• Title/Summary/Keyword: electrical connections

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Characteristics of Transformer-Type SFCL according to the Connecting Methods of Secondary Coils (2차 권선의 연결방법에 따른 변압기형 초전도 한류기의 특성)

  • Cho, Yong-Sun;Park, Hyoung-Min;Chung, Soo-Bok;Choi, Hyo-Sang
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.12
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    • pp.2078-2083
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    • 2007
  • We have analyzed operating characteristics of transformer-type superconducting fault current limiter (SFCL) according to the serial or parallel connections of secondary coils with $YBa_2Cu_3O_7$ (YBCO) thin films. The turn ratio between the primary and secondary coils was 63:21. Transformer-type SFCL using a transformer with secondary winding of serial or parallel coils could reduce the unbalanced quench caused by differences of the critical current density between YBCO thin films. We found that transformer-type SFCL having serial or parallel connections induced simultaneous quench between the superconducting units. The limiting current in the transformer-type SFCL with a parallel connection was lowered to 30 % compared to the SFCL with a serial connection. In the meantime, when the currents generated in the superconducting units were similar, the voltage value in the parallel connection was 60 % as low as that in the serial connection. However, the voltage generated in the primary winding was some higher. In conclusion, we found that transformer-type SFCL with parallel connection of secondary coils was more effective in fault current limiting characteristics and in the reduction of the consumption power for superconducting units compared to those of the transformer-type SFCL with serial connection of secondary coils.

Utility-based Rate Allocation Scheme for Mobile Video Streaming over Femtocell Networks

  • Quan, Shan Guo;Xu, Jian;Kim, Young-Yong
    • Journal of Information Processing Systems
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    • v.5 no.3
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    • pp.151-158
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    • 2009
  • This paper proposes a utility-based data rate allocation algorithm to provide high-quality mobile video streaming over femtocell networks. We first derive a utility function to calculate the optimal data rates for maximizing the aggregate utilities of all mobile users in the femtocell. The total sum of optimal data rates is limited by the link capacity of the backhaul connections. Furthermore, electromagnetic cross-talk poses a serious problem for the backhaul connections, and its influence passes on to mobile users, as well as causing data rate degradation in the femtocell networks. We also have studied a fixed margin iterative water-filling algorithm to achieve the target data rate of each backhaul connection as a counter-measure to the cross-talk problem. The results of our simulation show that the algorithm is capable of minimizing the transmission power of backhaul connections while guaranteeing a high overall quality of service for all users of the same binder. In particular, it can provide the target data rate required to maximize user satisfaction with the mobile video streaming service over the femtocell networks.

Prediction Principle and System Structure for the Detection of Incipient Electrical Fire (전기화재 예지원리 및 징후검출 시스템 구조)

  • 김창종
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.9 no.4
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    • pp.71-77
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    • 1995
  • Electrical fire in residential, commercial, and industrial areas occupies 40 percent of overall fire accidents as of the year of 1994. The causes of most electrical fires were studied and, based on this investigation, the principle of the early detection or prediction of the electrical fires is developed. The basic principle is to early detect electrical arcs or sparks caused by faulty connections and insulation failures. the structure of the prediction system based on microcontroller technique is presented.

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A Modular Design of Neural Networks for Real-time Transmission of Information Data (정보자료의 실시간 전송을 위한 신경망 모듈라)

  • Kim, Jong-Man;Hwang, Jong-sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11b
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    • pp.7-12
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    • 2004
  • New modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for interpolation of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is for enlarging the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. Simulation of interpolation with the designed LIPN has been done through various experiments.

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Study on the Improvement of the Reliability of Al-Cu Connections in Power Distribution Systems(II) (송배전용 Al-Cu 접속금구의 신뢰도 향상에 관한 연구(II) 압축형 및 폭발용접형 접속금구의 내식성 비교)

  • Ha, Yoon-Cheol;Bae, Jeong-Hyo;Ha, Tae-Hyun;Lee, Hyun-Goo;Kim, Dae-Kyeong
    • Proceedings of the KIEE Conference
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    • 2003.11a
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    • pp.370-372
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    • 2003
  • As there expands the usage of Al-Cu connections to interface aluminum and copper in power distribution systems, efforts to mitigate the mechanical, electrical or electro-chemical degradation are widely spreading. The explosive bending technology, in particular, has been thought as a countermeasure for the degradation. In this paper, electrochemical analysis and optical microscopic observation are carried out in order to compare the corrosion resistivities of the commercial compression type bimetallic sleeve and the explosion type bimetallic sleeve. The results show that the explosive bonding technology can prevent the interfacial corrosion caused by the formation of crevices and pits as well as from galvanic potential difference.

