• Title/Summary/Keyword: deposition rate

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The study on formation of platinum thin films for RTD temperature sensor (측온저항체 온도센서용 백금박막의 형성에 관한 연구)

  • 정귀상;노상수
    • Electrical & Electronic Materials
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    • v.9 no.9
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    • pp.911-917
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    • 1996
  • Platinum thin films were deposited on Si-wafer by DC rnagnetron sputtering for RTD (resistance thermometer devices). We investigated the physical and electrical characteristics of these films under various conditions, the input power, working vacuum, temperature of substrate and also after annealing these films. The deposition rate was increased with increasing the input power but decreased with increasing Ar gas pressure. The resistivity and sheet resistivity were decreased with increasing the temperature of substrate and the annealing time at 1000.deg. C. At substrate temperature of >$300^{\circ}C$, input power of 7 w/cm$^{2}$, working vacuum of 5 mtorr and annealing conditions of 1000.deg. C and 240 min, we obtained 10.65.mu..ohm..cm, resistivity of Pt thin films and 3800-3900 ppm/.deg. C, TCR(temperature coefficient of resistance). These values are close to the bulk value. These results indicate that the Pt thin films deposited by DC magnetron sputtering have potentiality for the development of Pt RTD temperature sensor.

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A study for the distribution of plasma density in RF glow discharge (RF 글로우 방전에서의 플라즈마 밀도의 분포에 대한 연구)

  • Keem, Ki-Hyun;Hwang, Joo-Won;Min, Byeong-Don;Kim, Sang-Sig
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.59-61
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    • 2002
  • In this study we attempted to diagnose the distribution of nitrogen plasma density generated using PECVD(plasma enhanced chemical vapor deposition). The distribution of plasma density formed in a PECVD chamber were measured by DLP2000. The experiment results showed that the plasma density is related to RF power and gas flow rate. As RF power gets higher, the plasma density linearly increased. And the experimental results revealed that a pressure in chamber affects plasma density.

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Properties of SiOCH Thin Film Dielectric Constant by BTMSM/O2 Flow Rates (BTMSM/O2 유량변화에 따른 SiOCH 박막의 유전상수 특성)

  • Kim, Jong-Wook;Hwang, Chang-Su;Kim, Hong-Bae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.4
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    • pp.362-367
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    • 2008
  • We have Manufactured the low-k dielectric interlayer fabricated by plasma enhanced chemical vapor deposition (PECVD), The thin film of SiOCH is studied correlation between components and Dielectric constant. The precursor was evaporated and introduced with the flow rates from 16 sccm to 25 sccm by 1sccm step in the constant flow rate of 60 sccm $O_2$ in process chamber. The chemical characteristics of SiOCH were analyzed by measuring FT/IR absorption lines and obtained each dielectric constant measuring C-V. Then compare respectively. ILD of BTMSM/$O_2$ could have low dielectric constant about $k\sim2$, and react sensitively. Also dielectric constant could be decreased by the effects of decreasing $CH_3$ and growing Si-O-Si(C) after annealing process.

Preparation of AlN thin films on silicon by reactive RF magnetron sputtering (RF 마그네트론 스퍼터링을 이용한 Si 기판상의 AlN 박막의 제조)

  • 조찬섭;김형표
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.2
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    • pp.17-21
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    • 2004
  • Aluminum nitride(AlN) thin films were deposited on silicon substrate by reactive RF magnetron sputtering without substrate heating. We investigated the dependence of some properties for AlN thin film on sputtering conditions such as working pressure, $N_2$ concentration and RF power. XRD, Ellipsometer and AES has been measured to find out structural properties and preferred orientation of AlN thin films. Deposition rate of AlN thin film was increased with an increase of RF power and decreased with an increase of $N_2$ concentration. AES in-depth measurements showed that stoichiometry of Aluminium and Nitrogen elements were not affected by $N_2$ concentration. It has shown that low working pressure, low $N_2$ concentration and high RF power should be maintained to deposit AlN thin film with a high degree of (0002) preferred orientation.

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Effect of Hydrodynamic Condition on the Electrochemical Behavior of Various Metals in 3.5 wt% NaCl Solution

  • Pan, Szu-Jung;Hadinata, Samuel-Sudibyo;Kao, Ruey-Chy;Tsai, Wen-Ta
    • Corrosion Science and Technology
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    • v.14 no.5
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    • pp.218-225
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    • 2015
  • The electrochemical behaviors of various metals with and without diamond-like-carbon (DLC) coating in 3.5 wt% NaCl solution were investigated. The effect of hydrodynamic conditions was focused by employing a rotating disc electrode (RDE). The experimental results showed that each bare metal had a more positive corrosion potential and a higher corrosion rate due to enhanced oxygen transport at the higher rotating speed of the RDE. DLC coating caused a substantial increase in the corrosion resistance of all metals studied. However, localized corrosion was still found in the DLC-coated metal at sites where deposition defects existed. Surface morphology examination was performed after the electrochemical test to confirm the roles of hydrodynamic conditions and DLC coating.

