• Korean Journal of Materials Research
• /
• v.2 no.3
• /
• pp.228-238
• /
• 1992

An investigation on the step-coverage of PECVD and $O_3$ ThCVD oxides was undertaken to implement into the void-free inter metal dielectric planarization using multi-chamber system for the submicron double level metallization. At various initial aspect ratios the instantaneous aspect ratios were measured through modelling and experiment by depositing the oxides up to $0.9{\mu}m$ in thickness in order to monitor the onset of void formation. The modelling was found to be in a good agreement with the observed instantaneous aspect ratio of TEOS-based PECVD oxide whose re-entrant angle was less than $5^{\circ}$. It is demonstrated that either keeping the instantaneous aspect ratio of PECVD oxide as a first layer less than a factor of 0.8 or employing Ar sputter etch to create sloped oxide edge ensures the void-free planarization after$O_3$ ThCVD oxide deposition whose step-coverage is superior to PECVD oxide. It has been observed that $O_3$ ThCVD oxide etchback scheme has shown higher yield of via contact chain than non etchback process, with resistance per via contact of $0.1~0.3{\Omega}/{\mu}m^2$.

• Journal of the Korean institute of surface engineering
• /
• v.29 no.6
• /
• pp.809-815
• /
• 1996

$Y_2O_3$-based metal-insulator-semiconductor (MIS) structure on p-Si(100) has been studied. Films were prepared by UHV reactive ionized cluster beam deposition (r-ICBD) system. The base pressure of the system was about $1 \times 10^{-9}$ -9/ Torr and the process pressure $2 \times 10^{-5}$ Torr in oxygen ambience. Glancing X-ray diffraction(GXRD) and in-situ reflection high energy electron diffracton(RHEED) analyses were performed to investigate the crystallinity of the films. The results show phase change from amorphous state to crystalline one with increasingqr acceleration voltage and substrate temperature. It is also found that the phase transformation from $Y_2O_3$(111)//Si(100) to $Y_2O_3$(110)//Si(100) in growing directions takes place between $500^{\circ}C$ and $700^{\circ}C$. Especially as acceleration voltage is increased, preferentially oriented crystallinity was increased. Finally under the condition of above substrate temperature $700^{\circ}C$ and acceleration voltage 5kV, the $Y_2O_3$films are found to be grown epitaxially in direction of $Y_2O_3$(1l0)//Si(100) by observation of transmission electron microscope(TEM). Capacitance-voltage and current-voltage measurements were conducted to characterize Al/$Y_2O_3$/Si MIS structure with varying acceleration voltage and substrate temperature. Deposited $Y_2O_3$ films of thickness of nearly 300$\AA$ show that the breakdown field increases to 7~8MV /cm at the same conditon of epitaxial growing. These results also coincide with XPS spectra which indicate better stoichiometric characteristic in the condition of better crystalline one. After oxidation the breakdown field increases to 13MV /cm because the MIS structure contains interface silicon oxide of about 30$\AA$. In this case the dielectric constant of only $Y_2O_3$ layer is found to be $\in$15.6. These results have demonstrated the potential of using yttrium oxide for future VLSI/ULSI gate insulator applications.

• Journal of the Korean Vacuum Society
• /
• v.17 no.5
• /
• pp.408-418
• /
• 2008

The rectangular resonant cavity was designed and characterized as a microwave plasma source for focused ion beam. The optimum cavity was calculated analytically and analyzed in detail by using HFSS(High Frequency Structure Simulator). Since the resonant cavity can be affected by the permittivity of quartz chamber and plasma, the cavity is designed to be changeable in one direction. By observing the microwave input power at which the breakdown begins, the optimum cavity length for breakdown is measured and compared with the calculated one, showing in good agreement with the optimum length reduced by 10cm according to the permittivity change in the presence of quartz chamber. The shape of breakdown power curve as a function of pressure appears to be similar to Paschen-curve. After breakdown, plasma densities increase with microwave power and the reduced effective permittivity in the cavity with plasma results in larger optimum length. However, it is not possible to optimize the cavity condition for high density plasmas with increased input power, because too high input power causes expansion of density cutoff region where microwave cannot penetrate. For more accurate microwave cavity design to generate high density plasma, plasma column inside and outside the density cutoff region needs to be treated as a conductor or dielectric.

