• Title/Summary/Keyword: direct fabrication

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The effect of MEA fabrication procedure on PEMFC performance (고분자전해질 연료전지의 MEA 제조방법에 따른 성능비교)

  • Cho Yong-Hun;Cho Yoon-Hwan;Park In-Su;Choi Baeckbom;Jung Dae-Sik;Sung Yung-Eun
    • 한국신재생에너지학회:학술대회논문집
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    • 2005.06a
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    • pp.291-295
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    • 2005
  • The PEMFC behavior is quite complex and is influenced by several factors, including composition and structure of electrodes and membrane type. Fabrication of MFA is important factor for proton exchange membrane fuel cell. MFA of PEMFC with hot pressing and direct coating method were prepared, and performances were evaluated and compared each other. The effect of MEA preparation methods, hot pressing methods and direct coating methods, on the cell performance was analyzed by impedance spectroscopy and SEM. The performance of PEMFC wi th direct coat ing method was better than wi th hot pressing method because membrane internal resistance and membrane-:-interfacial resistance were reduced by elimination of hot pressing process in MEA fabrication. In addition the micro structure of MEA with direct coating method reveals uniform interface between membrane and catalyst layer.

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Fabrication and Properties Analysis of MEA for PEMFC (고분자전해질 연료전지용 MEA 제조 및 특성평가)

  • Cho Y.H.;Cho Y.H.;Park I.S.;Sung Y.E.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.230-234
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    • 2005
  • Fabrication of MEA is important factor for proton exchange membrane fuel cell (PEMFC). MEA of PEMFC with hot pressing and direct coating method were prepared, and performances were evaluated and compared each other. The effect of MEA preparation methods, hot pressing methods and direct coating methods, on the cell performance was analyzed by impedance spectroscopy and SEM. The performance of PEMFC with direct coating method was better than with hot pressing method because membrane internal resistance and membrane-interfacial resistance were reduced by elimination of hot pressing process in MEA fabrication. In addition the micro structure of MEA with direct coating method reveals uniform interface between membrane and catalyst layer.

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Development of a Photopolymer-based Flexible Tactile Sensor using Layered Fabrication and Direct Writing (적층조형과 직접주사방식을 결합한 광경화성 수지 기반의 신축성 촉각센서의 제작)

  • Woo, Sang Gu;Lee, In Hwan;Kim, Ho-Chan;Lee, Kyung Chang;Cho, Hae-Yong
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.2
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    • pp.8-14
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    • 2014
  • Many kinds of robots and machines have been developed to replace human laborin industrial and medical fields, as well as domestic life. In these applications, the device sneed to obtain environmental data using diverse sensors. Among such sensors, the tactile sensor is important because of its ability to get information regarding surface texture and force through the use of mechanical contact. In this research, a simple tactile sensor was developed using the direct writing of pressure sensitive material and layered fabrication of photocurable material. The body of the sensor was fabricated using layered fabrication, and pressure sensitive materials were dispensed between the layers using direct writing. We examined the line fabrication characteristics of the pressure sensitive material according to nozzle dispensing conditions. A simple $4{\times}4$ array flexible tactile sensor was successfully fabricated using the proposed process.

Direct Carrier System Based 300mm FAB Line Simulation (Direct 반송방식에 기반을 둔 300mm FAB Line 시뮬레이션)

  • Lee, Hong-Soon;Han, Young-Shin;Lee, Chil-Gee
    • Journal of the Korea Society for Simulation
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    • v.15 no.2
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    • pp.51-57
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    • 2006
  • Production environment of semiconductor industry is shifting from 200mm wafer process to 300mm wafer process. In the new era of semiconductor industry, FAB (fabrication) Line Automation is a key issue that semiconductor industry is facing in shifting from 200mm wafer fabrication to 300mm wafer fabrication. In addition, since the semiconductor manufacturing technologies are being widely spread and market competitions are being stiffened, cost-down techniques became basis of growth. Most companies are trying to reduce average cycle time to increase productivity and delivery time. In this paper, we simulated 300mm wafer fabrication semiconductor manufacturing process by laying great emphasis on reduce average cycle time.