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Analysis of a Fire Case Caused by Heat Generation due to Cu2O Breeding (아산화동증식 발열에 의한 화재 사례의 분석)

  • Park, Jin-Young;Lee, Eui-Pyeong
    • Fire Science and Engineering
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    • v.34 no.2
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    • pp.54-63
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    • 2020
  • Although fires caused by heat generation due to Cu2O breeding in wire connections are well-known among fire investigators, there are few papers on the analysis and introduction of fire cases by heat generation due to Cu2O breeding. This study analyzed fire statistics caused by heat generation in electrical connections and the phenomena and features of heat generation due to Cu2O breeding. Then, a fire which occurred in the wire connection in a university lab by heat generation due to Cu2O breeding was analyzed in more detail. This fire case could reach a conclusion that heat generation due to Cu2O breeding caused a fire in the wire connection through the fire pattern investigation of fire origin, the visual investigation of wire connection, 3D CT, power-on-test, and stereoscopic microscopy, SEM and EDS analysis.

Analysis of Characteristics of Electrical Arc Spark Detector (전기화재 아크.스파크검출기 특성평가에 관한 연구)

  • 정용기;신효섭;지철근;김영수
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2002.11a
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    • pp.375-378
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    • 2002
  • An arc/spark detector (ASD) was developed is to early detect wire failures and insecure connections that may lead to fire in residents and commercial and industrial facilities. A detailed circuit design for ASD implementation along with prototype product is reported. The tests of ASD, which were successful in phase identification, in many different arc/spark locations under different loadings, and in false alarm probability, showed the ability and capability of the state-of-the-art detector in the electric fire hazard prevention.

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Two stage neural network for spatio-temporal pattern recognition (시변패턴 인식을 위한 2단 구조의 신경회로망)

  • Lim, Chung-Soo;Lee, Chong-Ho
    • Proceedings of the KIEE Conference
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    • 1998.07g
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    • pp.2290-2292
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    • 1998
  • This paper introduces Two-stage neural network that is capable of recognizing spatio-temporal patterns. First stage takes a spatio-temporal pattern as input and compress it into sparse spatio-temporal pattern. Second stage is for temporal pattern recognition with nonuniform inhibitory connections and different cell sizes. These are basic properties for detecting a embeded pattern in a larger pattern. The network is evaluated by computer simulation.

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A Study on the Cell String for High Efficiency and High Power Photovoltaic Modules (고효율 및 고출력 태양광 모듈을 위한 셀 스트링 연구)

  • Park, Ji Su;Hwang, Soo Hyun;Oh, Won Je;Lee, Su Ho;Jeong, Chae Hwan;Lee, Jae Hyeong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.5
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    • pp.295-299
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    • 2018
  • In this work, we conducted a study on cell strings of high efficiency and high power solar cell modules via simulation. In contrast to the conventional module manufacturing method, the simulation was performed by connecting cutting cells divided into four parts from 6-in size using the electrically conductive adhesive (ECA). The resistance of the ECA added in series connection was extracted using an experimental method. This resistance was found to be $3m{\Omega}$. Based on this simulation, we verified the change in efficiency of the string as a function of the number of cutting cell connections. Consequently, the cutting cell efficiency of the first 20.08% was significantly increased to 20.63% until the fifth connection; however, for further connections, it was confirmed that the efficiency was saturated to 20.8%. Connecting cutting cells using ECA improves the efficiency of the string; therefore, it is expected that it will be possible to fabricate modules with high efficiency and high power.

GHz EMI Characteristics of 3D Stacked Chip PDN with Through Silicon Via (TSV) Connections

  • Pak, Jun-So;Cho, Jong-Hyun;Kim, Joo-Hee;Kim, Ki-Young;Kim, Hee-Gon;Lee, Jun-Ho;Lee, Hyung-Dong;Park, Kun-Woo;Kim, Joung-Ho
    • Journal of electromagnetic engineering and science
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    • v.11 no.4
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    • pp.282-289
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    • 2011
  • GHz electromagnetic interference (EMI) characteristics are analyzed for a 3dimensional (3D) stacked chip power distribution network (PDN) with through silicon via (TSV) connections. The EMI problem is mostly raised by P/G (power/ground) noise due to high switching current magnitudes and high PDN impedances. The 3D stacked chip PDN is decomposed into P/G TSVs and vertically stacked capacitive chip PDNs. The TSV inductances combine with the chip PDN capacitances produce resonances and increase the PDN impedance level in the GHz frequency range. These effects depend on stacking configurations and P/G TSV designs and are analyzed using the P/G TSV model and chip PDN model. When a small size chip PDN and a large size chip PDN are stacked, the small one's impedance is more seriously affected by TSV effects and shows higher levels. As a P/G TSV location is moved to a corner of the chip PDNs, larger PDN impedances appear. When P/G TSV numbers are enlarged, the TSV effects push the resonances to a higher frequency range. As a small size chip PDN is located closer to the center of a large size chip PDN, the TSV effects are enhanced.