• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.162-167
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• 1992

Tic and TiN layers were deposited on the stainless steel substrate by the reactive RF sputtering. Ar was used for sputtering gas and CzHz and Nz were used for reaction gas. Deposition rate increased linearly to the applied RF power, and decreased as the partial pressure ratio of sputter gas to reactive gas increased. The thin layers were stoichiometric at the partial pressure ratio of 0.03 for Tic and at partial pressure ratio of 0.05 for TiN. The morphologies and structures of the thin layers were investigated by AES, SEM and TEM. In addition, N+ ion was implanted to Tic and the resulting influence on the film and annealing effects were also examined.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.157-157
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• 2011

Graphene has generated significant interest in the recent years as a functional material for electronics, sensing, and energy applications due to its unique electrical, optical, and mechanical properties. Much of the considerable interest in graphene stems from results obtained for samples mechanically exfoliated from graphite. Practical applications, however, require reliable and well-controlled methods for fabrication of large area graphene films. Recently high quality graphene layers were fabricated using chemical vapor deposition (CVD) on nickel and copper with methane as the source of the carbon atoms. Here, we report a simple and efficient method to synthesize graphene layers using solid carbon source. Few-layer graphene films are grown using filtered vacuum arc source (FVAS) technique by evaporation of carbon atom on Ni catalytic metal and subsequent annealing of the samples at 800$^{\circ}$C. In our system, carbon atoms diffuse into the Ni metal layer at elevated temperatures followed by their segregation as graphene on the free surface during the cooling down step as the solubility of carbon in the metal decrease. For a given annealing condition and cooling rate, the number of graphene layers is easily controlled by changing the thickness of the initially evaporated amorphous carbon film. Based on the Raman analysis, the quality of graphene is comparable to other synthesis methods found in the literature, such as CVD and chemical methods.

• Korean Journal of Materials Research
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• v.14 no.12
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• pp.840-845
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• 2004

Tin dioxide ($SnO_2$) thin films were prepared on Si(100) substrate by PE-ALD using the $DBDTA((CH_{3}CO_2)_{2}Sn[(CH_2)_{3}CH_3]_2)$ Precursor. The properties were studied as a function of source temperature, substrate temperature, and purging time. Scanning probe microscopic images at the source temperature $50^{\circ}C$ and the substrate temperature $300^{\circ}C$ shows lower roughness than those $40/60^{\circ}C$ source and $200/400^{\circ}C$ substrate temperature samples. The purging time for optimum process was 8sec and the deposition rate was about 1 nm per 10 cycles. The conductance of $SnO_2$ thin film showed a constant region in the range of $200^{\circ}C\;to\;500^{\circ}C$. The thin films deposited for 200 cycle show a better sensitivity to CO gas.

• Korean Journal of Materials Research
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• v.12 no.4
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• pp.235-239
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• 2002

In this study mesh-type PECVD system was suggested to minimize the hydrogen concentration. The main structural difference between the triode system and a conventional system is that, a third electrode, a mesh, is inserted between the powered and the ground electrode. We investigated several conditions to compare with conventional PECVD. The main effect of mesh was to minimize the substrate damage by ion bombardment and to enhance the surface reaction to induce hydrogen desorption. It was also found that hydrogen concentration decreased but deposition rate increased as increasing applied bias. Applied DC-bia s enhanced sputtering process. Intense ion bombardment causes the weakly bonded hydrogen or hydrogen-containing species to leave the growing film and increased adatom mobility. Furthermore, addition of hydrogen gas enhance the surface diffusion of adatom.

• Applied Chemistry for Engineering
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• v.10 no.8
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• pp.1119-1123
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• 1999

In this paper, electrorefining of uranium metal was studied to develop pyrometallurgical processing technology in molten salt system. The reaction between uranium metal and $CdCl_2$ was taken about 3 hours and the uranium metal deposits were obtained in the form of dendrite grown on the cathode surface in every electrotransport experiment. The shapes of dendrite were changed according to the applied voltages. Current efficiency was decreased with the increase of current density. Deposition rate was not changed after 6 hours and its maxium was obtained at $100{\sim}150mA/cm^2$ of current density and about 75 rpm of stirring speed, respectively. Also, the current efficiency was increased with decrease of the pitch of spiral groove curved on cathode.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.33.1-33.1
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• 2018

