• Journal of Powder Materials
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• v.31 no.2
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• pp.146-151
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• 2024

Pure SnO₂ has proven very difficult to densify. This poor densification can be useful for the fabrication of SnO₂ with a porous microstructure, which is used in electronic devices such as gas sensors. Most electronic devices based on SnO₂ have a porous microstructure, with a porosity of > 40%. In pure SnO₂, a high sintering temperature of approximately 1300℃ is required to obtain > 40% porosity. In an attempt to reduce the required sintering temperature, the present study investigated the low-temperature sinterability of a current system. With the addition of TiO₂, the compositions of the samples were Sn_1-xTi_xO₂-CoO(0.3wt%)-CuO(2wt%) in the range of x ≤ 0.04. Compared to the samples without added TiO₂, densification was shown to be improved when the samples were sintered at 950℃. The dominant mass transport mechanism appears to be grain-boundary diffusion during heat treatment at 950℃.

• Journal of Korea Foundry Society
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• v.37 no.4
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• pp.101-107
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• 2017

This study investigated the effect of Pd on the microstructure, tensile and creep properties of Mg-4Al-2Sn (AT42) alloy at a high temperature for transportation-related industrial applications. AT42-xPd (x = 0, 1 and 2 wt. %) alloys were prepared using a permanent mould casting method. The microstructures of the as-cast alloys were characterized by the presence of the intermetallic phases $Mg_{17}Al_{12}$, $Mg_2Sn$ and $Al_4Pd$. The addition of Pd was found to improve the tensile properties of AT42 at room and at elevated temperatures, and to increase the creep resistance at elevated temperatures. A small amount of Pd could markedly improve the tensile properties of AT42 by means of grain-refinement and the dispersion of secondary phase strengthening. Moreover, the thermally stable phase $Al_4Pd$ effectively improves the creep resistance of AT42 due to the strengthened grain boundaries and the suppressed formation of $Mg_{17}Al_{12}$.

• Journal of Powder Materials
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• v.25 no.4
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• pp.302-308
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• 2018

A lean alloy is defined as a low alloy steel that minimizes the content of the alloying elements, while maintaining the characteristics of the sintered alloy. The purpose of this study is to determine the change in microstructure and mechanical properties due to the addition of silicon or tin in Fe-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P alloys. Silicon- or tin-added F-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P master alloys were compacted at 700 MPa and subsequently sintered under a $H_2-N_2$ atmosphere at $1120^{\circ}C$. The sintered density of three alloy systems decreases under the same compacting pressure due to dimensional expansion with increasing Si content. As the diffusion rate in the Fe-P-Mo system is higher than that in the Fe-P-Mn system, the decrease in the sintered density is the largest in the Fe-P-Mn system. The sintered density of Sn added alloys does not change with the increasing Sn content due to the effect of non-dimensional changes. However, the effect of Si addition on the transverse rupture strengthening enhancement is stronger than that of Sn addition in these lean alloys.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• The Korean Journal of Food And Nutrition
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• v.7 no.4
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• pp.345-352
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• 1994

High protein beverage of cow-soy milk was prepared by mixing the soymilk and commercial homogenized cow milk in the various ratios. Effect of heat treatment, pH and addition of calcium and sucrose was studied on the water-soluble nitrogen of cow-soy milk The heat-treated soymilk at 10$0^{\circ}C$ were centrifuged at the range of 830~29,900xg for 30 min and 11,200xg was found to be proper for determination of the degree of protein denaturation by centrifugal method. When soymilk was heated at 70~10$0^{\circ}C$ for 30~240 min, soluble nitrogen (QA SN) in supernatant of protein was decreased to 78.0~56.8% due to protein denaturation. Most of heat denaturation of protein was found to be occurred during Initial heating 10$0^{\circ}C$ for all mixed cow-soy milk. The sedimentation of SN was maximum at pH 4.0 In the range of pH 3~8. Addition of sucrose affected little on oASN while calcium addition reduced %SN significantly to approx. 55% for soymilk(100%). The effect of Ca was less as the ratio of cow milk increased.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.188-194
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• 1999

