• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.112-115
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• 2017

ITO thin films were grown on the glass substrate under various oxygen gas flow and substrate temperature by using FTS (Facing Target Sputtering) system. To investigate properties of as-prepared films for transparent electrical devices, we employed four-point probe, UV-VIS spectrometer, X-ray diffractometer (XRD), scanning electron microscopy (SEM), Hall Effect measurement system and Atomic Force Microscope (AFM). As a results, all of prepared samples has high transmittance of over 80 % in the visible range (300-800 nm). Their resistivity increased as a function of oxygen gas flow and substrate temperature due to their crystal structure and oxygen defect in the films. As-prepared films have a resistivity of under $10^{-4}({\Omega}-cm)$.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.445-446
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• 2007

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

• Journal of Information Display
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• v.13 no.4
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• pp.139-143
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• 2012

In this study, optical simulation was used to compare three optical structures that could be applied to the typical organic light-emitting diode to increase the outcoupling efficiency. These were spherical scattering particles (treated as Mie scatterers) embedded in the glass substrate, microlenses formed on the glass substrate, and a diffusing layer (DL) with a Gaussian scattering distribution function inserted between the indium tin oxide (ITO) and the glass substrate. It was found that the application of microlens array and that of scattering particles in the glass substrate exhibited similar enhancements in the outcoupling efficiency when the density and the refractive index of the scattering particles were optimized. The DL located at the interface between the glass and the ITO further enhanced the efficiency because it could further extract the trapped light in the waveguide mode. The appropriate combination of these three structures increased the outcoupling efficiency to about 42%, which is much greater than the typical values of 15-20% when there is no optical structure for light extraction.

• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• Journal of the Semiconductor & Display Technology
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• v.8 no.3
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• pp.51-55
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• 2009

We investigated that electrical and optical the properties of IZO thin film for OLED anode application. The IZO thin film was the deposited on the glass substrate by facing targets system as a function of substrate temperature. As a result, the electrical and optical property of IZO thin film prepared with $150^{\circ}C$ was most excellent. To confirm the suitability of the IZO thin film for OLED anode, we evaluated the performance of OLED with IZO/TPD/Alq3/LiF/Al fabricated on IZO anode. Also, the performance of OLED fabricated on IZO anode showed the most excellent at $150^{\circ}C$ substrate temperature.

• Journal of Information Display
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• v.11 no.4
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• pp.140-143
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• 2010

A simple and versatile method of fabricating color patterns in two-dimension (2D) and three-dimension (3D) was developed using the selective-wettability approach. Red, green, and blue color elements are sequentially formed on a single substrate in a pattern-by-pattern and/or pattern-on-pattern fashion, through a simple coating process. Either 2D or 3D structures in an array format are produced by controlling the thickness of the hydrophobic layer (HL) coating a substrate within the framework of wetting transition. Moreover, it was demonstrated that the stacked geometry of two successive patterns can be easily tailored for various types of color arrays, with the pattern fidelity of a few tens of nanometers in terms of only a parameter of the HL thickness.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1390-1393
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• 2005

We fabricated an efficient top emission organic light emitting diode (FTEOLED) on paper substrates. For water proof and surface planarization, parylene of 5mm thick has been coated on copy paper substrate by vapor polymerization. As use this coating layer, fabrication of device was possible by photolithography and wet etching. Because paper is not transparent, we adapted top emission structure with transparent cathode and reflective anode. The FTOLED on paper showed the excellent electrical characteristic, $109cd/m^2$, 2.3cd/A at 10V.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.962-964
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• 2007

A 14.1-inch reflective type Thin Film Transistor-Electric Phoretic Display was developed at the esolution of 1280 x 900 lines on plastic substrate. All of the processes of TFT were carried out below $100\;^{\circ}C$ on PES plastic films. The process conditions of TFT were optimized for large area TFT-LCD on plastic substrate. At $60^{\circ}C$ high temperature during 160hours, TFT does not delaminate and IV characteristic is also satisfied.

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.35-40
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• 2008

In OLED vacuum evaporation process, the essential requirements include good uniformity of the film thickness over a glass substrate. And, it is commercially significant to improve the consuming efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. In this paper, to achieve the better thickness uniformity and the better organic material consuming rate, a process optimization algorithm was developed by understanding vacuum evaporation process parameters that affect the material consuming efficiency and the uniformity of film thickness. Based on the method developed in this study, the vacuum evaporation process of OLED was successfully controlled. The developed method allowed the manufacture of high quality OLED displays with cheaper fabrication cost.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.445-446
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• 2005

This letter reports the fabrication of polycrystalline silicon thin-film transistors (poly-Si TFT) on flexible plastic substrates using amorphous silicon (a-Si) precursor films by sputter deposition. The a-Si films were deposited with mixture gas of argon and helium to minimize the argon incorporation into the film. The precursor films were then laser crystallized using XeCl excimer laser irradiation and a four-mask-processed poly-Si TFTs were fabricated with fully self-aligned top gate structure.