• Carbon letters
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• 제11권3호
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• pp.211-215
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• 2010

Multi-walled carbon nanotube (MWCNT)/poly(vinyl alcohol) (PVA) nanocomposite hydrogels were prepared by freezingthawing method for the electro-responsive transdermal drug delivery. MWCNTs were used as the functional ingredient to improve both mechanical and electrical properties of MWCNT/PVA nanocomposite hydrogels. The morphology of nanocomposites revealed the uniform distribution of MWCNTs and the good interfacial contact. The compression moduli of hydrogel matrices increased greatly from 40 to 1500 kPa by forming MWCNT/PVA nanocomposites. The swelling ratio of MWCNT/PVA nanocomposites decreased as the content of MWCNTs increased under no electric voltage applied. However, the swelling ratio of MWCNT/PVA nanocomposites increased as the content of MWCNTs increased under electric voltage applied and the applied electric voltage increased. The drug was released in the electro-responsive manner through the skin due to the electro-sensitive swelling characteristics of MWCNT/PVA nanocomposite hydrogels.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.21-21
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• 2003

To increase the light-emission efficiency of LED, we increased the internal and external quantum efficiency by suppressing the defect formation in the quantum well and by increasing the light extraction efficiency in LED, respectively. First, the internal quantum efficiency was improved by investigating the effect of a low temperature (LT) grown p-GaN layer on the In$\sub$0.25/GaN/GaN MQW in green LED. The properties of p-GaN was optimized at a low growth temperature of 900oC. A green LED using the optimized LT p-type GaN clearly showed the elimination of blue-shift which is originated by the MQW damage due to the high temperature growth process. This result was attributed to the suppression of indium inter-diffusion in MQW layer as evidenced by XRD and HR-TEM analysis. Secondly, we improved the light-extraction efficiency of LED. In spite of high internal quantum efficiency of GaN-based LED, the external quantum efficiency is still low due to the total internal reflection of the light at the semiconductor-air interface. To improve the probability of escaping the photons outside from the LED structure, we fabricated nano-sized cavities on a p-GaN surface utilizing Pt self-assembled metal clusters as an etch mask. Electroluminescence measurement showed that the relative optical output power was increased up to 80% compared to that of LED without nano-sized cavities. I-V measurement also showed that the electrical performance was improved. The enhanced LED performance was attributed to the enhancement of light escaping probability and the decrease of resistance due to the increase in contact area.

• 한국초전도ㆍ저온공학회논문지
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• 제1권2호
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• pp.1-7
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• 1999

we evaluated the effects of joining process such as contact method. shape of joined area and pressure on the electrical and mechanical properties of Bi-2223 superconducting tape, Specifically. the current capacity of the jointed tape was measured as a function of uniaxial pressure. and the thermal shock, bonding strength and the thermal of the tape were evaluated and correlated to the microstructural evolution. It was observed that the current capacity was significanrly dependent on the uniaxial pressure The jointed tape, fabricated with a pressure of 1,000-1,600 Mpa. showed the highest value of current capacity results from improvements in core density, contacting area and grain alignment, ect. In addition, the strength of jointed tape was measured to be 86 Mpa, which is about 88% of the unjoined ape's strength. The irreversible strain($\varepsilon$irrev) for the jointed tape was measured to be 0.1%, smaller than that of unjoined tape ($\varepsilon$irrev= 0.3%). The decrease in the strength and irreversible strain for jointed tape is believed to be due to the irregular geometry/morphology of the transition area of the tape.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1518-1520
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• 2001

Bi-layer Mo films were deposited on sodalime glass substrates using DC magnetron sputtering. As the gas pressure and power density, the resistivity varied from $1.5{\times}10^{-5}$ to $4.97{\times}10^{-4}{\Omega}{\cdot}cm$. Furthermore, stress direction yielded compressive-to-tensile transition stress curves. The microstructure of the compressive stress films which had poor adhesion consists of tightly packed columns, but of the tensile-stressed films had less dense structure. Under all gas pressure conditions, Mo films exhibited distinctly increasing optical reflection with decreasing gas pressure. The expansion of (110) peak width with the gas pressure meant the worse crystalline growth. Also, The highest efficiency was 15.2% on 0.2 $cm^2$. The fill factor, open circuit voltage and short circuit current were 63 %, 570 mV and 42.6 mA/$cm^2$ respectively.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• 한국재료학회지
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• 제9권2호
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• pp.124-131
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• 1999