Fabrication and Characteristics of Indium Tin Oxide Films on Polycarbonates CR39 Substrate for OTFTs

  • Kwon, Sung-Yeol
    • Korean Journal of Materials Research
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    • v.17 no.4
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    • pp.232-235
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    • 2007
  • Indium tin oxide (ITO) films were deposited on polycarbonate CR39 substrate using DC magnetron sputtering. ITO thin films were deposited at room temperature because glass-transition temperature of CR39 substrate is $130^{circ}C$ ITO thin films are used as bottom and top electrodes and for organic thin film transparent transistor (OTFT). The electrodes electrical properties of ITO thin films and their optical transparency properties in the visible wavelength range (300-800 nm) strongly depend on the volume of oxygen percent. The optimum resistivity and transparency of ITO thin film electrode was achieved with a 75 W plasma power, 10 % volume of oxygen and a 27 nm/min deposition rate. Above 85% transparency in the visible wavelength range (300-800 nm) was measured without post annealing process, and resistivity as low as $9.83{\times}^{TM}10^{-4}{\Omega}$ cm was measured at thickness of 300 nm.

Study of ALD Process using the Line Type Plasma Source (라인형 플라즈마 소스를 이용한 ALD 공정 연구)

  • Kwon, Gi Chung;Jo, Tae Hoon;Choi, Jin Woo;Song, Sae Yung;Seol, Jae Yoon;Lee, Jun Sin
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.4
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    • pp.33-35
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    • 2016
  • In this study, a new plasma source was used in the ALD process. Line type plasma sources were analyzed by electric and magnetic field simulation. And the results were compared with plasma density and electron temperature measurement results. As a result, the results of the computer simulation and the diagnosis results of plasma density and electron temperature showed similar tendency. At this time, the plasma uniformity is 95.6 %. $Al_2O_3$ thin film was coated on 6 inch Si-wafer, using this plasma source. The uniformity of the thin film was more than 98% and the thin film growth rate was 0.13 nm/cycle.

RF Loss Minimization Method Using High Impedance Filter for Research (High Impedance Filter를 이용한 RF Loss 최소화 방법에 대한 연구)

  • Wang, Hyun-Chul;Seo, Hwa-Il
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.1
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    • pp.55-60
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    • 2020
  • This study designed High impedance filter to reduce RF loss to heater heating wire and increase RF current flowing to heater ground wire. Effects such as D / R improvement and process reproducibility could be seen. In addition, RF parameter distribution optimization was possible by understanding the RF path of PE-CVD equipment using Plasma and designing filter.

Friction and Wear at Ceramic Coated Surfaces of Aluminum Alloy (알루미늄 합금표면에 코팅된 세라믹재의 마찰마멸 특성)

  • 공호성;권오관;김형선
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.17 no.12
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    • pp.3083-3093
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    • 1993
  • Friction and wear at ceramic coated surfaces of aluminum alloy were experimentally studied using a Ring-on-Block wear test machine. Ceramic materials coated on aluminum alloy surfaces were WC, CrC, $Al_{2}O_{3}$ by a plasma spray; and $Al_{2}O_{3}$,$Al_{2}SiO_{5}$, $Na_{2}B_{4}O_{7}$,$Na_{4}P_{2}O_{7}$, and $Al_{2}O_{3}-ZrO_{2}$ composite coating by an Anodic Spark Depositon. They were tested under the sliding wet contact and compared with aluminum alloys and steels. Test results showed that ceramic coated surfaces, in general, have better anti-wear property than those of aluminum alloys due to increase in the surface hardness ; however, they also showed higher coefficients of friction and changes in wear mechanisms, resulting in brittle fractures.

The effects of TCO/p-layer Interface on Amorphous Silicon Solar Cell (비정질 실리콘 태양전지에서 TCO/p층 계면 특성의 영향)

  • Ji, I.H.;Suh, S.T.;Choi, B.S.;Hong, S.M.
    • Solar Energy
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    • v.8 no.1
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    • pp.68-73
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    • 1988
  • In the glass/TCO/p-i-n a-Si/Al type of amorphous silicon solar cell, the effects on solar cell efficiency and metastability for the various kinds of TCO analyzed by SAM and ESCA, which was used to measure the diffusion profiles of In and Sn and the Fermi energy shifts in the TCO/p interface respectively. Indium which diffused into a-Si p-layer did not have any significant effects on the Fermi level shift of p-layer when the content of $B_2H_6/SiH_4$ in p-layer was at 1 gas%. The cell fabricated on $SnO_2$ turned out to have the best cell photovoltaic characteristics. ITO fabricated by electron beam deposition system, which was shown to have the greatest rate of diffusion of Indium in ITO/p interface produced the worst metastability among the cells tested.

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