• Title/Summary/Keyword: electrical interconnection

Search Result 428, Processing Time 0.027 seconds

Voltage quality and Network Interconnection Standard Suitability in Jeju-Hangwon Wind Power Generation Farm (제주행원 풍력발전단지의 전압품질 및 연계기준 적합성 분석)

  • Kim, Se-Ho;Kim, Eel-Hwan;Huh, Jonhg-Chul
    • Journal of the Korean Solar Energy Society
    • /
    • v.26 no.2
    • /
    • pp.53-59
    • /
    • 2006
  • The number of wind generation installations are growing substantially in Jeju, Korea. Many of these installations are significant in size and directly connected to the distribution system. Utility grid interconnection standards for interconnecting non-utility distributed generation systems are essential to both power system company and generation company. These interconnection standards are important to utilities, customers, wind generation manufactures and nation. In this paper, it is investigated the voltage quality and the suitability of Jeju-Hangwon wind power generation farm by network interconnection technology standard.

A Study on the Reliability Evaluation for Interconnecting Power Systems in Northeast Asia (동북아 전력계통 연계를 위한 신뢰도 산정에 관한 연구)

  • Choi, Jae-Seok;Cha, Jun-Min
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.57 no.7
    • /
    • pp.1129-1134
    • /
    • 2008
  • This paper proposes a reliability evaluation for interconnection planning using a tie line equivalent assisting generator model (TEAG) that considers the uncertainties of the interconnected transmission systems and the tie lines. Development of this model was triggered by the need to perform probabilistic reliability evaluations on the NEAREST (North East Asia Region Electric Systems Tied) interconnection. The TEAG is the basis for the newly developed interconnection systems reliability evaluation computer program, NEAREL. The model is capable of considering uncertainties associated with generators, tie lines, and the tied grids. Reliability evaluations for six interconnection scenarios involving the power systems of six countries in the Asian north eastern region were performed using NEAREL. Sensitivity analysis was used to determine reasonable tie line capacities for three interconnected country scenarios of the six countries. Test results and summarized comments of the scenarios are included in the paper.

PSCAD/EMTDC Modeling/Analysis of VSC-HVDC Transmission for Cross Border Power System Interconnection

  • Kim, Jong-Yul;Yoon, Jae-Young;Kim, Ho-Yong
    • Journal of Electrical Engineering and Technology
    • /
    • v.4 no.1
    • /
    • pp.35-42
    • /
    • 2009
  • When two adjacent AC systems operate at different frequency such as 50Hz and 60Hz, as in the case of ROK and Russia, the only way to practically obtain the advantages of power system interconnection is to use HVDC connection. In this paper, application of the VSC-HVDC transmission for power system interconnection between Russia and ROK is evaluated through the PSCAD/EMTDC modeling and analysis. The simulation results show the feasibility of proposed system for cross border power system interconnection.

A Study on the Over Current Relay Misoperation in Power System with Distributed Generations (분산전원 연계 계통에서의 과전류계전기 오동작에 관한 연구)

  • Park, Jong-Il;Lee, Kyebyung;Park, Chang-Hyun
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.67 no.12
    • /
    • pp.1705-1710
    • /
    • 2018
  • This paper deals with an analysis of the causes of over current relay(OCR) misoperation in power system with distributed generations(DG). In general, Y-D and Y-Y-D transformer connections are used for grid interconnection of DG. According to the interconnection guideline, the neutral point on Y side should be grounded. However, these transformer connections can lead to OCR misoperation as well as over current ground relay(OCGR) misoperation. Several researches have addressed the OCGR misoperation due to the interaction between transformer connections and zero-sequence voltage of distribution system. Recently, a misoperation of OCR at the point of DG interconnection to the utility system has been also reported. With increasing the interconnections of DG, such OCR as well as OCGR misoperations are expected to increase. In this paper, PSCAD/EMTDC modeling including DG interconnection transformer was performed and various case studies was carried out for identifying the cause of OCR misoperation.