To investigate the effect of niobium and tin on the mechanical properties of zirconium alloys, the tensile test and the microstructural analysis were performed on the Zr-based binary(Zr-xNb, Zr-xSn) and ternary(Zr-0.8Sn-xNb, Zr-0.4Nb-xSn) alloys. As the content of Nb or Sn element increased, the strengths of the Zr-based alloys tended to gradually increase. The increase of mechanical strength was remarkable strength was remarkable in the range more than the solubility of Nb and Sn. The strengthening effects were discussed on the basis of the solid solution hardening, the precipitate hardening, the grain size effect, and the texture effect. The mechanical strength is mainly controlled by the solid solution hardening and additionally by the precipitate hardening in the content more than solubility limit of Nb and Sn. The grain refinement also has a slight effect on the strength of the zirconium alloys with the addition of Nb and Sn. However, the texture effect can be excluded due to the same Kearns number regardless of the content of alloying elements.

• Journal of Korea Foundry Society
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• v.31 no.5
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• pp.293-301
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• 2011

Representative magnesium alloys applied to the die-casting are AZ91, AM60, etc., and the application of these alloys is restricted to components operating at moderate temperatures, due to grain boundary siding of ${\beta}$-phase($Mg_{17}Al_{12}$) at temperatures above $120^{\circ}C$. Heat-resistant magnesium alloys such as AE42, AE44 have been developed, but that have been too burdensome to produce because of the expensive rare earth materials. Research work for the development of low-priced heat-resistant magnesium alloy is actively in progress and positive results are being reported. This study aims to investigate the effect of Ca additions on mechanical properties of Mg-4Al-2Sn heat resistant magnesium alloys. Mg-4Al-2Sn alloys with Ca (0wt.%, 0.3wt.%, 0.7wt.%, 1wt.%) have been produced through the die-casting process for the development of low-priced heat-resistant magnesium alloy, and high temperature tensile tests are performed using the specimens. The results showed that mechanical properties of Mg-4Al-2Sn-xCa increased with the addition of Ca up to 0.7wt.% Ca and further addition of Ca deteriorated the mechanical properties of the alloys. A significant amount of porosity was observed at the sample with 1wt%. Ca and the longer freezing range of the alloy was believed to cause the formation of porosity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.8
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• pp.658-666
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• 2000

Sb and Sb-Fe doped SnO$_2$film resistors were prepared by spray pyrolysis technique. The effects of Sb and Sb-Fe addition on TCR and electrical properties of SnO$_2$film resistors were studied. Also the dependence of electrical properties on the substrate temperature and substrate-nozzle distance was investigated. The Sn-Sb system with 7.9 mol% SbCl$_3$(STO-406) and Sn-Sb-Fe systems with 7.3 mol% SbCl$_3$+7.3 mol% FeCl$_3$(STO-407) and with 3.4 mol% SbCl$_3$+7.7mol% FeCl$_3$(STO-408) were prepared. Both of the systems Sn-Sb and Sn-Sb-Fe represented nonlinearity of TCR with temperature. As the amount of Fe increased TCR was shifted to positive direction. Decreasing Sb or increasing Fe caused resistivity to increase. Also increasing Fe caused the crystallization degree of rutile structure in SnO$_2$film to decrease. The electrical resistivity decreased with increasing substrate temperature The resistivity decreased with increasing substrate-nozzle distance in the ranges from 15 to 25 cm and increased rapidly at the distance over 25cm.

• Korean Journal of Materials Research
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• v.12 no.5
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• pp.369-374
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• 2002

To investigate the corrosion behavior of Zr-1.0Nb-xSn (x=1.0, 1.5, 2.0 and 2.5wt. %)alloy system, the corrosion tests of Zr-1.0Nb-xSn alloys were carried out in steam at $400^{\circ}C$ for 125 days and in 70ppm LiOH solution at $360^{\circ}C$ for 180 days. The matrix microstructures of the test specimens were analyzed using TEM and the oxide structures on the test specimens were analyzed using XRD. It was found from the analyses that the more Sn content the alloy had, the faster it was corroded and with the increase of Sn content in the alloy the fraction of $t-ZrO_2$ to $m-ZrO_2$ was decreased. It was also found that the alloys having more Sn showed more dislocation density than those having less.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.