Copper film, which is expected to be used as interconnection material for 1 giga DRAM integrated circuits was deposited on hole and trench patterns by Metal Organic Chemical Vapor Deposition(MOCVD) method. After a reflow process, contact and L/S patterns were filled by copper and the characteristics of the Cu reflow process were investigated. When deposited Cu films were reflowed, grain growth and agglomeration of Cu have occurred in surfaces and inner parts of patterns as well as complete filling in patterns. Also Cu thin oxide layers were formed on the surface of Cu films reflowed in $O_2$ambient. Agglomeration and oxidation of Cu had bad influence on the electrical properties of Cu films especially, therefore, their removal and prevention were studied simultaneously. As a pattern size is decreased, preferential reflow takes place inside the patterns and this makes advantages in filling patterns of deep submicron size completely. With Cu reflow process, we could fill the patterns with the size of deep sub-micron and it is expected that Cu reflow process could meet the conditions of excellent interconnection for 1 giga DRAM device when it is combined with Cu MOCVD and CMP process.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2007년도 추계종합학술대회
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• pp.751-753
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• 2007

최근에 유기물 전계효과 트랜지스터의 연구는 전자 소자 분야에서 널리 알려져 있다. 특히 본 연구에서는 CuPc 물질을 활성층으로 사용하여 Organic FET 소자를 제작하였다. Source와 Drain 전극을 Au와 Al을 사용하여 FET 소자의 전기적 특성을 비교하였다. CuPc FET 소자에서 CuPc 활성층의 두께는 40nm로 고정하였고, Au와 Al 전극의 두께는 200nm로 하여 소자를 제작하였다. 또한 C-V 특성을 측정하여 CuPc 유기물 층과 $SiO_2$ 절연층 계면에서의 특성 변화를 관측하였다. Au를 전극으로 사용한 FET 소자에서는 전형적인 FET 특성 곡선을 관측할 수 있었으나, Al을 전극을 사용한 FET 소자에서는 누설 전류가 흐르고 있음을 확인 할 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.473-473
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• 2011

In recent years, organic thin film transistors OTFTs based on conductive-conjugated molecules have received significant attention. We report a fabrication of organic single crystal nanowires that made on Si substrates by liquid bridge-mediated nanotransfer molding (LB-nTM) with polyurethane acrylate (PUA) mold. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid bridge between them. In liquid bridge-transfer process, the liquid layer serves as an adhesion layer to provide good conformal contact and form covalent bonding between the organic single crystal nanowire and the Si substrate. Pentacene is the most promising organic semiconductors. However pentacene has insolubility in organic solvents so pentacene OTFTs can be achieved with vacuum evaporation system. However 6, 13-bis (triisopropylsilylethynyl) (TIPS) pentacene has high solubility in organic solvent that reported by Anthony et al. Furthermore, the substituted rings in TIPS-pentacene interrupt the herringbone packing, which leads to cofacial ${\pi}-{\pi}$ stacking. The patterned TIPS-Pentacene single crystal nanowires have been investigated by Atomic force microscopy (AFM), Transmission Electron Microscopy (TEM), X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM) and electrical properties.

• Bulletin of the Korean Chemical Society
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• 제33권12호
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• pp.3993-3997
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• 2012

Three-dimensional porous nickel foam was used as a current collector to prepare a Co-Ni oxide/Ni foam electrode for a supercapacitor. The synthesized Co-Ni oxide was proven to consist of mixed oxide phases of $Co_3O_4$ and NiO. The Co-Ni oxide/Ni foam electrode prepared was characterized by morphological observation, crystalline property analysis, cyclic voltammetry, and impedance spectroscopy. Cyclic voltammetry for the electrode showed high specific capacitances, such as 936 F $g^{-1}$ at 5 mV $s^{-1}$ and 566 F $g^{-1}$ at 200 mV $s^{-1}$, and a comparatively good cycle performance. These improved results were mainly due to the dimensional stability of the nickel foam and its high electrical contact between the electrode material and the current collector substrate.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 학술대회 논문집 전문대학교육위원
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• pp.49-51
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• 2002

In this thesis, Josephson junction using high-Tc superconducting multi-layer thin film has been fabricated by on-axis RF magnetron sputtering method. And, the characterizations were performed by X-ray diffraction, SEM and the measuring system of critical current density. The physical properties of multi-layer superconducting thin films were also analyzed with the measured results. To fabricate the multi-layer superconducting thin films, the optimum partial pressure of Argon and Oxgen and the temperature of substrate were measured. Also, YBaCuO thin film was grown on MgO and $SrTiO_3$ substrates by rf-sputtering and LGO thin film of 30 A was epitaxially grown on the YBaCuO thin film as a josephson junction with the same condition. The schottky barrier at the contact surface between YBaCuO/LGO and YBaCuO/Au and the energy gap of 0.5 ${\sim}$ 0.6 mV in Nb were observed from the dI/dV-V of YBaCuO/LGO/Au/Nb and YBaCuO/Au/Nb.