• Title/Summary/Keyword: electrical connections

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Logic-based Fuzzy Neural Networks based on Fuzzy Granulation

  • Kwak, Keun-Chang;Kim, Dong-Hwa
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.1510-1515
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    • 2005
  • This paper is concerned with a Logic-based Fuzzy Neural Networks (LFNN) with the aid of fuzzy granulation. As the underlying design tool guiding the development of the proposed LFNN, we concentrate on the context-based fuzzy clustering which builds information granules in the form of linguistic contexts as well as OR fuzzy neuron which is logic-driven processing unit realizing the composition operations of T-norm and S-norm. The design process comprises several main phases such as (a) defining context fuzzy sets in the output space, (b) completing context-based fuzzy clustering in each context, (c) aggregating OR fuzzy neuron into linguistic models, and (c) optimizing connections linking information granules and fuzzy neurons in the input and output spaces. The experimental examples are tested through two-dimensional nonlinear function. The obtained results reveal that the proposed model yields better performance in comparison with conventional linguistic model and other approaches.

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A Development of Electronic Motor Control Systems (전자식 모터제어 시스템 개발)

  • Lee, Sung-Hwan;Yi, Seok-Ju
    • Proceedings of the KIEE Conference
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    • 2000.11a
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    • pp.76-78
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    • 2000
  • The previous MCC's have the demerits of high cost and much manhour for rework because they are impossible for the standardization of products and have many manual connections. The customers require the products which can operate in connection with SCADA system by digitalizing the functions of the current MCC's and are systematized with capability of remote control. To solve these disadvantages and requirements, we developed the Electronic Motor Control System according to starting type for applying to fields based on this. This system has the various functions such as protection, measurement, and communication. Using these functions, it can monitor motor status through communication with the upper system and define the circuit for lower connection cost according to starting type and shorter manufacture period by program. The development of this product results in establishment of competitive structure with domestic competition and perfect automatic monitoring through linkage with SCADA system. In addition, it provides the comparable dominancy of receiving on orders in switch gear and adaptability to change of MCC market in Japan and Europe.

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A Multi-hop routing protocol for bluetooth devices (블루투스 멀티 홉 라우팅 프로토콜)

  • Yang, Il-Sik;Kim, Myung-Gyu;Son, Ji-Yeon;Park, Jun-Seok
    • Proceedings of the KIEE Conference
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    • 2005.10b
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    • pp.448-450
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    • 2005
  • A ubiquitous network allows all users to access and exchange information of any kind freely at any time, from anywhere, and from any appliance through the use of broadband and mobile access. Bluetooth commincation can provide the missing wireless extension to the heterogeneous network, allowing a more ubiquitous access. In this point of view, the BT specifications define ways for which each BT device can set up multiple connections with neighboring devices to communicate in a multi-hop fashion. this paper provides insights on the Bluetooth technology and on some limitations of the scatternet formations. so that, we describe a new multi-hop routing protocol for the establishment of scatternets. this protocol defines rules for forming a multi-hop topology in two phases. the first phase, topology discovery, concerns the discovery of the node's depth from a root node initiating inquiry process. the second phase forms scatternet topology based on the result of topology discovery.

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Study on tests on interfaces and connection of end fitting of composite insulators (복합 애자류의 수분침투시험평가기술에 대한 고찰)

  • Kim, Geun-yong
    • Proceedings of the KIEE Conference
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    • 2015.07a
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    • pp.1171-1172
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    • 2015
  • 송전선이나 전기기기의 나선(裸線)부분을 절연하고 동시에 기계적으로 유지 또는 지지하기 위한 절연체와 이것과 일체로 조립된 금구류로 구성된 절연지지물인 애자는 전기적으로 충분한 절연내력을 가지게 하기 위하여 다수의 주름을 만들어 표면에 따른 거리를 크게 한다. 이는 표면이 습하였을 때, 염분이나 먼지 등이 부착하였을 때 절연내력이 저하되는 것을 방지하는 데 효과가 있다. 그리고 재질별(세라믹, 유리, 합성수지 등), 모양별(원판형, 원주형, 중공, 갓형 등), 용도별(전차 선로용, 발전소 또는 변전소용, 통신 선로용 등) 및 사용방법(현수용, 내장용, 인류용, 고정용 등)에 따라 다양하게 분류된다. 본 논문에서는 복합 애자류(composite insulators)의 여러 가지 성능평가 시험방법 중에서 복합 애자의 여러 계면과 연결 금구의 접속부(interfaces and connections of end fittings)에 대한 이상 유무를 확인하는 시험인 수분침투시험평가기술에 대해 고찰하였다.