• Journal of the Korean Ceramic Society
• /
• v.38 no.10
• /
• pp.942-947
• /
• 2001

Thickness dependence of orientation on piezoelectric and electrical properties was investigated by PZT (52/48) films by diol based sol-gel method. The thickness of each layer by spinning at one time was $0.2{\mu}m$ and crack-free films could be successfully deposited on 4 inches Pt/Ti/$SiO_2$/Si substrates by 0.5 mol solutions in the range from $0.2{\mu}m$ to $3.8{\mu}m$. Excellent P-E hysteresis curves were achieved, which were attributed to the well-densified PZT films and columnar grain without pores or any defects between interlayers. The (111) preferred orientation of films were shown in the range of thickness below $1{\mu}m$. As the thickness increased, the (111) preferred orientation disappeared from $1{\mu}m$ to $3{\mu}m$ region, and the orientation of films became random above $3{\mu}m$. Dielectric constants and longitudinal piezoelectric coefficient, $d_{33}$, measured by pneumatic method were saturated around the value of about 1400 and 300 pC/N respectively above the thickness of $1{\mu}m$.

• Nuclear Engineering and Technology
• /
• v.5 no.1
• /
• pp.30-37
• /
• 1973

The Nishitani's equations for impedance of anodic oxide films have been derived based on a p-i-n model under the assumption of $\omega$$\varepsilon$$\rho$$_{ο}$<<4$\pi$<<$\omega$$\varepsilon$$\rho$$_{\omega}$, where $\omega$ is angular frequency, $\varepsilon$ is dielectric constant, and $\rho$$_{ο}$ and $\rho$$_{\omega}$ are the resistivity of the interface region and the intrisic region of the anodic oxide film, respectively. Since it is not possible to evaluate all parameters in the equations, however, any clear physical picture cannot be obtained from the equations. Therefore, the equations are modified under the assumption of $\omega$$\tau$$_{\omega}$>>1 and In(1+$\omega$$^2$$\tau$$_{ο}$$^2$)<<1, where $\tau$$_{\omega}$=$\varepsilon$$\rho$$_{\omega}$(4$\pi$) and $\tau$$_{ο}$=$\varepsilon$$\rho$$_{ο}$/(4$\pi$). The modified equations are then used to explain the change in the frequency characteristics of anodic oxide films when they are heated. The change in impedance of anodic oxide films when they are heated is attributed mainly to the increase in the diffusion layer and to the decrease in the resistivity of anodic oxide films.s.

• Korean Journal of Optics and Photonics
• /
• v.28 no.1
• /
• pp.28-32
• /
• 2017

In this research, we designed an LSPR sensor based on a thin-film multilayer comprising $TiO_2$ and $SiO_2$. The thickness of the overall substrate layer of the suggested multilayer LSPR sensor is limited to 100 nm, and the number of repeating $TiO_2$ and $SiO_2$ thin films is 1-4 within a limited thickness. Additionally, a nanowire structure with a gold thin film of 40 nm, height of 40 nm, period of 600 nm, and line width of 300 nm was formed on the multilayer. To design the variable wavelength-type SPR, the angle was fixed at $75^{\circ}$ and the wavelength was changed. We then simulated the system with the finite-element method (FEM) using Maxwell's equations. It was confirmed that the resonance wavelength became shorter as the number of multilayers increased when the refractive index was fixed. We found that the wavelength changes were more sensitive. However, no changes were observed when the number of the multilayers was three or higher.

