• International Journal of Precision Engineering and Manufacturing
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• v.7 no.1
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• pp.13-17
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• 2006

Self-Assembled Monolayers (SAMs) formed by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecules and bio molecules. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance of Self-Assembled Monolayers in selective etching of thin metal film. In this report, we present the several machining method to form the nanoscale structure by Mask-Less laser patterning using alknanethiolate Self-Assembled Monolayers such as thin metal film etching and heterogeneous SAM structure formation.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.12
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• pp.160-166
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• 2004

Self-Assembled Monolayers(SAMs) by alkanethiol adsorption to thin metal film are widely being investigated fer applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecule and bio molecule. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance of Self-Assembled Monolayers in selective etching of thin metal film. In this report, we present the several machining method to form the nanoscale structure by Mask-Less laser patterning using alknanethiolate Self-Assembled Monolayers such as thin metal film etching and heterogeneous SAMs structure formation.

• The Korean Journal of Ceramics
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• v.7 no.2
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• pp.74-79
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• 2001

Alumina composite reinforced by chopped alumina fiber was fabricated by filter-pressing the fiber slurry followed by the infiltration of alumina slurry. The chopped fiber was coated with nickel by electroless plating method. The green samples were densified by hot-pressing. Microstructures were studied by SEM and the mechanical properties such as bending strength and fracture toughness were measured. The resulting mechanical properties were analyzed in relation with processing parameters such as preform density and resulting microstructures. The load-displacement curve of the specimen with Ni interlayer but without Ni inclusion showed brittle fracture mode due to the direct contact between matrix and fiber. The load-displacement curve of the specimen with Ni interlayer and Ni inclusion in the matrix which is introduced by high applied pressure during specimen preparation showed non-brittle fracture mode due to the fiber pull-out and dutile phases in the matrix.

• Journal of Korea Foundry Society
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• v.20 no.3
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• pp.188-196
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• 2000

A vacuum casting was proposed as a new fabrication method of Si wafer for solar cell substrate. It was tried to fabricate a Si plate with good properties and to reduce the production cost by direct vacuum casting. By $5{\sim}10$ cmHg of pressure difference Si plate with $50{\times}46{\times}1.5\;mm^3$ was fabricated. For the preventing of the reaction between graphite mold and Si melt, BN powder coating or BN insert were used. The Si wafer was poly crystalline with 100 ${\mu}m{\sim}1$ mm order of grain size. And there were some twins and dislocations in the grains.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.6
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• pp.52-57
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• 1999

Funtional metal prototypes are often required in numerous industrial applications. These components are typically needed in the early stage of a project to determine form, fit and function. Recent R/P(Rapid Prototyping) part are made of soft materials such as plastics, wax, paper, these master models cannot be employed durable test in real harsh working environment. Parts by direct metal rapid tooling method, such as laser sintering, by now are hard to get net shape, pores of the green parts of powder casting method must be infiltrated to get proper strength as tool, and new type of 3D direct tooling system combining fabrication welding arc and cutting process is reported by song etc. But a system which can build directly 3D parts of high performance functional material as metal part would need long period of system development, massive investment and other serious obstacles, such as patent. In this paper, through the rapid tooling process as silicon rubber molding using R/P master model, and fabricate wax pattern in that silicon rubber mold using vacuum casting method, then we tranlsated the wax patterns to numerous metal prototypes by new investment casting process combined conventional investment casting with rapid pototyping & rapid tooling process. with this wax-injection-mold-free investment casting, we developed new investment casting process of fabricating numerous functional metal prototypes from one master model, combined 3-D CAD, R/P and conventional investment casting and tried to expect net shape measuring total dimension shrinkage from R/P part to metal part.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.354-354
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• 2007

Titanium nitride (TiN) thin films are widely used for hard coatings due to their superior hardness. In this paper, we wanted see how the films properties are changed according to DC power. TiN thin films were deposited by direct current (DC) magnetron sputtering method using TiN compound target on silicon substrates. The films structural properties are examined by X-ray Diffractions (XRD) and tribological properties are measured by nano-indentation, nano-scratch tester, nano-stress tester. Especially in DC power of 150 W, the maximum hardness and the minimum residual stress of TiN film exhibited about 25 GPa and 1 GPa, respectively. And also, the critical load of TiN film prepared by magnetron sputtering method were measured over 30 N.

• Korean Journal of Environmental Agriculture
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• v.18 no.3
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• pp.265-271
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• 1999

The direct seeding of seeds or the pellets of three native tree species (Pinus densiflora, Parthenocissus tricuspidata and Rhus chinensis) was tried on the rock cut-slope revegetation bed established by construction of mechanical excavation or erosion break with artificially enriched soil medium. The seed $pellet(1{\sim}2\;cubic\;cm)$ made by coating seeds(treated with proper previous pregermination treatments) with the mixture of peatmoss, clay, chemical absorbant(3.5:1.0:0.2, v/v) showed about twice better percent germination than the control seeds. The percent germination and the survival rate of the germinated seedlings were higher in the spring direct seeding than the summer or the fall. The soil medium containing the compost showed extremely low percent $germination(0{\sim}3%)$ which presumably attributed to the compost inducing damping-off disease. The survival rates were affected mainly by shading of natural herbaceous vegetation invading from outside to the revegetation bed. The planting of two year old container seedlings of P. densiflora and P. tricuspidata on August 2, 1998 was successful indicating that it could be an alternative revegetation method in case the summer direct seeding is unfavorable.

• Applied Biological Chemistry
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• v.36 no.1
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• pp.7-10
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• 1993

ELISA method was applied for the screening of zearalenone producing strains. The developed ELISA was as follow: $125\;{\mu}l$ of diluted solution (1 : 500) of antibody was added to each microtiter well and incubated overnight at $40^{\circ}C$. For direct competitive ELISA, samples and zearalenone-peroxidase conjugate were mixed in a 1 : 1 ratio, and a $100\;{\mu}l$ of aliquot was then added to antisera-coated wells. Plates were incubated for 30 minutes at $37^{\circ}C$, and wells washed 6 times, and $100\;{\mu}l$ of ABTS substrates was added. Plates were incubated for antother 15 minutes at $37^{\circ}C$, and $100\;{\mu}l$ of stopping reagent was added to the wells and absorbance was recorded at 410nm on ELISA Reader. Among 19 strains showed zearalenone-producing ability by ELISA, 3 strains (R-5, C-46, S-134) produced more than 50 ng/ml of zearalenone.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• Journal of Sensor Science and Technology
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• v.19 no.3
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• pp.202-208
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• 2010

This study examined the dependency of crystalline orientation and electric properties of sol-gel PZT film on hydrolysis, a $PbTiO_3$ seed layer and a concentration of sol-gel solution. The PZT thin films were prepared by using 2-Methoxyethanol-based sol-gel method and spin-coating on Pt/Ti/$SiO_2$/Si substrates. The 1-${\mu}m$-thick PZT films were coated and then fired in a furnace by direct insert method. The highly (111) oriented PZT film of pure perovskite structure could be obtained. We could control the degree of orientation by various parameters such as hydrolysis, a $PbTiO_3$ seed layer and a concentration of sol-gel solution. The highest measured remanent polarization, dielectric constant and piezoelectric coefficient are $24.16\;{\mu}C/cm^2$, 2808, and 159 pC/N, respectively.