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Fabrication of three dimensional microstructures using laser direct writing technique (레이저묘화 기술을 이용한 3차원 미세구조물 제조)

  • 정성호;한성일
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.670-673
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    • 2003
  • Fabrication of three dimensional microstructures by laser-assisted chemical vapor deposition of material is investigated. To fabricate microstructures, a thin layer of deposit in desired patterns is first written using laser direct writing technique and on top of this layer a second layer is deposited to provide the third dimension normal to the surface. By depositing many layers. a three dimensional microstructure is fabricated. Optimum deposition conditions for direct writing of initial and subsequent layers with good surface quality and profile uniformity are determined. Using an arson ion laser and ethylene as the light source and reaction gas, respectively, fabrication of three-dimensional carbon microstructures is demonstrated.

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Ion Beam Induced Micro/Nano Fabrication: Shape Fabrication (이온빔을 이용한 마이크로/나노 가공: 형상가공)

  • Kim, Heung-Bae;Hobler, Gerhard
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.10
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    • pp.109-116
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    • 2007
  • Focused ion beams are a potential tool for micro/nano structure fabrication while several problems still have to be overcome. Redeposition of sputtered atoms limits the accurate fabrication of micro/nano structures. The challenge lies in accurately controlling the focused ion beam to fabricate various arbitrary curved shapes. In this paper a basic approach for the focused ion beam induced direct fabricate of fundamental features is presented. This approach is based on the topography simulation which naturally considers the redeposition of sputtered atoms and sputtered yield changes. Fundamental features such as trapezoidal, circular and triangular were fabricated with this approach using single or multiple pass box milling. The beam diameter(FWHM) and maximum current density are 68 nm and $0.8 A/cm^2$, respectively. The experimental investigations show that the fabricated shape is well suited for the pre-designed fundamental features. The characteristics of ion beam induced direct fabrication and shape formation will be discussed.

Investigation into direct fabrication of nano-patterns using nano-stereolithography (NSL) process (나노 스테레오리소그래피 공정을 이용한 무(無)마스크 나노 패턴제작에 관한 연구)

  • Park Sang Hu;Lim Tae-Woo;Yang Dong-Yol
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.3 s.180
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    • pp.156-162
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    • 2006
  • Direct fabrication of nano patterns has been studied employing a nano-stereolithography (NSL) process. The needs of nano patterning techniques have been intensively increased for diverse applications for nano/micro-devices; micro-fluidic channels, micro-molds. and other novel micro-objects. For fabrication of high-aspect-ratio (HAR) patterns, a thick spin coating of SU-8 process is generally used in the conventional photolithography, however, additional processes such as pre- and post-baking processes and expansive precise photomasks are inevitably required. In this work, direct fabrication of HAR patterns with a high spatial resolution is tried employing two-photon polymerization in the NSL process. The precision and aspect ratio of patterns can be controlled using process parameters of laser power, exposure time, and numerical aperture of objective lens. It is also feasible to control the aspect ratio of patterns by truncation amounts of patterns, and a layer-by-layer piling up technique is attempted to achieve HAR patterns. Through the fabrication of several patterns using the NSL process, the possibility of effective patterning technique fer various N/MEMS applications has been demonstrated.

Development of Direct Metal Tooling (DMT) Process for Injection Mold Core with Curved Conformal Cooling Channel (곡선형 형상적응형 냉각채널을 갖는 금형 코어 제작을 위한 DMT 공정개발)

  • Han, Ji Su;Yu, Man Jun;Lee, Min Gyu;Lee, Yoon Sun;Kim, Woo-Sung;Lee, Ho Jin;Kim, Da Hye;Sung, Ji Hyun;Cha, Kyoung Je
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.11
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    • pp.103-108
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    • 2019
  • The cooling rate and the uniformity of mold temperature, in the injection molding process, possess great influences on the productivity and quality of replications. The conformal cooling channel, which is of a uniform spacing from the mold cavity by the metal additive manufacturing process, receives much attention recently. The purpose of this study is to develop a mold core with a curved conformal cooling channel for a pottery-shaped thick-wall cosmetic container through the hybrid method of direct metal tooling (DMT) process. In this study, we design a mold core that contains the curved cooling channel for the container. A method that divides the cavity is proposed and the DMT process is carried out to form the curved cooling channel. The test mold core, with the curved conformal cooling channel, has been fabricated by the proposed method to confirm the feasibility of the design concept. We show that no leakage is observed for the additive manufactured test mold core, and its physical properties demonstrate that it can be sufficiently used as the injection mold core.