pH is expressed mathematically as $pH=-{\log}[H^+]$, is a measure of the hydrogen ion concentration, [$H^+$] to specify the acidity or basicity of an aqueous solution. The pH scale usually ranges from 0 to 14. Every aqueous solution can be measured to determine its pH value. The pH values below 7.0 express the acidity, above 7.0 are alkalinity and pH 7.0 is a neutral solution. The solution pH can be determined by indicator or by measurement using pH sensor, which measuring the voltage generated between a glass electrode and a reference electrode according to the Nernst Equation. The pH value of solutions depends on the temperature and the activity of contained ions. In nickel electroless plating process, the controlled pH value in some limited ranges are extremely important to achieve optimal deposition rate, phosphorus content as well as solution stability. Basically, nickel electroless plating solution contains of $Ni^{2+}ions$, reducing agent, buffer and complexing agents. The plating processes are normally carried out at $82-92^{\circ}C$. However, the change of its pH values with temperatures does not follow any rule. Thus, the purpose of study is to understand the relationship between pH and temperature of some based solutions and electroless nickel plating solutions. The change of pH with changing temperatures is explained by view of the thermal dynamic and the practical measurements.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.56-56
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• 2018

Transparent conductive oxides (TCOs) have attracted attention due to their high electrical conductivity and optical transparency in the visible region. Consequently, TCOs have been widely used as electrode materials in various electronic devices such as flat panel displays and solar cells. Previous studies on TCOs focused on their electrical and optical performances; there have been numerous attempts to improve these properties, such as chemical doping and crystallinity enhancement. Recently, due to rapidly increasing demand for flexible electronics, the academic interest in the mechanical stability of materials has come to the fore as a major issue. In particular, long-term stability under bending is a crucial requirement for flexible electrodes; however, research on this feature is still in the nascent stage. Hydrogen-incorporated amorphous In-Sn-O (a-ITO) thin films were fabricated by introducing hydrogen gas during deposition. The hydrogen concentration in the film was determined by secondary ion mass spectrometry and was found to vary from $4.7{\times}10^{20}$ to $8.1{\times}10^{20}cm^{-3}$ with increasing $H_2$ flow rate. The mechanical stability of the a-ITO thin films dramatically improved because of hydrogen incorporation, without any observable degradation in their electrical or optical properties. With increasing hydrogen concentration, the compressive residual stress gradually decreased and the subgap absorption at around 3.1 eV was suppressed. Considering that the residual stress and subgap absorption mainly originated from defects, hydrogen may be a promising candidate for defect passivation in flexible electronics.

• Journal of Sensor Science and Technology
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• v.15 no.6
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• pp.406-410
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• 2006

The films of indium oxide $In_{2}O_{3}$) were deposited onto $SiO_{2}$ coated Si wafers by a thermal evaporation method. Substrate temperature was varied from $25^{\circ}C$ to $300^{\circ}C$. Deposition rate increased to $250^{\circ}C$ and then decreased rapidly. The crystallographic properties and surface morphologies of the films were investigated by X-ray diffraction (XRD) and scanning electron microscope (SEM), respectively. The films deposited at $250^{\circ}C$ were found to have a nanobelt structure. Resistor-type gas-sensors were fabricated with $In_{2}O_{3}$ films using Pt as electrodes. The resistance variation of $In_{2}O_{3}$ films with the concentration of NO gas was measured. The $In_{2}O_{3}$ films deposited at $250^{\circ}C$ showed the highest sensitivity to the NO gas.

• Journal of Sensor Science and Technology
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• v.12 no.2
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• pp.95-101
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• 2003

Ultrasonic transmitter used for scale prevention in boiler or heat exchanger is composed of the magnetostrictive material which transforms electric energy into ultrasonic wave and the horn which amplifies generated ultrasonic wave and transfers it into medium loaded. In this paper, we have performed the shape design for magnetostrictive material and analyzed a few type of horns which amplify generated ultrasonic wave and found each solution theoretically. Final length of the horn has been determined by measuring the sound pressure in medium between theoretical value and experience data. At last we have given the results of our study for the effects of ultrasonic wave irradiated by manufactured ultrasonic transmitter on preventing scale deposition on test pipe under the similar condition to boiler.

• Journal of Surface Science and Engineering
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• v.38 no.2
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• pp.79-82
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• 2005

This study investigated the effect of nitriding on the hardness and adhesion properties of $TiB_2$ coatings. Inductively coupled plasma (ICP) was used for both nitriding and deposition. By applying ICP, H13 steel was nitrided at a high rate of $50\;{\mu}m/hr$. After nitriding, a Fe4N compound layer or a diffusion layer was formed according to the hydrogen/nitrogen ratio. Both layers could improve the load-bearing capacity of the substrate by increasing the substrate hardness. The adhesion of the $TiB_2$ coatings increased to $\~30N$ after nitriding, but the hardness of the coating was lowered to 20-30 GPa. However, the adhesion of the $TiB_2$ coatings with a high hardness (>60 GPa) could not be improved substantially by nitriding due to the large difference in hardness between the coating and the substrate. The grain size of the $TiB_2$ coating was larger on the nitrided substrates, resulting in a decrease in the hardness of the coating.