• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1466-1468
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• 2009

The preparation method of copper nanopowder by dry process for conductive ink was investigated. Inert gas condensation method was used to synthesize copper nanopowder. The produced powders was spherical and sized 10~100nm flowing the conditions. The results showed that input voltage and evaporation rate is critical variables for nano-sized copper powder.

• Journal of the FoodService Safety
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• v.3 no.1
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• pp.8-18
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• 2022

Dry-aging is one of the traditional aging processes, especially for beef. This aging process is being popular, because it produces unique brown/roasted flavor and texture that consumers prefer. However, as it is exposed to outside without packaging food safety concerns have been raised. The objective of this study was to investigate the presence of total aerobic bacteria (TAB) and pathogenic bacteria in manufacturing environment and suggest the safety management plan for the production of dry-aged meat. Surface samples from 66 environmental and 6 beef carcass samples were collected. According to the monitoring results, the contamination levels of TAB were in the order of shelves (5.4±1.1 Log CFU/cm²), cotton gloves (2.9±0.2 Log CFU/cm²), and door knobs (2.8±0.4 Log CFU/cm²) in the dry-aging room. In the door knobs, the level of mold was higher than that of yeast. These results indicate that the mold spores may be cross-contaminated with environmental factors inside the aging room. The risk factors that may occur during the manufacturing process were presented and possibility of risk was determined. From the aspect of microbiology, aging and trimming steps were determined as the critical control points. The temperature of the aging room should be maintained below 10℃ and the humidity below 75-85%. Based on the monitoring and the risk assessment of the dry-aging process, we prepared the safety management plan for the production of dry-aged meat, and it should be useful in improving the food safety of dry-aged meat.

• Journal of the Korea Concrete Institute
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• v.18 no.3 s.93
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• pp.415-423
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• 2006

As the shortage of natural & good quality aggregate for concrete, it is needed development of alternative aggregate. At the present time, the crushed sand is widely used among the alternation aggregate, and the usage of crushed sand will be increased more and more. Generally, crushed sud is produced with wet process in domestic, but some manufacturing companies which are handicapped with local restrict are produced by dry process. In this study, analyzing the facilities of dry crushed sand, the quality properties of dry crushed sand was done by Korean Industrial Standards. Based on the quality results of dry crushed sand, the experiment of concrete with the dry crushed sand which is substitute for sea sand was done. As the results of basic qualities, the amount of 0.08 mm sieve passing ratio was over KS criteria, and the fineness modulus was higher than sea sand, and the other physical properties of dry crushed sand was similar to sea sand. The results of concrete experiment, according to the substitutive ratio of dry crushed sand is increased, the slump and air content of concrete was decreased by increase of fine particles of dry crushed sand, and the unit weight content, compressive & tensile strength of concrete were increased on the contrary. The physical properties of concrete used dry crushed sand were showed same tendency without relation to W/B. Consequently, if the fine particle contents of dry crushed sand was lower, it is judged that dry crushed sand is no problem to use for concrete aggregate and the amount of usage will be increased.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.15 no.1
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• pp.19-26
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• 2005

In previous report, we presented that petroleum based solvents used in dry cleaning shop was almost similar to stoddard solvent defined by ACGIH and NIOSH, and the occupational exposure standard of stoddard solvent could be used in total exposure assessment of those solvents. The specific aim of the this study was to evaluate of the solvent exposure used in commercial dry cleaning shops by using occupational exposure standard of stoddard solvent. We conducted first survey of 8 self-employed dry cleaning shops and 5 factory type dry cleaning shops from July to August, and second survey of the same shops from October to November in 2002. The exposure concentration to the solvent during loading and unloading activity of vented dry cleaning machine was 489.2ppm(GM), 270.3ppm(GM), respectively, which was almost excursion limit(500ppm) of ACGIH, and exceed the ceiling limit(312ppm) of NIOSH. The time-weighted average (TWA) worker exposure to the solvent was 21.3ppm(GM) at self-employed shops, 20.7ppm(GM) at factory type shops on first survey, and 31.1ppm(GM), 33.7ppm(GM), respectively on second survey. The TWA exposure concentration of workers with spotting and cleaning machine operating job was 25.4ppm(GM), which was 2.9 times higher than the TWA exposure concentration, 8.8ppm(GM) of press workers. All TWA exposure concentrations was lower than OEL(100ppm) of stoddard solvent. We found that the most heavy exposure process at dry cleaning was loading, unloading process, and the vent of dry cleaning machine was the main emission source for workers exposure to petroleum based solvent.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1273-1276
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• 2007

