• The Korean Journal of Ceramics
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• v.1 no.1
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• pp.13-20
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• 1995

Effects of thermal annealing on the dielectric/piezoelectric properties of $Pb(Zn, Mg)_{1/3}Nb_{2/3}O_3-PbTiO_3$ ceramics (PZMNPT) with Zn/Mg=6/4) were examined across the rhombohedral/tetragonal morphotropic phase boundary (MPB). Both the relative dielectric permittivity ($\varepsilon$r)and the piezoelectric constant($d_33$)/electromechanical coupling constant ($k_p$)were increased by thermal annealing ($800^{\circ}$~$900^{\circ}C$) after sintering at $1150^{\circ}C$ for 1 hr. Based on the dielectric analysis using the series mixing model and the concept of a random distribution of the local Curie points, the observed improvements in the dielectric and piezoelectric properties of PZMN-PT were interpreted in terms of the elimination of PbO-rich amorphous intergranular layers(~1nm) induced by thermal annealing. A concrete evidence of the presence of amorphous grain-boundary layers in the unannealed (as-sintered) specimen was obtained by examining the structure of intergranular region using a TEM.

• Electrical & Electronic Materials
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• v.8 no.1
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• pp.64-70
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• 1995

We discussed the thermal analysis for a recording media with the variation of the laser pulse duration, the laser power and the temperature distribution in order to optimize the Te-based antireflection structure from the computer calculations. In the case that the radial heat diffusion is negligible, we can calculate the maximum temperature of the recording layer at the center of the spot by the Simple Model. The temperature profile of the recording layer is obtained from the Numerical Model by considering the total specific heat and the latent heat. As a result, the effect of the heat sinking acting as a thermal loss for the hole formation could be minimized by introducing the pulse with the hole formation duration(.tau.) below the thermal time constant(.tau.$_{D}$) of a dielectric layer. These requirments can be satisfied by using the dielectric thickness of the 2nd ART(Anti-Reflection Trilayer) condition or the dielectric materials with a low thermal diffusivity.y.

• Macromolecular Research
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• v.17 no.10
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• pp.785-790
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• 2009

In this paper, the relaxation behavior of the regenerated silk fibroin (SF) films was investigated using dielectric thermal analysis (DETA), and compared with the dynamic mechanical behavior obtained from dynamic mechanical thermal analysis (DMTA), in order to gain a better understanding of the characteristics of dielectric behavior of SF film and identify the differences between the two analyses. Compared to DMTA, DETA exhibited a higher sensitivity on the molecular relaxation behaviors at low temperature ranges that showed a high $\gamma$-relaxation peak intensity without noise. However, it was not effective to examine the relaxation behaviors at high temperatures such as $\alpha-$ and ${\alpha}_c$-relaxations that showed a shoulder peak shape. On the contrary, DMTA provided more information regarding the relaxation behaviors at high temperatures, by exhibiting the changes in width, intensity and temperature shift of the $\alpha$-relaxation peak according to various crystallinities. Conclusively, DETA and DMTA can be utilized in a complementary manner to study the relaxation behavior of SF over a wide temperature range, due to the different sensitivity of each technique at different temperatures.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.2
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• pp.48-54
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• 2003

To evaluate the radiation degradation of ethylene propylene rubber (EPR), radiation effects on EPR were investigated by using dielectric analysis and thermal-gravimetric analysis. Permittivity, loss factor, tan$\delta$, and thermal decomposition temperature were observed for ${\gamma}$-ray irradiated EPR. As the radiation dose was increased, the peak temperature of the loss factor and tans of EPR were increased and loss factor and tan$\delta$ at peak temperature were decreased. Activation energies were calculated using loss factor and thermal decomposition for ${\gamma}$-ray irradiated EPR as well. The trends of both calculated activation energies showed the same tendencies as radiation dose was increased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.05a
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• pp.123-126
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• 1994

We discussed the thermal analysis for recording media with the variation of the laser pulse duration and the power and the temperature distribution for the optimized Te-based antireflection structure by using the computer calculations. If the radial diffusion of heat is negligible, we can calculate the maximum temperature at the spot center in recording layer by Simple Method, and the temperature profile considering the specific heat and the latent heat by Numerical Method. As a result, the effect of the heat sinking which acted as a loss for the hole formation can be minimized by introducing the pulse of the hole formation duration( $\tau$ ) shorter than the thermal time constant( $\tau$$\sub$D/) of dielectric layer. This requirments can be satisfied as using the dielectric thickness of the 7nd ART condition or the dielectric materials with low thermal diffusivity.

• Journal of the Korean Ceramic Society
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• v.30 no.2
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• pp.93-100
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• 1993

The effects of MgO addition on thermal expansiion coefficient and dielectric constant of mullite were studied. Thermal coefficient and dielectric constant decrease with increasing MgO content and exhibit a minimum value at 1wt% MgO. However, above 3wt% MgO content both values increase. Result of X-ray diffraction analysis how that mullite compositions which include more than 0.1wt% MgO form cordierite. Spinel is also formed as well as cordierite in the composition containing more than 3wt% MgO. The results indicate that addition of MgO affect the thermal expansion coefficient and dielectric constant of mullite substrate because of the formation of new phases; cordierite and spinel. The thermal expansion coefficient and dielectric constant are affected mainly by cordierite and spinel in the regions containing less than more than 3wt% MgO, respectively.

• Journal of the Korean Ceramic Society
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• v.39 no.3
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• pp.222-225
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• 2002

Microwave dielectric properties of the layered and functionally graded materials (FGMs) of $Mg_{0.93}Ca_{0.07}TiO_3$ (MCT) and $(Ca_{0.3}Li_{0.14}Sm_{0.42})TiO_3$(CLST) were investigated as a function of the volume ratio of two components. Dielectric constant was decreased with an increase of the volume ratio of MCT which had a lower dielectric constant thant CLST. For the layered FGMs specimens, the difference of thermal expansion coefficients between two components induced thermal strain to dielectric layers, which was confirmed by the plot of ${\Delta}$k (X-ray diffraction peak width0 versus k (scattering vector) using the double-peak Lorentzian function, f(x). Quality factor of the specimens was affected by the thermal strain of dielectric layer, especially MCT layer. For the specimen with the volume ratio of MCT/CLST = 2, the qulaity factor of the specimen showed a minimum value due to the maximum thermal strain fo MCT layer.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.33-38
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• 2013

In this study, both a finite element analysis and an experimental analysis are executed to investigate the mechanical characteristics of dielectric material effects on warpage. Also, viscoelastic material properties are measured by DMA and are considered in warpage simulation. A finite element analysis is done by using both thermal elastic analysis and a thermo-viscoelastic analysis to predict the nonlinear effects. For experimental study, specimens warpage of non-symmetric structure with body size of $22.5{\times}22.5$ mm, $37.5{\times}37.5$ mm and $42.5{\times}42.5$ mm are measured under the reflow temperature condition. From the analysis results, experimental warpage is not similar to FEA results using thermal elastic analysis but similar to FEA results using thermo-viscoelastic analysis. Also, its effect on substrate warpage is increased as core thickness is decreased and body size is getting larger. These FEA and the experimental results show that the nonlinear characteristics of dielectric material play an important role on substrate warpage. Therefore, it is strongly recommended that non-linear behavior characteristics of a dielectric material should be considered to control warpage of FCBGA substrate under conditions of geometry, structure and manufacturing process and so on.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.220-221
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• 2007

Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.207-208
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• 2007

Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).