• 제목/요약/키워드: die block

검색결과 69건 처리시간 0.021초

진공다이캐스팅 공법을 이용한 자동차용 조향장치 개발에 대한 사례연구 (Case Study for Developing Automobile Part (Steering Wheel) using Vacuum Die-Casting Mold)

  • 권홍규;장무경
    • 산업경영시스템학회지
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    • 제35권2호
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    • pp.196-203
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    • 2012
  • When manufacturing die casting mold, generally, the casting layout design should be considered based on the relation between injection system, casting condition, gate system, and cooling system. Also, the extent or the location of product defects were differentiated according to the various relations of the above conditions. High-qualified products can be manufactured as those defects are controled by the proper modifications or the changes of die casting mold with the conditions. In this research, the proper manufacturing method was derived intensively for reducing the defect of the internal porosity of steering wheel housing which is very complicated to achieve a good mold design. The method was also derived for minimizing and for guaranteeing the product quality through the analysis of the casting problem and the deduction of alternative plans.

냉간단조금형에서 다이블록의 수명연장에 관한 연구 (A Research on the Life Span extension of Die Block in Cold Forging Die)

  • 김세환;최계광
    • 한국산학기술학회논문지
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    • 제9권2호
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    • pp.281-285
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    • 2008
  • 냉간단조금형(Cold Forging Die)의 다이블록(Dieblock)을 제작하는 방법 중의 하나로, 다이블록 제작용 재료를 면가공 하여 다이블록 상면(上面)을 마스터펀치(Master Punch)인 호브(Hob)로 압입(Indentation) 시켜 절삭가공((Cutting Work)이 아닌 다이호빙(Die Hobbing) 방법으로 임프레션(Impression)을 성형하여 제작하고 있다. 이 방법에 의하여 다이블록의 재료를 합금공구강(Alloy Tool Steel)인 SKD11을 사용하여 제작하고, 스테인리스판(Stainless Sheet Metal)을 제품 재료로 하여 냉간단조가공(Cold Forging Work)을 수행하였더니 6,000 스트로크(Stroke)에서 금형수명(Die Life)을 다 하고 파손되었다. 본 논문에서는 다이블록 재료를 고속도공구강(High Speed Tool Steel)인 SKH51로 교체 제작하고, 탄소강(Carbon Steel)인 S45C를 제품 재료로 하여 냉간단조가공을 수행하였더니 21,000 스트로크에서 금형수명을 다하고 파손되어 종래의 방법과 비교 검토하였을 때 350%의 금형수명 연장 효과를 얻게 되었다.

고속 성형 공정의 바운싱 현상을 줄이기 위한 액중 방전 성형의 해석적 연구 (Numerical Study of Electrohydraulic Forming to Reduce the Bouncing in High Speed Forming Process)

  • 우민아;노학곤;송우진;강범수;김정
    • 소성∙가공
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    • 제25권4호
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    • pp.261-267
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    • 2016
  • High-speed forming process is the forming technology that deforms the blank in a very short time, with the strain rate of the blank above 1000 s−1. Among many high-speed forming processes, electromagnetic forming (EMF) employs the Lorentz force when deforms the blank. Because of the high strain rate, the formability of the blank can be improved. However, when the blank is formed into rather complex shapes, it is bounced from the die and the wrinkles are generated. Therefore, electrohydraulic forming (EHF) is suggested in this study to reduce the bouncing problem of the blank. EHF is a high-speed forming that uses high voltage discharge in liquid. The shockwave resulting from the electric discharge propagates to the blank and it deforms the blank into the die. In this study, two high-speed forming processes, EMF and EHF were compared numerically with trapezoidal middle block die. This comparison showed that EMF cannot deform the blank into the die because of the bouncing, while EHF can overcome the bouncing problem and deform the blank into the die shape successfully.

