• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.3
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• pp.129-134
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• 2020

Moisture infiltration inside the solar cell module, filling of EVA sheet, melting of the frame seal, and deterioration of power generation performance in the module one year after installation are occurring. Whitening phenomenon, electrode corrosion phenomenon, and dielectric breakdown phenomenon are appearing in solar cell module installed in Korea before 5-7 years, leading to deterioration of power generation performance, and big problems for long-term reliability and long life technology are emerging. Therefore, in order to solve these problems, the development of a micro inverter (MiCrco Inverter Converter, MiC) including the function of securing the durability of the solar cell module and monitoring the aging progress and the solar cell based on the monitoring data from the MiC smart monitoring programs have been proposed to determine the aging of modules. In addition, in order to become a highly efficient solar smart monitoring system through systematic operation management through IT convergence with MiC that has enhanced monitoring function of solar cell module, SoC(System On Chip) in micro inverter is the environment for solar cell module. There is a demand for functions that can detect information in a complex manner and perform communication and control when necessary. Based on these requirements, this paper aims to develop SoC-based low-cost MiC smart photovoltaic system technology.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.6
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• pp.272-277
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• 2010

The glass-ceramics containing bottom ash (B/A) which was a by-produced from an electrical power plant was fabricated and its crystalline phase, microstructure and mechanical properties were analyzed. At first, the glass was fabricated by adding modifier oxide $Li_2O$ to lower the melting temperature of coal bottom ash. The glass obtained was heat-treated by using a 2-stage process to crystallize, that is to say, to increase the degree of crystallization in the glass-ceramics, the first heat treatment for nucleation was performed followed by the secondary one for the growth of nucleates. The main crystalline phase formed in the glass-ceramics was ${\beta}$-spodumene and the secondary phase was $L_2SiO_3$. It was recognized that the degree of crystallization of glass-ceramics was increased with a holding time of the secondary heat treatment stage. In the case of the specimens hold up to 3 hour, the crystallization was not completed and the microstructures and morphologies of crystalline phase were not uniform. In the specimens of holding time over 9 hours, the cracks were generated inside of it, so its compressive strength would decrease due them. In conclusion, it was able to obtain the optimum condition to fabriate the glass-ceramics having the properties of high crystallization degree, uniform microstructures and morphologies and the high mechanical strength.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.211-211
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• 1999

Titanium nitride (TiN) thin films have useful properties including high hardness, good electrical conductivity, high melting point, and chemical inertness. The applications have included wear-resistant hard coatings on machine tools and bearings, decorative coating making use of the golden color, thermal control coatings for widows, and erosion resistant coatings for spacecraft plasma probes. For all these applications as feature sizes shrink and aspect ratios grow, the issue of good step coverage becomes increasingly important. It is therefore essential to manufacture conformal coatings of TiN. The growth of TiN thin films by chemical vapor deposition (CVD) is of great interest for achieving conformal deposition. The most widely used precursor for TiN is TiCl4 and NH3. However, chlorine impurity in the as-grown films and relatively high deposition temperature (>$600^{\circ}C$) are considered major drawbacks from actual device fabrication. To overcome these problems, recently, MOCVD processes including plasma assisted have been suggested. In this study, therefore, we have doposited Ti(C, N) thin films on Si(100) and D2 steel substrates in the temperature range of 150-30$0^{\circ}C$ using tetrakis diethylamido titanium (TDEAT) and titanium isopropoxide (TIP) by pulsed DC plamsa enhanced metal-organic chemical vapor deposition (PEMOCVD) method. Polycrystalline Ti(C, N) thin films were successfully grown on either D2 steel or Si(100) surfaces at temperature as low as 15$0^{\circ}C$. Compositions of the as-grown films were determined with XPS and RBS. From XPS analysis, thin films of Ti(C, N) with low oxygen concentration were obtained. RBS data were also confirmed the changes of stoichiometry and microhardness of our films. Radical formation and ionization behaviors in plasma are analyzed by optical emission spectroscopy (OES) at various pulsed bias and gases conditions. H2 and He+H2 gases are used as carrier gases to compare plasma parameter and the effect of N2 and NH3 gases as reactive gas is also evaluated in reduction of C content of the films. In this study, we fond that He and H2 mixture gas is very effective in enhancing ionization of radicals, especially N resulting is high hardness. The higher hardness of film is obtained to be ca. 1700 HK 0.01 but it depends on gas species and bias voltage. The proper process is evident for H and N2 gas atmosphere and bias voltage of 600V. However, NH3 gas highly reduces formation of CN radical, thereby decreasing C content of Ti(C, N) thin films in a great deal. Compared to PVD TiN films, the Ti(C, N) film grown by PEMOCVD has very good conformability; the step coverage exceeds 85% with an aspect ratio of more than 3.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.51-57
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• 2010

