dry state, preserving the functional activity of proteins. Stem cells were cultured on each protein patterned sample at $37^{\circ}C$ for 1day.

• Nuclear Engineering and Technology
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• v.54 no.2
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• pp.644-652
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• 2022

During the pyroprocessing operation, various signals can be collected by process monitoring (PM). These signals are utilized to diagnose process states. In this study, feasibility of using PM for nuclear safeguards of electrorefining operation was examined based on the use of machine learning for detecting off-normal operations. The off-normal operation, in this study, is defined as co-deposition of key elements through reduction on cathode. The monitored process signal selected for PM was cathode potential. The necessary data were produced through electrodeposition experiments in a laboratory molten salt system. Model-based cathodic surface area data were also generated and used to support model development. Computer models for classification were developed using a series of recurrent neural network architectures. The concept of transfer learning was also employed by combining pre-training and fine-tuning to minimize data requirement for training. The resulting models were found to classify the normal and the off-normal operation states with a 95% accuracy. With the availability of more process data, the approach is expected to have higher reliability.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.2314-2320
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• 2015

MBR (Membrane Bio-Reactor) process is known to consume enormous energy to control membrane fouling. To solve this problem, electro-coagulation technique has been applied to MBR. A series of electro-coagulation was applied to activated sludge suspension under different current density condition. After the electro-coagulations, membrane filtration of the activated sludge suspensions was conducted to investigate the effect of electro-coagulation on the fouling. As current density increased 10 to 40A/m2, the total fouling resistance (Rc+Rf) decreased from 18 to 79%, showing that the electro-coagulation improved the membrane filtration efficiency. Both the organic concentration in bulk and the particles size distribution were not nearly changed before and after the electro-coagulation. The enhanced filtration efficiency might be due to the aluminum hydroxide generated from chemical precipitation, which can be acted as a dynamic membrane preventing a deposition of foulants on membrane surfaces.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.100-101
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• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.348-348
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• 2009

The conductive coating method is used for various industrial fields. For example, Sputtering process is used to coat ITO layer in LCD or OLED panel manufacture process and fabricate a base layer of substrate of an electric printing device. However, conventional coating processes (beam sputtering, spin coating etc.) has a problems in the industrial manufacturing process. These processes have a very high cost and critical manufacturing environment as a vacuum process. Recently, many researchers have proposed various printing process instead of conventional coating processes. In this paper, we propose an ESD printing process in ITO coating layer and apply to fabricate a conductive coating film. Furthermore, the effect of the nozzle and also the applied voltage on different configuration of the nozzle head was also studied for better understanding of the Electro Static deposition process.