유동 및 응고해석을 이용한 자동차용 부품(하우징)개발에 대한 사례연구 (A Case Study on Developing Automotive Part(Housing) by Filling and Solidification Analysis)

  • 정병국;권홍규
    • 산업경영시스템학회지
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    • 제38권1호
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    • pp.44-51
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    • 2015
  • When manufacturing die casting mold, generally, the casting layout design should be considered based on the relations of injection system, casting condition, gate system, and cooling system. According to the various relations of the conditions, the location of product defects was differentiated. High-qualified products can be manufactured as those defects are controlled by the proper modifications of die casting mold with keeping the same conditions. In this research, Computer Aided Engineering (CAE) simulation was performed with the several layout designs in order to optimize the casting layout design of an automotive part (Housing). In order to apply them into the production die-casting mold, the simulation results were analyzed and compared carefully. With the filling process, internal porosities caused by air entrapments were predicted and also compared with the modification of the gate system and overflow. With the solidification analysis, internal porosities occurring during the solidification process were predicted and also compared with the modified gate system. The simulation results were also applied into the production die-casting mold in order to compare the results and verify them with the real casting samples.

프론트필러의 핫스템핑 공정설계를 위한 블랭크형상의 최적화 연구 (Blank Shape Design Process for a Hot Stamped Front Pillar and its Experimental Verification)

  • 김지태;김병민;강충길
    • 소성∙가공
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    • 제21권3호
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    • pp.186-194
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    • 2012
  • Hot stamping is a forming method that offers various advantages such as superior mechanical properties, good formability, and very small springback. However, relatively large-sized parts, such as front pillars, exhibit poor formability when hot stamped due to the limited material flow and thickness reduction imparted by the process. This reduction in thickness can also lead to cracks. One of the reasons is the relatively high friction between the sheet and the die. In this study, in order to obtain the optimal conditions for hot stamping of front pillars, various process parameters were studied and analyzed using the sheet forming software, J-STAMP. The effects of various parameters such as the die structure, blank shape, blank holding force, punch speed, clearance(upper and lower dies) and distance block were analyzed and compared.

와이어 컷 방전가공(W-EDM)후의 가공면 조도 고찰 (A Study on Surface Roughness in Wire - Cut Electric Discharge Machining)

  • 최계광;김세환
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2002년도 춘계학술발표논문집
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    • pp.59-64
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    • 2002
  • 프레스 금형의 부품제작에 주로 사용되는 와이어 컷 방전가공에서 가공횟수가 펀치와 다이 블록의 가공면조도에 미치는 영향을 고찰하고자 수행하였다. 본 연구의 수행을 위해 정 밀 가공 기술로 활용도가 증가되고 있는 와이어 컷 방전가공기(Sodic A500H)를 사용하여 1차, 2차, 3차 총 3회 가공을 실시하였다. 3회에 걸쳐 가공된 펀치와 다이블록의 가공면조도 고찰을 위해 표면조도거칠기 측정기(Federal 사의 System5000)를 사용하여 연구를 수행하였다.

와이어 컷 방전가공후의 가공면 조도 고찰 (A Study on Surface Roughness in Wire-Cut Electric Discharge Machining)

  • 김세환;최계광
    • 한국산학기술학회논문지
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    • 제3권2호
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    • pp.69-73
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    • 2002
  • 프레스 금형의 부품제작에 주로 사용되는 와이어 컷 방전가공에서 가공횟수가 펀치와 다이블록의 가공면조도에 미치는 영향을 고찰하였다. 본 연구의 수행을 위해 정밀 가공기술로 활용도가 증가되고 있는 와이어 컷 방전가공기(Sodic A500H)를 사용하여 1차, 2차, 3차 총 3회 가공을 실시하였다. 3회에 걸쳐 가공된 펀치와 다이블록의 가공면 조도 고찰을 위해 표면조도거칠기 측정기 (Federal사의 System5000)를 사용하여 연구를 수행하였다.