Thermoelectric properties of the p-type $(Bi,Sb)_2Te_3$, hot-pressed with the $(Bi,Sb)_2Te_3$ powders fabricated by melting/grinding method, were characterized with variation of the hot-pressing conditions. Thermoelectric characteristics of the hot-pressed $(Bi,Sb)_2Te_3$ were also analyzed with addition of $ZrO_2$ as nano inclusions. With increasing the hotpressing temperature from $350^{\circ}C$ to $550^{\circ}C$, Seebeck coefficient and electrical resistivity decreased from 275 ${\mu}V$/K to 230 ${\mu}V$/K and 6.68 $m{\Omega}$-cm to 1.86 $m{\Omega}$-cm, respectively. The power factor decreased with addition of $ZrO_2$ nano powders more than 1 vol%, implying that the optimum amount of $ZrO_2$ nano inclusions to get a maximum power factor would be less than 1 vol%.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.1
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• pp.43-52
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• 2010

Glass was fabricated by using refused coal ore obtained from Dogye coal mine in Samchuk. We additionally used soda ash and calcium carbonate as raw materials to make a glass with the chemical composition of soda-lime glass. And the properties of glass were measured when limestone was used as natural raw materials instead of calcium carbonate as chemical raw materials. Transparent glass was fabricated by melting raw materials at $1550^{\circ}C$ for 1 hr in an electrical furnace. The various kinds of glass samples were fabricated according to the kinds of refused coal ore and glass cullet. The optical properties of transmittance and color chromaticity were measured by UV/VIS/NIR spectrometer and the thermal properties of thermal expansion coefficient and softening point were measured. Transparent glass with the transmittance of over 70% in visible range was fabricated by using normal refused coal ore and black colored glass with the transmittance of 0~35% was fabricated by using shel1 type refused coal ore. Therefore, it is concluded that refused coal ore can be used for raw materials to manufacture secondary glass products such as a glass tile and foamed glass panel for construction material.

• Journal of Sensor Science and Technology
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• v.8 no.3
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• pp.239-246
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• 1999

A highly sensitive photovoltaic infrared photodiode was fabricated for detecting infrared light in $3{\sim}5\;{\mu}m$ wavelength range on InSb wafer with p-i-n structure grown by MOCVD. Silicon dioxide($SiO_2$) insulating films for the junction interface and surface of photodiode were prepared using RPCVD because InSb has low melting point and evaporation temperature. After formation of In ohmic contacts by thermal evaporation, the electrical properties of the photodiode were characterized in dark state at 77K. A product of zero-bias resistance and area($R_0A$) showed $1.56{\times}10^6\;{\Omega}{\cdot}cm^2$ that satisfied BLIP(background limited infrared photodetector) condition. When the photodiode was tested under infrared light, the normalized detectivity of about $10^{11}\;cm{\cdot}Hz^{1/2}{\cdot}W^{-1}$ was obtained. we successfully fabricated a unit cell with InSb IR array with good quantum efficiency and high detectivity.