We provide a newly developed dry etching process for the fabrication of ZnO-based oxide TFTs. The etching characteristics of ZnO (active layer) and $Al_2O_3$ (gate insulator) thin films were systematically investigated when the etching gas mixtures and their mixing ratios were varied in the heliconplasma etching system.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.2
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• pp.60-69
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• 1998

Polysilicon surface mdoification tecnique is developed to reduce the sticking of microstructures fabricated by micromachining. Modified anti-sticking grain holes are simply formed by two-step dry eth without additional photolithography nor deposition of thin films. Both process-induced sticking and in-use sticking are successfully reduced more than two times by adopting grain holed polysilicon substrate. A sticking model for cantilever beam is derived. This model includes bending moment stems from stress gradient along the thickness directionof structural polysilicon. Because the surface tension of rinse liquid and the surface energy of the solids to be stuk tend to decrease in recently developed anti-sticking techniques, the effect of stress gradient will play an important role to analyze the sticking phenomena. Effect of the temperature during post-release rinse and dry is modelled and verified experimentally. Based on developed anti-sticking polysilicon structure and the sticking model, sticking of microstructure, fabricated by simple wet process including sacrificial layer etch and rinse with deionized water without special equimpment for post-release rinse and dry was alleviated more than 3.5 times.

• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.276-278
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• 1997

The reliable etching process is one of the essential steps in fabricating GaN based-device. High etch rate is needed to obtain a deeply etched structure and perfect anisotropic etched facet is needed to obtain lasing profile. In the research, therefore, we had proposed a planar inductively coupled plasma etcher (Planar ICP Etcher) as a high density plasma source, and studied the etching mechanism using the $CH_4/H_2$/Ar gas mixture. Dry etching characteristics such as etch rate, anisotropic etching profile and so on, for the III-V nitride layers were investigated using Planar ICP Etcher, based on the plasma characteristic as a variation of plasma process parameters.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.1
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• pp.34-40
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• 2013

The 1st assessment(performance test) was applied to assure the floor impact sound performance for developing the dry double-floor with the change of rubber hardness of the upper panel's support and the ceiling structure of the sub-floor. Depends on the change of the rubber hardness in sub-structure, the heavy-weight sound impact value is improved up to 3 dB, and the light-weight sound impact value is moved up to 21 dB, comparing with the bare-slab. Also, the improved value for the floor impact sound conjugating with the sub-floor's ceiling was 5 dB. Based on this result, the 2nd assessment(performance test) was made the state that the rubber hardness of the sub-floor support was ranged between 50 and 70 for considering the stability of walking patients. In addition to this process, the assessment was carried out with a variety of ceiling structure applied to the dry double-floor structure with the air flow system on the sub-floor's ceiling. The result for the 2nd assessment proved that TYPEII-3 had the better sound reduction performance in the heavy-weight impact sound test than other types, and also for the light-weight impact sound TYPEII-3 had the 29 dB sound reduction performance overall. Henceforth, based on the result the research for the sound reduction performance from the floor impact sound shall be ongoing process as well as the development of a double-dry floor and a sound reduction ceiling to suitable on the field.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.10a
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• pp.280-285
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• 2012

The 1st assessment (performance test) was applied to assure the floor impact sound performance for developing the dry double- floor with the change of rubber hardness of the upper panel's support and the ceiling structure of the sub-floor. Depends on the change of the rubber hardness in substructure, the heavy-weight sound impact value is improved up to 3 dB, and the light-weight sound impact value is moved up to 21 dB, comparing with the bare-slab. Also, the improved value for the floor impact sound conjugating with the sub-floor's ceiling was 5dB. Based on this result, the 2nd assessment (performance test) was made the state that the rubber hardness of the sub-floor support was ranged between 50 and 70 for considering the stability of walking patients. In addition to this process, the assessment was carried out with a variety of ceiling structure applied to the dry doublefloor structure with the air flow system on the sub-floor's ceiling. The result for the 2nd assessment proved that TYPE-11 had the better sound reduction performance in the heavy-weight impact sound test than other types, and also for the light-weight impact sound TYPE-11 had the 29 dB sound reduction performance overall. Henceforth, based on the result the research for the sound reduction performance from the floor impact sound shall be ongoing process as well as the development of a double-dry floor and a sound reduction ceiling to suitable on the field.

• Journal of the Optical Society of Korea
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• v.6 no.4
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• pp.180-184
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• 2002

In this study, we investigated mask errors, photo errors with attenuated phase shift mask and off-axis illumination, and etch errors in dry etch conditions. We propose that total process proximity correction (TPPC), a concept merging every process step error correction, is essential in a lithography process when minimum critical dimension (CD) is smaller than the wavelength of radiation. A correction rule table was experimentally obtained applying TPPC concept. Process capability of controlling gate CD in DRAM fabrication should be improved by this method.