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지속적 경막외 차단술 후 발생한 척수거미막염 (Spinal Arachnoiditis after Continuous Epidural Block)

  • 장항;김정호;강훈수
    • The Korean Journal of Pain
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    • 제10권2호
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    • pp.301-303
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    • 1997
  • A 35-year-old female patient was referred to our hospital with neurologic symptoms after continuous epidural block performed 2 days earlier. She die not have any prior no previous lumbar surgery or experience trauma, intraspinal hemorrhage, infections or other known causative factors to associate with neurologic symptoms. Continuous epidural block is widely used for postoperative pain control. Complications can occur with this block including postduralpuncture headache, epidural abscess and rare cases of arachnoiditis etc. We experienced such a case of spinal arachnoiditis after continuous epidural block. Neurologic examination revealed painful bilateral hypoesthesia below $S_2$ level dermatomes, urinary and fecal incontinence and various degrees of leg weakness. The following day, the patient was noted to have bilateral sacral radiculopathies and lesion on proximal portion of both tibial nerve. CSF study reported: protein 264 mg/dl, sugar 64 mg/dl, WBC $7/mm^3$. L-spine MyeloCTscan results were unremarkable. She was discharged after a month of hospitalization and has regular checkups but her neurologic symptoms show no signs of improvement.

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Ultrasonic Vibration and Rheocasting for Refinement of Mg-Zn-Y Alloy Reinforced with LPSO Structure

  • Lu, Shulin;Yang, Xiong;Hao, Liangyan;Wu, Shusen;Fang, Xiaogang;Wang, Jing
    • Metals and materials international
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    • 제24권6호
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    • pp.1315-1326
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    • 2018
  • In this work, ultrasonic vibration (UV) and rheo-squeeze casting was first applied on the Mg alloy reinforced with long period stacking ordered (LPSO) structure. The semisolid slurry of Mg-Zn-Y alloy was prepared by UV and processed by rheosqueeze casting in succession. The effects of UV, Zr addition and squeeze pressure on microstructure of semisolid Mg-Zn-Y alloy were studied. The results revealed that the synergic effect of UV and Zr addition generated a finer microstructure than either one alone when preparing the slurries. Rheo-squeeze casting could significantly refine the LPSO structure and ${\alpha}-Mg$ matrix in $Mg_{96.9}Zn_1Y_2Zr_{0.1}$ alloy without changing the phase compositions or the type of LPSO structure. When the squeeze pressure increased from 0 to 400 MPa, the block LPSO structure was completely eliminated and the average thickness of LPSO structure decreased from 9.8 to $4.3{\mu}m$. Under 400 MPa squeeze pressure, the tensile strength and elongation of the rheocast $Mg_{96.9}Zn_1Y_2Zr_{0.1}$ alloy reached the maximum values, which were 234 MPa and 17.6%, respectively, due to its fine ${\alpha}-Mg$ matrix (${\alpha}1-Mg$ and ${\alpha}2-Mg$ grains) and LPSO structure.

A CMOS Frequency Synthesizer Block for MB-OFDM UWB Systems

  • Kim, Chang-Wan;Choi, Sang-Sung;Lee, Sang-Gug
    • ETRI Journal
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    • 제29권4호
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    • pp.437-444
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    • 2007
  • A CMOS frequency synthesizer block for multi-band orthogonal frequency division multiplexing ultra-wideband systems is proposed. The proposed frequency synthesizer adopts a double-conversion architecture for simplicity and to mitigate spur suppression requirements for out-of-band interferers in 2.4 and 5 GHz bands. Moreover, the frequency synthesizer can consist of the fewest nonlinear components, such as divide-by-Ns and a mixer with the proposed frequency plan, leading to the generation of less spurs. To evaluate the feasibility of the proposed idea, the frequency synthesizer block is implemented in 0.18-${\mu}m$ CMOS technology. The measured sideband suppression ratio is about 32 dBc, and the phase noise is -105 dBc/Hz at an offset of 1 MHz. The fabricated chip consumes 17.6 mA from a 1.8 V supply, and the die-area including pads is $0.9{\times}1.1\;mm^2$.

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