• Resources Recycling
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• v.18 no.1
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• pp.38-43
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• 2009

In this study, binderless consolidation processes of ultra foe Si powder, by-products of making high purity poly-Si in the current method, were systematically investigated for use as economical solar-grade feedstock. The average diameter of the silicon powder was $7.8{\mu}m$. The main contaminants of the fine silicon powder were $SiO_2$ type oxide and humidity. The chemical pretreatment using the HF solution was observed to be effective for the improvement of the compactability of the silicon powder and the density ratio and the strength of the silicon powder compacts. The yield of the binder-free consolidation process increased by 20% under a vacuum condition. In as-received state, the silicon powder were not pure enough to be used as solar grade feed-stock material. After the dry chemical treatments, a sufficiently high purity above solar-grade was able to be achieved.

• Korean Journal of Materials Research
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• v.29 no.11
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• pp.720-726
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• 2019

Recently, research on cost reduction and efficiency improvement of crystalline silicon(c-Si) photovoltaic(PV) module has been conducted. In order to reduce costs, the thickness of solar cell wafers is becoming thinner. If the thickness of the wafer is reduced, cracking of wafer may occur in high temperature processes during the c-Si PV module manufacturing process. To solve this problem, a low temperature process has been proposed. Conductive paste(CP) is used for low temperature processing; it contains Sn57.6Bi0.4Ag component and can be electrically combined with solar cells and ribbons at a melting point of $150^{\circ}C$. Use of CP in the PV module manufacturing process can minimize cracks of solar cells. When CP is applied to solar cells, the output varies with the amount of CP, and so the optimum amount of CP must be found. In this paper, in order to find the optimal CP application amount, we manufactured several c-Si PV modules with different CP amounts. The amount control of CP is fixed at air pressure (500 kPa) and nozzle diameter 22G(outer diameter 0.72Ø, inner 0.42Ø) of dispenser; only speed is controlled. The c-Si PV module output is measured to analyze the difference according to the amount of CP and analyzed by optical microscope and Alpha-step. As the result, the optimum amount of CP is 0.452 ~ 0.544 g on solar cells.

• Journal of the Semiconductor & Display Technology
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• v.21 no.3
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• pp.74-79
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• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06a
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• pp.75-87
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• 1996

This review is presented under the following headings: 1.Introduction 1.1 Brief review of the properties of AlN 1.2 Historical survey of work on ceramic and single crystal AlN 2.Thermochemical background 3.Crystal growth 4.Doping 5.Potential applications and future work The known properties of AlN which make it of interest for various are discussed briefly. The properties include chemical stability, crystal structure and lattice constants, refractive indices and other optical properties, dielectric constant, surface acoustic wave velocity and thermal conductivity. The history of work in single crystals, thin films and ceramics are outlined and the thermochemistry of AlN reviewed together with some of the relevant properties of aluminium and nitrogen; the problems encountered in growing crystals of AlN are shown to arise directly from these thermochemical relationships. Methods have been reported in the literature for growing AlN crystals from melts, solution and vapour and these methods are compared critically. It is proposed that the only practicable approach to the growth of AlN is by vapour phase methods. All vapour based procedures share the share the same problems: $.$the difficulty of preventing contamination by oxygen & carbon $.$the high bond energy of molecular nitrogen $.$the refractory nature of AlN (melting point~3073K at 100ats.) $.$the high reactivity of Al at high temperatures It is shown that the growth of epitactic layers and polycrystalline layers present additional problems: $.$chemical incompatibility of substrates $.$crystallographic mismatch of substrates $.$thermal mismatch of substrates The result of all these problems is that there is no good substrate material for the growth of AlN layers. Organometallic precursors which contain an Al-N bond have been used recently to deposit AlN layers but organometallic precursors gave the disadvantage of giving significant carbon contamination. Organometallic precursors which contain an Al-N bound have been used recently to deposit AlN layers but organometallic precursors have the disadvantage of giving significant carbon contamination. It is conclude that progress in the application of AlN to optical and electronic devices will be made only if considerable effort is devoted to the growth of larges, pure (and particularly, oxygen-free) crystals. Progress in applications of epi-layers and ceramic AlN would almost certainly be assisted also by the availability of more reliable data on the pure material. The essential features of any stategy for the growth of AlN from the vapour are outlined and discussed.