Effect of Hot Spot to Performance of Interconnection Network (Hot Spot 이 Interconnection Network 의 성능에 미치는 영향)

  • Kim, Seong-Jong;Keem, Tae-Hyeong;Lee, Young-No;Shin, In-Chul
    • Proceedings of the KIEE Conference
    • /
    • 1988.07a
    • /
    • pp.655-658
    • /
    • 1988
  • Interconnection network is to provide communication among functional modules. The interconnections considered are Generalized Cube networks. Two situations are examined: a memory module is equally likely to be addressed by a processor and a processor has a favorite memory. This paper proposes the effective condition of operation in interconnection network through performance evaluation by simulation.

  • PDF

Voltage Stability Analysis for Power System Interconnection between North and South in Korea Peninsula (남북전력협력을 위한 전력계통 연계방안의 전압안정도 분석)

  • Shin, Joong-Rin;Kim, Byung-Seop;Choi, Yeol-Jun
    • Proceedings of the KIEE Conference
    • /
    • 2001.05a
    • /
    • pp.103-107
    • /
    • 2001
  • This paper presents a proposal for the power system interconnection alternative between the South and North Korea. The characteristics of bus voltage and power flow are analized to see the feasibility of the proposed and to evaluate the voltage atability. We collect and estimate various data of the South and North Korea power network. and the various case studies using the PowerWorld simulator were made to find the aceeptable interconnection alternative.

  • PDF

A Study on Application of BESS at Distribution System (배전시스템에 전지전력저장시스템의 적용에 관한 연구)

  • Kim, Yong-Sung;Moon, Sun-Ho;Chu, Dong-Wook;Kim, Eung-Sang;Kim, Jae-Chul
    • Proceedings of the KIEE Conference
    • /
    • 1997.07c
    • /
    • pp.867-870
    • /
    • 1997
  • This paper presents application of battery energy storage system(BESS) for interconnection with power distribution system. We configured interconnection model using PSCAD/EMTDC program. The simulation for voltage regulation on BESS interconnection with power distribution analyzes transient voltage variation, steady state voltage variation, and voltage of reverse power flow at interconnected feeder and nearby feeder.

  • PDF

Economic Feasibility on the Interconnected Electric Power System in North-East Asia (동북아 전력계통 연계에 따른 경제성 분석)

  • Chung, Koo-Hyung;Han, Seok-Man;Kim, Bal-Ho
    • The Transactions of the Korean Institute of Electrical Engineers A
    • /
    • v.55 no.2
    • /
    • pp.76-84
    • /
    • 2006
  • Interstate electric power system, as an alternative for energy cooperation under regional economic block, has been hotly debated before progressing the restructure in electric power industry and rapidly expanded in many regions after 1990s. Especially, since northeast asia has strong supplementation in resource, load shape, fuel mix etc., interconnection of electric power systems in this region may bring considerable economic benefits. This paper implements a mathematical optimization model, ORIRES, proposed by Russia, in analysing the economic feasibility of system interconnection. Additional analyses on the environmental impact of the system interconnection, and sensitivity of key factor inputs have been performed.

A Study on Distributed Generation System Interface (분산형전원의 전력계통 인터페이스 문제와 해결 방안)

  • Roh, Jae-Hyung;Shin, Young-Kyun;Kim, Bal-Ho.H.;Kim, Chang-Sup
    • Proceedings of the KIEE Conference
    • /
    • 2001.07a
    • /
    • pp.527-529
    • /
    • 2001
  • Interfaces are the point of interconnection between distributed generation and the energy infrastructure. These interfaces are generally physical but can include a market dimension as well. While there are issues surrounding various interfaces, the most important issues in the short term are on the electrical interface. Much of the discussion and debate surrounding distributed generation interconnection has centered on technical issues. However, there are two elements of Interconnection that merit equal consideration-process and contractual issues. The solution of distributed generation Interconnection issues depends on whether existing requirements can be modified to make them more efficient, transparent, and standardized while maintaining the grid's reliability and safety. In this paper, two main courses, standardization and third party participation, are suggested for the resolution of these issues.

  • PDF

Development of BGA Interconnection Process Using Solderable Anisotropic Conductive Adhesives (Solderable 이방성 도전성 접착제를 이용한 BGA 접합공정 개발)

  • Yim, Byung-Seung;Lee, Jeong Il;Oh, Seung Hoon;Chae, Jong-Yi;Hwang, Min Sub;Kim, Jong-Min
    • Journal of the Semiconductor & Display Technology
    • /
    • v.15 no.4
    • /
    • pp.10-15
    • /
    • 2016
  • In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.