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Design of Tree Architecture of Fuzzy Controller based on Genetic Optimization

  • Han, Chang-Wook;Oh, Se-Jin
    • Journal of the Institute of Convergence Signal Processing
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    • v.11 no.3
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    • pp.250-254
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    • 2010
  • As the number of input and fuzzy set of a fuzzy system increase, the size of the rule base increases exponentially and becomes unmanageable (curse of dimensionality). In this paper, tree architectures of fuzzy controller (TAFC) is proposed to overcome the curse of dimensionality problem occurring in the design of fuzzy controller. TAFC is constructed with the aid of AND and OR fuzzy neurons. TAFC can guarantee reduced size of rule base with reasonable performance. For the development of TAFC, genetic algorithm constructs the binary tree structure by optimally selecting the nodes and leaves, and then random signal-based learning further refines the binary connections (two-step optimization). An inverted pendulum system is considered to verify the effectiveness of the proposed method by simulation.

A Proxy Acknowledgement Mechanism for TCP Variants in Mobile Ad Hoc Networks

  • Oo, May Zin;Othman, Mazliza;O'Farrell, Timothy
    • Journal of Communications and Networks
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    • v.18 no.2
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    • pp.238-245
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    • 2016
  • A sequence number checking technique is proposed to improve the performance of TCP connections in mobile ad hoc networks. While a TCP connection is initialized, a routing protocol takes the responsibility for checking the hop count between a source and destination pair. If the hop count is greater than a predefined value, the routing protocol decides to use a proxy node. The responsibility of a proxy node is to check the correctness of data packets and inform the missing packets by sending an acknowledgement from a proxy node to the source node. By doing so, the source node is able to retransmit any missing packet in advance without waiting until an end-to-end acknowledgement is received from the destination. Simulation results show that the proposed mechanism is able to increase throughput up to 55% in static network and decrease routing overhead up to 95%in mobile network.

Development Of A Simulator For Developing Various Servo Driver (다양한 서보 드라이버 개발용 시뮬레이터 개발)

  • Lee, In-Eung;Jang, Seok-Myeong
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.985-986
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    • 2007
  • Most industrial robot can not load control box on their bodies because of robot's weight and volume. A robot is connected to its control box with cables. Complicated connections cause a lot of problems on transfer, management and operating robots. To get rid of those, Control module must be made the smallest size by using advanced electronic technology. This paper represents about how to simulate servo system inserting several parameter values that we ultimately want to achieve. Through simulating, we will be able to estimate the structure of desired servo system without any mistakes that can possibly occur on hardware work.

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Design and Evaluation of a parallel EMG Signal Identifier using Trsnsputers (트랜스퓨터를 이용한 병렬 근신호 인식기의 설계 및 평가)

  • 김종원;김성환
    • Journal of Biomedical Engineering Research
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    • v.17 no.4
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    • pp.459-468
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    • 1996
  • This paper considers the problem of realising a parallel EMG identifier used in FES (functional electrical stimulation) system on a fixed dimension transputer array. This involves using an identifiestion algorithm in the wavelet transform domain. This algorithm have suggested by the authors in a previous paper(6). The transputer serial links permit higtlly varied and economic network-type connections and the structure enables rapid topological reconfiguration. Analysing the results Showed that the Speed-UPS ranged from 1.82 to 3.44 With 2-4 transputers for corresponding model order, and from 1.82 to 3.97 with increasing the model orders when two and four transputers are used respectively.

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Remote Patient Monitoring System for Diagnostic Pure-tone Audiometry (순음 청력검사를 위한 원격진단 모니터링 시스템)

  • Lee, Kang-Ho;Kwon, Yeong-Eun;Kwon, Ohwon
    • Journal of Sensor Science and Technology
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    • v.28 no.5
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    • pp.289-293
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    • 2019
  • This paper presents a remote patient monitoring system for diagnostic pure-tone audiometry. A pure-tone audiometer was developed for basic hearing screening; its performance was evaluated according to international standards in terms of linearity, accuracy, and total harmonic distortion. Pure-tone audiometry has a maximum hearing level of 104.9 dB HL that is comparable with other commercial products. The audiometer shows satisfactory linearity with a deviation of ${\pm}0.4dB$, an accuracy of ${\pm}0.025%$, and a total harmonic distortion (THD) of 0.21%. The remote patient monitoring systems include remote control devices based on wide area network (WAN) connections and an audiometer connected in series. Through experimentation, we successfully performed real-time diagnostic communication without delay in transferring audiometric data. This system is expected to supply domestic equipment in the audiometric market and to improve the quality of life of patients in non-clinical environments.

Development Trends in Advanced Packaging Technology of Global Foundry Big Three (글로벌 파운드리 Big3의 첨단 패키징 기술개발 동향)

  • H.S. Chun;S.S. Choi;D.H. Min
    • Electronics and Telecommunications Trends
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    • v.39 no.3
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    • pp.98-106
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    • 2024
  • Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.