• Korean Journal of Materials Research
• /
• v.8 no.12
• /
• pp.1170-1175
• /
• 1998

PZT films without lower electrode were deposited on the highly doped Si(100) substrate with MgO buffer layer (Mgo/si) by RF magnetron sputtering method followed by the rapid thermal annealing at $650^{\circ}C$ . We investigated the dependences of the crystalline and electrical properties on the MgO thickness and the RTA post annealing. The PZT films on bare Si (without MgO) showed pyrochlore crystal structure while those on MgO(50 )/Si substrates showed the typical perovskite crystal structures. From SEM and AES analysis, the thickness of PZT films was about 7000 showing relatively smooth interface. The depth profiles indicated that atomic species were distributed homogeneously in the PZT/MgO/Si substrate. The dielectric constant($\varepsilon_{r}$ ) and remanent polarization(2Pr) were about 300 and $14\mu$C/$\textrm{cm}^2$;, respectively. The leakage current was about $3.2\mu$/A$\textrm{cm}^2$.

• The Journal of the Institute of Internet, Broadcasting and Communication
• /
• v.17 no.2
• /
• pp.245-250
• /
• 2017

From the instant of installation and operation, power cables start deteriorating. Cable systems can be maintained not only by monitoring the insulation status of the insulation layer and oversheath, but also the insulation status of the terminal and junction in high-voltage power cables. When the cable system (the cable itself and cable junctions combined) deteriorates, fire accidents happen due to dielectric breakdowns. We have invented a device to monitor the deteriorating status of cables, and installed it at Korea Western Power Co. Ltd. located in Taean, Chungcheongnam-do Province. In this paper, we present the results obtained using our device, through analysing and calculating the standard deviation of leakage current from cable insulators attached to the cables. When the standard deviation of analysed leakage current falls below a critical value, a cable system is deemed to be operating safely. But when the standard deviation of analysed leakage current is larger than the critical value, the insulation status of the terminal and junction in the cable system is considered to have seriously deteriorated. The terminal and junction in the relevant system should then be replaced preemptively in order to prevent blackout accidents of cables caused by the suspension of power supply.

• Composites Research
• /
• v.27 no.5
• /
• pp.183-189
• /
• 2014

Experimental considerations have been performed to obtain the clear optical microscopic images of graphene oxide which are useful to probe its quality and morphological information such as a shape, a size, and a thickness. In this study, we investigated the contrast enhancement of the optical images of graphene oxide after hydrazine vapor reduction on a Si substrate coated with a 300 nm-thick $SiO_2$ dielectric layer. Also, a green-filtered light source gave higher contrast images comparing to optical images under standard white light. Furthermore, it was found that a image channel separation technique can be an alternative to simply identify the morphological information of graphene oxide, where red, green, and blue color values are separated at each pixels of the optical image. The approaches performed in this study can be helpful to set up a simple and easy protocol for the morphological identification of graphene oxide using a conventional optical microscope instead of a scanning electron microscopy or an atomic force microscopy.

• Korean Journal of Optics and Photonics
• /
• v.24 no.5
• /
• pp.224-230
• /
• 2013

Laser Lift-Off (LLO) is a process that removes a GaN or AIN thin layer from a sapphire wafer to manufacture vertical-type LEDs. It consists of a light source, an attenuator, a mask, a projection lens and a beam homogenizer. In this paper, we design an attenuator and a projection lens. We use the 'ZEMAX' optical design software for analysis of depth of focus and for a projection lens design which makes $7{\times}7mm^2$ beam size by projecting a beam on a wafer. Using the 'LightTools' lighting design software, we analyze the size and uniformity of the beam projected by the projection lens on the wafer. The performance analysis found that the size of the square-shaped beam is $6.97{\times}6.96mm^2$, with 91.8 % uniformity and ${\pm}30{\mu}m$ focus depth. In addition, this study performs dielectric coating using the 'Essential Macleod' to increase the transmittance of an attenuator. As a result, for 23 layers of thin films, the transmittance total has 10-96% at angle of incidence $45-60^{\circ}$ in S-polarization.